摘要:
A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated die pads, each die pad being electrically connected to the second power electrode of the die that is on it. The split pad may include several conductive leads, including at least one output lead electrically connected to a first electrode of the first semiconductor die on the same side of the die as the control electrode and to the second electrode of the second die located on the opposite side of the second die from the control electrode.
摘要:
A power module including a power circuit having heat generating power devices including one or more heatsinks not isolated from the power devices by an insulating body.
摘要:
A current sensing circuit including a shunt resistor coupled, at one end, to the low-side transistor of a half bridge circuit and, at its other end, to a load. The voltage sensed across the shunt resistor is proportional to the current delivered to the load. A level shifting circuit is provided to transpose the sensed voltage to a low voltage signal which can be fed back to control commutation of the transistors in the half bridge circuit.
摘要:
A switch in an inductive circuit is prevented from avalanche operation when the switch is turned off. By preventing avalanche, the associated EMI is reduced or eliminated. Switch avalanche can be prevented using an active component, such as a transistor, or a passive component, such as a resistor, coupled to the switch gate to control current in the switch gate. By controlling current in the switch gate during turn-off, avalanche operation can be prevented without a significant increase in turn-off energy.
摘要:
A novel power supply control circuit topology uses a standard power supply controller to control a high side switch in an electronic circuit. A feedback voltage referenced to ground (or negative bus level) is level-shifted to a high side controller by means of a diode/capacitor/resistor network. Power to the high side controller is supplied by using the feedback output voltage. The circuit can be used instead of conventional flyback converters, particularly in low voltage applications. The circuit requires fewer pins on the transformer/inductor, leading to lower cost and size, particularly as compared to prior art flyback converters. Lower voltage rating required for the switch reduces noise and losses in the device.
摘要:
Conductive EMI in motor drive circuits is reduced by interposing inductors in the ground line. The common mode current enters the motor drive circuit through the two supply leads and leaves the system through the ground lead. The ground current typically is very high frequency but very low in rms amperage. Interposing an induction (low current, very high L) in the ground line advantageously reduces EMI. The inventive method reduces.or eliminates the need for filtering capacitors across the rectifier of the motor drive circuit. In addition, the inventive method minimizes the common mode choke to merely a wraparound ferrite core over the input wires. EMI emissions are reduced further by sandwiching ground traces along with power traces and connecting to.the heat sink with the shortest possible route. This reduces the ground loop area, which consequently reduces emissions.
摘要:
A circuit for synchronous rectification including two power MOSFET transistor switches in which the bottom switch is a P channel MOSFET, rather than an N channel MOSFET. The circuit of the present invention uses a single channel driver, rather than a dual driver and eliminates the deadtime associated with conventional circuits, thus minimizing reverse recovery losses. In an alternative arrangement, the position of the output filter is switched so that the N channel MOSFET conducts during the freewheeling time and the P channel MOSFET (with a larger RDSON) conducts during the conductor charge cycle.
摘要:
A flexible power assembly (FPA) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is mounted directly on a heatsink, which supports a circuit board that is mounted above and spaced from the top side of the IMS. There are provided devices that are mounted on the circuit board which are electrically connected to the power semiconductor devices. There may be a cavity in the circuit board allowing the top of the IMS to be exposed, and optionally providing access for bonding wires to the top of the circuit. Bonding pads may be provided on the circuit board for electrical connection with the bonding wires. A cover may be optionally provided to enclose a space over the cavity. Potting compound may be contained in the space created by the cavity.
摘要:
An audio amplifier assembly that includes a semiconductor package having a semiconductor power die tuned for class D amplifier applications and a conductive clip used for low inductance integration into the amplifier circuit.