公开(公告)号：US11059145B2

公开(公告)日：2021-07-13

申请号：US16059344

申请日：2018-08-09

Applicant: Tokyo Electron Limited

Inventor： Yoshiki Okamoto ,  Yasushi Takiguchi ,  Akihiro Kubo ,  Hayato Hosaka ,  Ryuto Ozasa

IPC: B24B53/017 ,  B24B37/20 ,  B24B37/04 ,  B24B53/14 ,  B24B37/10 ,  B24B27/00 ,  B24B49/12 ,  B24B53/007 ,  B24B53/095

Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

公开(公告)号：US11031261B2

公开(公告)日：2021-06-08

申请号：US16014308

申请日：2018-06-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi Takiguchi ,  Koki Yoshimura ,  Taro Yamamoto ,  Hideharu Kyouda ,  Koshi Muta

IPC: H01L21/67

Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

公开(公告)号：US10168618B2

公开(公告)日：2019-01-01

申请号：US14919869

申请日：2015-10-22

Applicant: Tokyo Electron Limited

Inventor： Norihiko Sasagawa ,  Hiroichi Inada ,  Yasushi Takiguchi

IPC: B05D3/12 ,  G03F7/16 ,  H01L21/67 ,  G03F7/30 ,  B05D1/00 ,  G06F19/00

Abstract: A liquid processing method includes: accommodating a substrate horizontally in each of a first processing region and a second processing region, for performing therein a process on the substrate by a processing solution from a nozzle; rotating a rotary body about a vertical axis; keeping a plurality of processing nozzles provided at the rotary body; supplying different kinds of processing solutions to the substrate from the plurality of processing nozzles; holding a processing nozzle selected from the plurality of processing nozzles by a nozzle holder provided at the rotary body; transferring the nozzle holder into selected one of the first and the second processing regions by a nozzle transfer device; and rotating the rotary body by a rotation driving unit so as to allow a front of the nozzle holder in a forward/backward direction thereof to face the selected one of the first and the second processing regions.

公开(公告)号：US10120285B2

公开(公告)日：2018-11-06

申请号：US15374081

申请日：2016-12-09

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi ,  Masahiro Fukuda

IPC: B05C11/08 ,  G03F7/30 ,  B05D1/00 ,  B05D1/26 ,  B05C5/02 ,  H01L21/67

Abstract: A developing apparatus including a horizontal substrate holder, a rotating mechanism to rotate the substrate holder, a developer nozzle to supply a developer onto a part of the substrate to form a liquid puddle, a moving mechanism to move the developer nozzle in a radial direction of the rotating substrate, a contact part that moves with the developer nozzle and has a surface opposed to the substrate, which is smaller than the surface of the substrate, and a control unit to output a control signal such that a supply position of the developer on the substrate is moved in the radial direction of the substrate so that the liquid puddle is spread out on a whole surface of the substrate while the contact part is in contact with the liquid puddle.

公开(公告)号：US09869941B2

公开(公告)日：2018-01-16

申请号：US15378491

申请日：2016-12-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryoichi Uemura ,  Yasushi Takiguchi

IPC: B08B3/02 ,  G01B11/02 ,  G03F7/20 ,  H01L21/67

CPC classification number: G03F7/70925 ,  B08B3/024 ,  G01B11/02 ,  G03F7/422 ,  H01L21/67051

Abstract: A substrate cleaning method includes: a first step in which a cleaning liquid is ejected from a nozzle N2 to a central portion of a wafer W; a second step in which a dry gas is ejected from a nozzle N3 to the central portion of the wafer W to form a dry area; a third step in which the cleaning liquid is ejected from the nozzle N2 while the nozzle N2 is moved from a central side of the wafer W to a peripheral side thereof; a fourth step in which a width of an intermediate area generated between a wet area and the dry area is acquired; and a fifth step in which, when the width of the intermediate area exceeds a predetermined threshold value, a process parameter is changed such that the width of the intermediate area becomes the threshold value or less.

公开(公告)号：US11554389B2

公开(公告)日：2023-01-17

申请号：US17152870

申请日：2021-01-20

Applicant: Tokyo Electron Limited

Inventor： Akihiro Kubo ,  Yasushi Takiguchi ,  Teruhiko Kodama ,  Yoshiki Okamoto

IPC: B08B1/04 ,  B08B11/02 ,  B08B3/04 ,  H01L21/02 ,  H01L21/687 ,  H01L21/67 ,  B08B1/00

Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.

公开(公告)号：US11532487B2

公开(公告)日：2022-12-20

申请号：US16872441

申请日：2020-05-12

Applicant: Tokyo Electron Limited

Inventor： Akihiro Kubo ,  Yasushi Takiguchi ,  Teruhiko Kodama ,  Yoshiki Okamoto ,  Hayato Hosaka

IPC: H01L21/461 ,  H01L21/67 ,  B24B37/04 ,  H01L21/306

Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.

公开(公告)号：US20210398827A1

公开(公告)日：2021-12-23

申请号：US17467346

申请日：2021-09-06

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  H01L21/687 ,  B24B37/30 ,  B08B1/04 ,  B08B1/00 ,  B24B37/10 ,  H01L21/304 ,  H01L21/677

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

公开(公告)号：US10649334B2

公开(公告)日：2020-05-12

申请号：US16100609

申请日：2018-08-10

Applicant: Tokyo Electron Limited

Inventor： Koki Yoshimura ,  Shogo Takahasi ,  Yasushi Takiguchi ,  Taro Yamamoto

IPC: G03F7/16 ,  H01L21/67 ,  G03F7/30 ,  H01L21/683

Abstract: Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.

公开(公告)号：US09470979B2

公开(公告)日：2016-10-18

申请号：US15051780

申请日：2016-02-24

Applicant: Tokyo Electron Limited

Inventor： Yasushi Takiguchi ,  Taro Yamamoto ,  Yoshinori Ikeda ,  Koki Yoshimura ,  Yoshiki Okamoto ,  Masahiro Fukuda

IPC: G03B27/32 ,  G03C5/26 ,  G03F7/16

CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。