Noise reducing apparatus, noise reducing method, and noise reducing program for improving image quality
    11.
    发明授权
    Noise reducing apparatus, noise reducing method, and noise reducing program for improving image quality 有权
    降噪装置,降噪方法和降噪程序,提高图像质量

    公开(公告)号:US08532428B2

    公开(公告)日:2013-09-10

    申请号:US12528773

    申请日:2008-02-04

    申请人: Akira Inoue

    发明人: Akira Inoue

    IPC分类号: G06K9/40

    摘要: A noise reducing apparatus and associated method and program for improving image quality in an image are provided. The noise reducing apparatus detects a flat area from an image and analyzes the noise from the flat area, and then it suppresses a noise component of the image based on the noise analysis result.

    摘要翻译: 提供了一种用于改善图像中的图像质量的降噪装置和相关联的方法和程序。 噪声降低装置从图像检测平坦区域,并分析来自平坦区域的噪声,然后基于噪声分析结果抑制图像的噪声分量。

    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR
    12.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR 有权
    氮化物半导体发光元件及其制造方法

    公开(公告)号:US20130214288A1

    公开(公告)日:2013-08-22

    申请号:US13880027

    申请日:2012-05-02

    IPC分类号: H01L33/32

    CPC分类号: H01L33/32 H01L33/02 H01L33/16

    摘要: A nitride-based semiconductor light-emitting device of an embodiment includes a semiconductor multilayer structure having a growing plane which is an m-plane and being made of a GaN-based semiconductor. The semiconductor multilayer structure includes a n-type semiconductor layer, a p-type semiconductor layer, a p-side electrode provided on the p-type semiconductor layer, and an active layer interposed between the n-type semiconductor layer and the p-type semiconductor layer. The ratio of the thickness of the active layer to the thickness of the n-type semiconductor layer, D, is in the range of 1.8×10−4≦D≦14.1×10−4. The area of the p-side electrode, S, is in the range of 1×102 μm2≦S≦9×104 μm2. A maximum current density which leads to 88% of a maximum of the external quantum efficiency is not less than 2 A/mm2.

    摘要翻译: 实施方式的氮化物系半导体发光元件具有半导体层叠结构,该半导体层叠结构具有作为m面的生长面并由GaN系半导体构成。 半导体多层结构包括n型半导体层,p型半导体层,设置在p型半导体层上的p侧电极以及介于n型半导体层和p型半导体层之间的有源层 半导体层。 有源层的厚度与n型半导体层的厚度D之比在1.8×10 -4 @ D @ 14.1×10 -4的范围内。 p侧电极S的面积在1×102mum2 @ S @ 9×104mum2的范围内。 导致外部量子效率最大值的88%的最大电流密度不小于2A / mm2。

    Image correction method, image correction device, and program
    13.
    发明授权
    Image correction method, image correction device, and program 有权
    图像校正方法,图像校正装置和程序

    公开(公告)号:US08494265B2

    公开(公告)日:2013-07-23

    申请号:US12739777

    申请日:2008-10-17

    IPC分类号: G06T5/00

    CPC分类号: H04N9/68 G06K9/00684 H04N1/60

    摘要: An image correction device includes a scene belonging rate computation unit that computes, from the feature value of an input image, a plurality of scene belonging rates each of which prescribes a probability with which the input image belongs to each category scene; an unknown scene belonging rate specification unit that specifies an unknown scene belonging rate prescribing a probability with which the input image belongs to an unknown scene; a by-scene correction parameter memory unit that stores by-scene correction parameters; a correction parameter combination unit that computes a combined correction parameter that is the weighted average of the correction parameters using the plurality of scene belonging rates and the unknown scene belonging rate; and an image correction unit that performs image correction processing for the input image using the combined correction parameter.

    摘要翻译: 图像校正装置包括场景归属率计算单元,其从输入图像的特征值计算多个场景归属率,每个场景归属率规定输入图像属于每个类别场景的概率; 未知场景属性率指定单元,其指定输入图像属于未知场景的概率的未知场景归属率; 存储逐场校正参数的逐场校正参数存储单元; 校正参数组合单元,其使用所述多个场景归属率和所述未知场景归属率来计算作为所述校正参数的加权平均的组合校正参数; 以及图像校正单元,其使用组合校正参数对输入图像执行图像校正处理。

    Printer control device for controlling concurrently input print data, and printer apparatus with a printer control device
    16.
    发明授权
    Printer control device for controlling concurrently input print data, and printer apparatus with a printer control device 有权
    用于同时输入打印数据的打印机控制装置,以及具有打印机控制装置的打印机装置

    公开(公告)号:US08400662B2

    公开(公告)日:2013-03-19

    申请号:US12857311

    申请日:2010-08-16

    申请人: Akira Inoue

    发明人: Akira Inoue

    IPC分类号: G06F15/00 G06K1/00

    摘要: A printer apparatus is provided which receives concurrent input print data from plural input ports without increasing receiving buffer memory. A controller determines whether an image creator is used by other jobs when starting receiving print data through any one of the plural input ports. When not used, print data related to the current job is stored in a receiving buffer memory and at the same time print data stored in the buffer memory is printed via the image creator. On the other hand, when other jobs use the image creator, the print data related to the current job is stored in a hard disk unit and is printed when the image creating device becomes available.

    摘要翻译: 提供一种打印机装置,其从多个输入端口接收同时输入的打印数据,而不增加接收缓冲存储器。 当通过多个输入端口中的任何一个开始接收打印数据时,控制器确定其他作业是否使用图像创建器。 当不使用时,与当前作业相关的打印数据存储在接收缓冲存储器中,并且通过图像创建者打印存储在缓冲存储器中的打印数据。 另一方面,当其他作业使用图像创建者时,与当前作业相关的打印数据被存储在硬盘单元中,并且当图像创建装置可用时被打印。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    17.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20130020584A1

    公开(公告)日:2013-01-24

    申请号:US13639199

    申请日:2010-04-22

    IPC分类号: H01L29/78

    摘要: In the present invention, provided is a semiconductor device, including: a GaN channel layer which is provided on a substrate and through which electrons run; a barrier layer which is provided on the GaN channel layer and which contains at least one of In, Al, and Ga and contains N; a gate electrode which is provided on the barrier layer; and a source electrode and a drain electrode which are provided on the substrate across the gate electrode, in which, in a portion of the barrier layer between the gate electrode and the drain electrode, a magnitude of polarization of the barrier layer is smaller on the gate electrode side than on the drain electrode side. Thus, PAE can be improved by reducing Rd and Cgd simultaneously.

    摘要翻译: 在本发明中,提供了一种半导体器件,包括:GaN沟道层,其设置在基板上,电子通过该沟道层运行; 阻挡层,其设置在所述GaN沟道层上并且包含In,Al和Ga中的至少一个并且包含N; 设置在所述阻挡层上的栅电极; 以及源极电极和漏电极,其设置在跨越栅电极的基板上,其中在栅电极和漏电极之间的阻挡层的一部分中,阻挡层的极化大小在 栅电极侧比漏极侧。 因此,通过同时减少Rd和Cgd可以改善PAE。

    EPITAXIAL SILICON WAFER AND METHOD FOR MANUFACTURING SAME
    19.
    发明申请
    EPITAXIAL SILICON WAFER AND METHOD FOR MANUFACTURING SAME 有权
    外延硅晶片及其制造方法

    公开(公告)号:US20120112319A1

    公开(公告)日:2012-05-10

    申请号:US13382674

    申请日:2010-07-01

    IPC分类号: H01L29/36 H01L21/20

    摘要: It is an object to provide an epitaxial silicon wafer that is provided with an excellent gettering ability in which a polysilicon layer is formed on the rear face side of a silicon crystal substrate into which phosphorus (P) and germanium (Ge) have been doped. A PBS forming step for growing a polysilicon layer is executed on the rear face side of a silicon crystal substrate into which phosphorus and germanium have been doped at a high concentration to execute a baking treatment. After a surface layer of the silicon crystal substrate is then polished up to a predetermined amount, a silicon epitaxial layer is grown by a CVD method. By the above steps, the number of LPDs (caused by an SF) that occur on the surface of the epitaxial silicon wafer due to the SF can be greatly reduced.

    摘要翻译: 本发明的目的是提供一种在掺杂有磷(P)和锗(Ge)的硅晶体衬底的背面侧上形成多晶硅层的优异的吸气能力的外延硅晶片。 在已经以高浓度掺杂有磷和锗的硅晶体衬底的背面执行用于生长多晶硅层的PBS形成步骤,以进行烘烤处理。 然后将硅晶体衬底的表面层抛光至预定量之后,通过CVD法生长硅外延层。 通过上述步骤,可以大大减少由于SF而在外延硅晶片的表面上发生的LPD(由SF引起)的数量。

    EPITAXIAL SILICON WAFER AND METHOD FOR MANUFACTURING SAME
    20.
    发明申请
    EPITAXIAL SILICON WAFER AND METHOD FOR MANUFACTURING SAME 有权
    外延硅晶片及其制造方法

    公开(公告)号:US20120112190A1

    公开(公告)日:2012-05-10

    申请号:US13378562

    申请日:2010-05-28

    IPC分类号: H01L29/04 H01L21/20

    摘要: It is an object to provide an epitaxial silicon wafer that is provided with an excellent gettering ability in which a polysilicon layer is formed on the rear face side of a silicon crystal substrate into which phosphorus (P) and germanium (Ge) have been doped. A silicon epitaxial layer is grown by a CVD method on the surface of a silicon crystal substrate into which phosphorus and germanium have been doped at a high concentration. After that, a PBS forming step for growing a polysilicon layer is executed on the rear face side of a silicon crystal substrate. By the above steps, the number of LPDs (caused by an SF) that occur on the surface of the epitaxial silicon wafer due to the SF can be greatly reduced.

    摘要翻译: 本发明的目的是提供一种在掺杂有磷(P)和锗(Ge)的硅晶体衬底的背面侧上形成多晶硅层的优异的吸气能力的外延硅晶片。 通过CVD法在硅晶体衬底的表面上以高浓度掺杂有磷和锗的方式生长硅外延层。 之后,在硅晶体基板的背面进行用于生长多晶硅层的PBS形成工序。 通过上述步骤,可以大大减少由于SF而在外延硅晶片的表面上发生的LPD(由SF引起)的数量。