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公开(公告)号:US10944048B2
公开(公告)日:2021-03-09
申请号:US16554531
申请日:2019-08-28
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ya-Huei Tsai , Rai-Min Huang
Abstract: A semiconductor device includes a substrate, an array of magnetic tunnel junctions (MTJs), an array of first dummy MTJs, and an array of second dummy MTJs. The substrate includes an array region defined thereon, and the array region includes at least an outermost corner. The array of MTJs is disposed in the array region. The array of the first dummy MTJs is disposed along the outermost corner of the array region. The array of the second dummy MTJs is disposed around the array region and the array of first dummy MTJs.
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公开(公告)号:US10930704B2
公开(公告)日:2021-02-23
申请号:US16812354
申请日:2020-03-08
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Rai-Min Huang , Hung-Yueh Chen , Ya-Huei Tsai , Yu-Ping Wang
IPC: H01L27/22 , H01L23/532 , H01L43/02 , H01L23/522 , H01L23/528 , G11C11/16
Abstract: A magnetic memory cell includes a substrate, a transistor, a first dielectric layer disposed on the substrate, a landing pad in the first dielectric layer, a second dielectric layer covering the first dielectric layer and the landing pad, a memory stack in the second dielectric layer, and a source line in the first dielectric layer. The first dielectric layer covers the transistor. The landing pad is situated in a first horizontal plane and is coupled to a drain region of the transistor. The memory stack has a bottom electrode connected to the landing pad and a top electrode electrically connected to a bit line. The source line is situated in a second horizontal plane and is connected to a source region of the transistor. The second horizontal plane and the first horizontal plane are not coplanar.
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公开(公告)号:US20170047330A1
公开(公告)日:2017-02-16
申请号:US15339945
申请日:2016-11-01
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chien-Ming Lai , Ya-Huei Tsai
IPC: H01L27/092 , H01L29/51 , H01L21/28 , H01L29/66 , H01L29/49 , H01L21/8238
CPC classification number: H01L27/092 , H01L21/28088 , H01L21/32134 , H01L21/82345 , H01L21/8238 , H01L21/823842 , H01L27/0922 , H01L29/49 , H01L29/4966 , H01L29/513 , H01L29/517 , H01L29/66545
Abstract: A semiconductor device having metal gate includes a first metal gate structure and a second metal gate structure disposed in a first device region and in a second device region on a substrate respectively. The first metal gate structure includes a gate insulating layer, a first bottom barrier layer, a top barrier layer, and a metal layer disposed on the substrate in order, wherein the top barrier layer is directly in contact with the first bottom barrier layer. The second metal gate structure includes the gate insulating layer, a second bottom barrier layer, the top barrier layer, and the metal layer on the substrate in order, wherein the top barrier layer is directly in contact with the second bottom barrier layer. The first bottom barrier layer and the second bottom barrier layer have different impurity compositions.
Abstract translation: 具有金属栅极的半导体器件分别包括设置在第一器件区域中的第一金属栅极结构和设置在衬底上的第二器件区域中的第二金属栅极结构。 第一金属栅极结构依次包括栅极绝缘层,第一底部阻挡层,顶部阻挡层和设置在基板上的金属层,其中顶部阻挡层直接与第一底部阻挡层接触。 第二金属栅极结构依次包括栅极绝缘层,第二底部阻挡层,顶部阻挡层和金属层,其中顶部阻挡层直接与第二底部阻挡层接触。 第一底部阻挡层和第二底部阻挡层具有不同的杂质组成。
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公开(公告)号:US20170040435A1
公开(公告)日:2017-02-09
申请号:US14840041
申请日:2015-08-30
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Tsen Lu , Chien-Ming Lai , Lu-Sheng Chou , Ya-Huei Tsai , Ching-Hsiang Chiu , Yu-Tung Hsiao , Chen-Ming Huang , Kun-Ju Li , Yu-Ping Wang
IPC: H01L29/66 , H01L29/49 , C22C32/00 , H01L29/423
CPC classification number: H01L29/66545 , B32B1/00 , B32B18/00 , C22C32/0068 , H01L21/28088 , H01L29/4238 , H01L29/4966 , H01L29/511
Abstract: A semiconductor device is disclosed. The semiconductor device includes a substrate and a gate structure on the substrate. The gate structure includes a high-k dielectric layer on the substrate and a bottom barrier metal (BBM) layer on the high-k dielectric layer. Preferably, the BBM layer includes a top portion, a middle portion, and a bottom portion, in which the top portion being a nitrogen rich portion, and the middle portion and the bottom portion being titanium rich portions.
Abstract translation: 公开了一种半导体器件。 半导体器件包括衬底和衬底上的栅极结构。 栅极结构包括在衬底上的高k电介质层和高k电介质层上的底部阻挡金属(BBM)层。 优选地,BBM层包括顶部,中间部分和底部,其中顶部是富氮部分,中部和底部是富钛部分。
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公开(公告)号:US20250040149A1
公开(公告)日:2025-01-30
申请号:US18916730
申请日:2024-10-16
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ya-Huei Tsai , Rai-Min Huang , Yu-Ping Wang , Hung-Yueh Chen
Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
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公开(公告)号:US12150315B2
公开(公告)日:2024-11-19
申请号:US18395649
申请日:2023-12-25
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ya-Huei Tsai , Rai-Min Huang , Yu-Ping Wang , Hung-Yueh Chen
Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
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公开(公告)号:US12052932B2
公开(公告)日:2024-07-30
申请号:US18132989
申请日:2023-04-11
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Jia-Rong Wu , Rai-Min Huang , I-Fan Chang , Ya-Huei Tsai , Yu-Ping Wang
Abstract: The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of the MTJ comprises a circular shape.
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公开(公告)号:US20240074209A1
公开(公告)日:2024-02-29
申请号:US18500994
申请日:2023-11-02
Applicant: UNITED MICROELECTRONICS CORP
Inventor: Jia-Rong Wu , I-Fan Chang , Rai-Min Huang , Ya-Huei Tsai , Yu-Ping Wang
IPC: H10B61/00 , G11C11/16 , H01F10/32 , H01F41/34 , H01L23/522 , H01L23/528 , H10N50/01 , H10N50/80
CPC classification number: H10B61/00 , G11C11/161 , H01F10/3254 , H01F41/34 , H01L23/5226 , H01L23/528 , H10N50/01 , H10N50/80 , H10N50/85
Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.
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公开(公告)号:US11895848B2
公开(公告)日:2024-02-06
申请号:US17750386
申请日:2022-05-22
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ya-Huei Tsai , Rai-Min Huang , Yu-Ping Wang , Hung-Yueh Chen
CPC classification number: H10B61/22 , H01L23/528 , H10N50/80 , G11C11/161 , H01F10/3254 , H10N50/85
Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
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公开(公告)号:US20220285437A1
公开(公告)日:2022-09-08
申请号:US17750386
申请日:2022-05-22
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ya-Huei Tsai , Rai-Min Huang , Yu-Ping Wang , Hung-Yueh Chen
IPC: H01L27/22 , H01L23/528 , H01L43/02
Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
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