利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

45 条记录 (耗时 0.045 秒)

    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
    13.
    发明申请
    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 审中-公开
    用于冷却发热装置中所需热点的柔性流体输送的方法和装置

    公开(公告)号：US20050211427A1

    公开(公告)日：2005-09-29

    申请号：US10882142

    申请日：2004-06-29

    申请人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

    发明人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

    IPC分类号： G05D23/00

    CPC分类号： F28F3/048 ,  F28D15/0266 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

    摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

    Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
    14.
    发明授权
    Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device 有权
    用于在发热装置中实现温度均匀性和热点冷却的方法和装置

    公开(公告)号：US07104312B2

    公开(公告)日：2006-09-12

    申请号：US10698304

    申请日：2003-10-30

    申请人： Kenneth Goodson ,  Thomas Kenny ,  Peng Zhou ,  Girish Upadhya ,  Mark Munch ,  Mark McMaster ,  James Horn

    发明人： Kenneth Goodson ,  Thomas Kenny ,  Peng Zhou ,  Girish Upadhya ,  Mark Munch ,  Mark McMaster ,  James Horn

    IPC分类号： F28F7/00

    CPC分类号： F28F3/048 ,  F04B19/006 ,  F28D15/00 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

    摘要翻译： 一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。 该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。 该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。 通过优化和控制热交换器中的流体和热电阻来最小化温差。 对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

    Pump and fan control concepts in a cooling system
    15.
    发明授权
    Pump and fan control concepts in a cooling system 有权
    冷却系统中的泵和风扇控制概念

    公开(公告)号：US08602092B2

    公开(公告)日：2013-12-10

    申请号：US11400347

    申请日：2006-04-06

    申请人： Daniel J. Lenehan ,  Kenneth Goodson ,  Thomas W. Kenny ,  Mark Munch ,  Saroj Sahu

    发明人： Daniel J. Lenehan ,  Kenneth Goodson ,  Thomas W. Kenny ,  Mark Munch ,  Saroj Sahu

    IPC分类号： F24F11/06

    CPC分类号： H01L23/473 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A closed loop cooling system and apparatus for controlling a fluid flow rate through the closed loop cooling system, the apparatus comprising a heat exchanger coupled to at least one heat generating device for removing waste heat from the heat generating device, at least one pump for circulating the fluid, a heat rejector for receiving the fluid, at least one fan for removing waste heat from the heat rejector, at least one temperature sensor coupled to the heat generating device to measure the temperature value of the at least one heat generating device, and a controller electrically coupled to the at least one pump, the at least one fan, and the at least one temperature sensor for receiving the temperature value to selectively control the fluid flow rate and the air flow rate, based on the temperature value.

    摘要翻译： 一种用于控制通过闭环冷却系统的流体流速的闭环冷却系统和装置，该装置包括耦合到至少一个用于从发热装置排出废热的至少一个发热装置的热交换器，至少一个用于循环的泵 所述流体，用于接收流体的热排出器，用于从所述热排出器去除废热的至少一个风扇，耦合到所述发热装置的至少一个温度传感器以测量所述至少一个发热装置的温度值;以及 电耦合到所述至少一个泵，所述至少一个风扇和所述至少一个温度传感器的控制器，用于接收所述温度值，以基于所述温度值选择性地控制所述流体流速和所述空气流速。

    Semi-compliant joining mechanism for semiconductor cooling applications
    16.
    发明申请
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US20050270742A1

    公开(公告)日：2005-12-08

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H01L23/40 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。

    Pump and fan control concepts in a cooling system
    17.
    发明授权
    Pump and fan control concepts in a cooling system 失效
    冷却系统中的泵和风扇控制概念

    公开(公告)号：US07591302B1

    公开(公告)日：2009-09-22

    申请号：US10731674

    申请日：2003-12-08

    申请人： Daniel J. Lenehan ,  Kenneth Goodson ,  Thomas W. Kenny ,  Mark Munch ,  Saroj Sahu

    发明人： Daniel J. Lenehan ,  Kenneth Goodson ,  Thomas W. Kenny ,  Mark Munch ,  Saroj Sahu

    IPC分类号： F24F11/06

    CPC分类号： H01L23/473 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of and apparatus for cooling heat-generating devices in a cooling system is disclosed. The apparatus includes various sensors, control schemes and thermal models, to control pump flow rates and fan flow rates to minimize power consumption, fan noise, and noise transients. The apparatus further includes at least one heat-generating device, at least one heat exchanger, and at least one heat rejector. The apparatus can also include many pumps and fans. The method includes controlling a fluid flow rate of at least one pump and an air flow rate of at least one fan, in a cooling system for cooling at least one device. The method comprises the steps of: providing at least one temperature sensor coupled to measure a temperature value of each device; receiving the temperature value from each temperature sensor; and providing a controller to selectively control the fluid flow rate and the air flow rate, based on each temperature value. The method can further include the step of filling at least a portion of a heat exchanger with a thermal capacitance medium for maintaining the temperature value of the device below a maximum allowable temperature during thermal transients, wherein the heat exchanger is thermally coupled to the device.

    摘要翻译： 公开了一种用于冷却冷却系统中的发热装置的方法和装置。 该设备包括各种传感器，控制方案和热模型，以控制泵流量和风扇流量，以最小化功耗，风扇噪声和噪声瞬变。 该装置还包括至少一个发热装置，至少一个热交换器和至少一个热排出器。 该设备还可以包括许多泵和风扇。 该方法包括在用于冷却至少一个装置的冷却系统中控制至少一个泵的流体流速和至少一个风扇的空气流量。 该方法包括以下步骤：提供耦合以测量每个装置的温度值的至少一个温度传感器; 从每个温度传感器接收温度值; 并且基于每个温度值提供控制器来选择性地控制流体流速和空气流速。 该方法还可以包括用热容器介质填充热交换器的至少一部分的步骤，用于在热瞬变期间将器件的温度值保持在最大允许温度以下，其中热交换器热耦合到器件。

    Semi-compliant joining mechanism for semiconductor cooling applications
    18.
    发明授权
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US07301773B2

    公开(公告)日：2007-11-27

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。

    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
    19.
    发明申请
    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers 审中-公开
    用于微通道热交换器中压降降低的交错歧管

    公开(公告)号：US20050211417A1

    公开(公告)日：2005-09-29

    申请号：US10881980

    申请日：2004-06-29

    申请人： Girish Upadhya ,  Thomas Kenny ,  Peng Zhou ,  Mark Munch ,  James Shook ,  Kenneth Goodson ,  David Corbin

    发明人： Girish Upadhya ,  Thomas Kenny ,  Peng Zhou ,  Mark Munch ,  James Shook ,  Kenneth Goodson ,  David Corbin

    IPC分类号： F04B19/00 ,  F28D15/02 ,  F28F3/12 ,  H01L23/473 ,  F28F7/00

    CPC分类号： H01L23/473 ,  F04B19/006 ,  F28D15/0266 ,  F28F3/12 ,  F28F13/185 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

    摘要翻译： 耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动， 在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。 微通道热交换器包括具有热交换区域的界面层。 优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。 或者，界面层包括沿着热交换区域配置的第一组和第二组手指。