Abstract:
Techniques and mechanisms to provide mechanical support for a micromachined piezoelectric transducer array. In an embodiment, a transducer array includes transducer elements each comprising a respective membrane portion and a respective supporting structure disposed on or around a periphery of that membrane portion. The transducer elements are initially formed on a sacrificial wafer, wherein supporting structures of the transducer elements facilitate subsequent removal of the sacrificial wafer and/or subsequent handling of the transducer elements. In another embodiment, a polymer layer is disposed on the transducer elements to provide for flexible support during such subsequent handling.
Abstract:
A magnetic recording transducer includes a main pole including a nose portion, the nose portion terminating at an air-bearing surface (ABS). The magnetic recording transducer further includes at least one coil having a coil front distal from the ABS, and at least one side shield, the at least one side shield extending from at the ABS to not further than the coil front.
Abstract:
A method and system for providing a magnetic transducer having an air-bearing surface (ABS) are described. The magnetic transducer includes a base layer, a perpendicular magnetic recording (PMR) pole on the base layer, an additional pole, a write shield, a write gap between the PMR pole and a portion of the write shield, and coil(s) that energize at least the additional pole. The base layer includes a first portion proximate to the ABS and a second portion recessed from the ABS. The first portion is nonmagnetic, while the second portion is magnetic. The PMR pole has a first front portion proximate to the ABS. The additional pole has a second front portion recessed from the ABS. At least a portion of the additional pole resides between the PMR pole and write shield. At least a portion of the write gap resides on the front portion of the PMR pole.
Abstract:
Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.
Abstract:
A plurality of transducer elements are formed. For each of the plurality of transducer elements, an electrode of the transducer element is formed on a first side of a support layer. A piezoelectric element of the transducer element is formed on the first side of the support layer. An interconnect of the transducer element is formed in the support layer. The support layer is thinned to expose a second side of the support layer. The interconnects of the plurality of transducer elements extend between the first side and the second side of the support layer. The second side of the support layer is bonded to a flexible layer with an adhesive material. Conductive fillers are disposed in the adhesive material. The interconnects of the plurality of transducer elements are each electrically coupled via the conductive fillers to the corresponding interconnect extending through the flexible layer.
Abstract:
Techniques and mechanisms to provide mechanical support for a micromachined piezoelectric transducer array. In an embodiment, a transducer array includes transducer elements each comprising a respective membrane portion and a respective supporting structure disposed on or around a periphery of that membrane portion. The transducer elements are initially formed on a sacrificial wafer, wherein supporting structures of the transducer elements facilitate subsequent removal of the sacrificial wafer and/or subsequent handling of the transducer elements. In another embodiment, a polymer layer is disposed on the transducer elements to provide for flexible support during such subsequent handling.
Abstract:
Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.
Abstract:
A method and system for providing a pole of magnetic transducer having an air-bearing surface (ABS) are described. Leading shield and planarization stop layers are provided. Portions of the planarization stop and shield layers distal from the ABS location are removed, providing a depression forming a bevel. The bevel has an angle greater than zero and less than ninety degrees. An intermediate layer having a top surface substantially perpendicular to the ABS location is provided. Part of the intermediate layer is removed, forming a trench having a bottom corresponding to the leading shield and a location and profile corresponding to the pole. A nonmagnetic layer is provided at least partially in the trench. The pole with a leading edge bevel corresponding to the bevel is provided in the trench. A capping layer covering the pole is provided, at least part of the intermediate layer removed, and a wrap-around shield provided.
Abstract:
A well may be formed for access to an optical waveguide core by a process that results in an L-shaped well. The L-shaped well may then be filled with a polymer. By controlling the size of each portion of well, the occurrence of bubbles within the well and cuts to the core may be reduced.
Abstract:
Embodiments of an optical detection apparatus are disclosed which may include one or more of a waveguide, a trench formed in the waveguide, a reflective surface, and a photodetector. The waveguide may be formed in a semiconductor substrate to propagate an optical signal received at a first end of the waveguide. The trench may also be formed in the waveguide having a first sidewall and a second sidewall, the first and second sidewalls forming first and second angles with the waveguide's propagation direction. The second sidewall may include a reflective surface formed thereon. The photodetector may be configured to receive an optical signal propagated in the waveguide, through the first sidewall and reflected from the reflective surface on the second sidewall.