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公开(公告)号：US20110163681A1
公开(公告)日：2011-07-07
申请号：US13032510
申请日：2011-02-22
申请人： Wilson Dau , Louis Lerman , Allan Brent York , Robert Steele , Jacqueline Teng , George Lerman
发明人： Wilson Dau , Louis Lerman , Allan Brent York , Robert Steele , Jacqueline Teng , George Lerman
IPC分类号： H05B37/02
CPC分类号： F21K9/1355 , F21K9/20 , F21K9/23 , F21K9/232 , F21K9/235 , F21S2/005 , F21V3/00 , F21V14/02 , F21V19/003 , F21V21/005 , F21V23/06 , F21V29/506 , F21Y2107/00 , F21Y2107/90 , F21Y2115/10 , H05B33/0803 , H05B33/0845 , Y02B20/19 , Y02B20/383
摘要： A solid state lamp, such as one that can replace an incandescent light bulb, has a base portion having an electrical connector for connection to a source of power, such as an Edison-type connector for connection to the mains voltage. An AC/DC converter in the base converts the mains voltage to a suitable light emitting diode (LED) drive voltage. A plurality of receptacles on the base connects to electrodes of plug-in modules. Each plug-in module supports a plurality of low power LEDs connected in series. The strings of LEDs on different modules are connected in parallel when connected to the receptacles. The modules and base are configured to allow a user to operate the lamp with different combinations of modules to generate a desired light output from the lamp. For example, the user can recreate the lumens equivalent of a 20 W, 40 W, or 60 W bulb by using one, two, or three modules.
摘要翻译： 诸如可以替代白炽灯泡的固态灯具有具有用于连接到电源的电连接器的基座部分，例如用于连接到电源电压的爱迪生型连接器。 基站中的AC / DC转换器将电源电压转换为合适的发光二极管（LED）驱动电压。 基座上的多个插座连接到插件模块的电极。 每个插件模块支持串联连接的多个低功率LED。 当连接到插座时，不同模块上的LED串串并联。 模块和基座被配置为允许用户以不同的模块组合操作灯以产生来自灯的期望的光输出。 例如，用户可以通过使用一个，两个或三个模块来重建20 W，40 W或60 W灯泡的流明等效物。
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12.发明授权Method and apparatus for coupling light-emitting elements with light-converting material 有权用光耦合发光元件与光转换材料的方法和装置公开(公告)号：US09034674B2
公开(公告)日：2015-05-19
申请号：US13436166
申请日：2012-03-30
申请人： Ingo Speier , Robert C. Gardner , Louis Lerman , Chris Lowery , Allan Brent York
发明人： Ingo Speier , Robert C. Gardner , Louis Lerman , Chris Lowery , Allan Brent York
IPC分类号： H01L21/00 , H01L51/50 , H01L51/00 , H01L25/075 , H01L33/50
CPC分类号： H01L51/5036 , H01L22/10 , H01L22/26 , H01L25/0753 , H01L33/50 , H01L51/0013 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： Light-emitting elements such as LEDs are associated with light-converting material such as phosphor and/or other material. A donor substrate comprising the light-converting and/or other material is suitably placed relative to a target substrate associated with the light-emitting elements. A laser or other energy source is then used to transfer the light-converting and/or other material in a pattern via writing or masking from the donor substrate to the target substrate in accordance with the pattern. Addressability and targetability of the transfer process facilitates precise patterning of the target substrate.
摘要翻译： 诸如LED的发光元件与诸如磷光体和/或其它材料的光转换材料相关联。 包含光转换和/或其它材料的施主衬底适当地相对于与发光元件相关联的目标衬底放置。 然后使用激光器或其他能量源，以根据图案从施主衬底经由写入或掩模将图案中的光转换和/或其他材料转移到目标衬底。 转移过程的可寻址性和目标性有助于靶基质的精确构图。
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13.发明申请公开(公告)号：US20130037838A1
公开(公告)日：2013-02-14
申请号：US13436166
申请日：2012-03-30
申请人： Ingo Speier , Robert C. Gardner , Louis Lerman , Chris Lowery , Allan Brent York
发明人： Ingo Speier , Robert C. Gardner , Louis Lerman , Chris Lowery , Allan Brent York
CPC分类号： H01L51/5036 , H01L22/10 , H01L22/26 , H01L25/0753 , H01L33/50 , H01L51/0013 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： Light-emitting elements such as LEDs are associated with light-converting material such as phosphor and/or other material. A donor substrate comprising the light-converting and/or other material is suitably placed relative to a target substrate associated with the light-emitting elements. A laser or other energy source is then used to transfer the light-converting and/or other material in a pattern via writing or masking from the donor substrate to the target substrate in accordance with the pattern. Addressability and targetability of the transfer process facilitates precise patterning of the target substrate.
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公开(公告)号：US09006998B2
公开(公告)日：2015-04-14
申请号：US13569121
申请日：2012-08-07
CPC分类号： H05B33/0854 , H05B33/0845 , H05B33/0848 , H05B33/089 , H05B37/0281
摘要： In a single lighting device including a large number of light-emitting elements (LEEs), the LEEs are divided into separately powered groups, and different combinations of the groups are fully energized to achieve the desired overall brightness. In some embodiments, the number of LEEs in each group has a binary relationship to the other groups. The resolution of the dimming is the brightness of the smallest group. In one example of five binary weighted groups of LEEs, 32 brightness levels can be achieved while the LEEs in the energized groups are fully ON. Thus, since there is no high frequency switching, there is substantially no power dissipation by the dimming control system, and there is limited noise or EMI created. The dimming control can be easily implemented with a logic circuit controlling a transistor switch for each group.
摘要翻译： 在包括大量发光元件（LEE）的单个照明装置中，LEE被分成单独供电的组，并且组的不同组合被完全通电以实现期望的总体亮度。 在一些实施例中，每个组中的LEE的数量与其他组具有二元关系。 调光的分辨率是最小组的亮度。 在LEE的五个二进制加权组的一个示例中，可以实现32个亮度级，而通电组中的LEE完全ON。 因此，由于没有高频切换，所以通过调光控制系统基本上没有功率消耗，并且产生有限的噪声或EMI。 调光控制可以通过控制每个组的晶体管开关的逻辑电路来实现。
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公开(公告)号：US20130038219A1
公开(公告)日：2013-02-14
申请号：US13569121
申请日：2012-08-07
IPC分类号： H05B37/02
CPC分类号： H05B33/0854 , H05B33/0845 , H05B33/0848 , H05B33/089 , H05B37/0281
摘要： In a single lighting device including a large number of light-emitting elements (LEEs), the LEEs are divided into separately powered groups, and different combinations of the groups are fully energized to achieve the desired overall brightness. In some embodiments, the number of LEEs in each group has a binary relationship to the other groups. The resolution of the dimming is the brightness of the smallest group. In one example of five binary weighted groups of LEEs, 32 brightness levels can be achieved while the LEEs in the energized groups are fully ON. Thus, since there is no high frequency switching, there is substantially no power dissipation by the dimming control system, and there is limited noise or EMI created. The dimming control can be easily implemented with a logic circuit controlling a transistor switch for each group.
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公开(公告)号：US20120268932A1
公开(公告)日：2012-10-25
申请号：US13538093
申请日：2012-06-29
CPC分类号： F21V29/70 , F21K9/00 , F21K9/27 , F21K9/60 , F21K9/90 , F21S8/06 , F21V19/005 , F21V23/00 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/183 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后将具有导体的透明顶部衬底层压在底部衬底上。 多个实施例一起描述了串联连接LED的各种方式。 光片可以形成为从光片的相对表面发光，使其能够用于悬挂固定装置中以照亮天花板以及地板。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。
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17.发明申请Manufacturing Methods for Solid State Light Sheet or Strip with LEDs Connected in Series for General Illumination 有权固态灯片或带状LED的制造方法，串联连接用于一般照明公开(公告)号：US20110193114A1
公开(公告)日：2011-08-11
申请号：US13044456
申请日：2011-03-09
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。 在另一个实施例中，导体层形成在顶部基板的外表面上，并通过形成在顶部基板中的开口与底部基板上的LED电极和导体接触。
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公开(公告)号：US20120268931A1
公开(公告)日：2012-10-25
申请号：US13537936
申请日：2012-06-29
CPC分类号： F21V29/70 , F21K9/00 , F21K9/27 , F21K9/60 , F21K9/90 , F21S8/06 , F21V19/005 , F21V23/00 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/183 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
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19.发明授权Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination 有权具有串联连接用于一般照明的LED的固态光片或条带的制造方法公开(公告)号：US08198109B2
公开(公告)日：2012-06-12
申请号：US13044456
申请日：2011-03-09
IPC分类号： H01L21/00
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。 在另一个实施例中，导体层形成在顶部基板的外表面上，并通过形成在顶部基板中的开口与底部基板上的LED电极和导体接触。
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20.发明申请公开(公告)号：US20110193106A1
公开(公告)日：2011-08-11
申请号：US13079717
申请日：2011-04-04
IPC分类号： H01L33/08
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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