Optical diffusers, photomasks and their methods of fabrication
    11.
    发明授权
    Optical diffusers, photomasks and their methods of fabrication 有权
    光扩散器,光掩模及其制造方法

    公开(公告)号:US08409789B2

    公开(公告)日:2013-04-02

    申请号:US12853533

    申请日:2010-08-10

    申请人: Zhijian Lu

    发明人: Zhijian Lu

    IPC分类号: G03F7/00 G02F1/1335

    摘要: A large mask with random apertures may be formed by forming a smaller mask (also called a cell mask) with a random pattern of transmissive apertures which is then repeatedly replicated to create the large mask. The random pattern may be created by perturbing the aperture locations by a small amount or the apertures may be randomly placed within the cell mask provided certain criteria are met. Alternatively, a large mask with a random pattern of transmissive apertures may be formed without using a cell mask. This large mask may be used to fabricate diffusers and other devices that do not suffer from the interference, diffraction and other optical effects common in devices having structures that are non-randomly patterned.

    摘要翻译: 可以通过用随机图案的透射孔形成更小的掩模(也称为细胞掩模)来形成具有随机孔径的大掩模,然后重复地复制以形成大掩模。 可以通过将孔径位置扰乱少量来产生随机图案,或者如果符合某些标准,孔可以随机地放置在细胞掩模内。 或者,可以在不使用细胞掩模的情况下形成具有透射孔的随机图案的大掩模。 这种大的掩模可用于制造不受干涉,衍射和在具有非随机图案化结构的器件中常见的其它光学效应的扩散器和其它器件。

    Minimizing resist poisoning in the manufacture of semiconductor devices

    公开(公告)号:US20080020580A1

    公开(公告)日:2008-01-24

    申请号:US11828217

    申请日:2007-07-25

    IPC分类号: H01L21/04

    CPC分类号: H01L21/76808 H01L21/31144

    摘要: The present invention provides a method for manufacturing an interconnect and a method for manufacturing an integrated circuit including the interconnect. The method of manufacturing an interconnect, among other steps, includes forming a via (160) in a substrate (130) and then forming a base getter material (210) in the via (160). The method further includes forming a photoresist layer (410) over the base getter material (210), the photoresist layer (410) having an opening (420) therein positioned over the via (160), and etching a trench (510) into the substrate (130) using the opening (420) in the photoresist layer (410).

    Method For Implementing Account Charging And Account Charging System
    17.
    发明申请
    Method For Implementing Account Charging And Account Charging System 有权
    实行账户充值和账户收费系统的方法

    公开(公告)号:US20070274481A1

    公开(公告)日:2007-11-29

    申请号:US10566952

    申请日:2004-07-30

    IPC分类号: H04L12/14

    CPC分类号: G06Q40/04 H04L12/14 H04L12/66

    摘要: A method for realizing charging includes setting up mapping relation between service attribute and charging rule, acquiring service attribute of the to-be-charged service when it is demanded to charge the to-be-charged service, acquiring charging rule of the to-be-charged service according to service attribute of the to-be-charged service, and charging the to-be-charged service according to the acquired charging rule. Also disclosed is a charging system having an acquiring charging rule module and charging processing module. When it is demanded to develop new services or modify charging rules of original services, it can be fulfilled by modifying the service information provided for charging processing module accordingly, thus charging requirements of various services can be satisfied. Charging processing module of charging system is independent of services, so that cost of charging system is reduced, and stability, reliability and versatility of charging system are improved.

    摘要翻译: 实现充电的方法包括建立服务属性与收费规则之间的映射关系,当要求对待收费服务收费时获取收费服务的服务属性,获取待收费业务的收费规则 根据收费服务的服务属性进行收费服务,并根据获取的收费规则向收费服务收费。 还公开了一种具有获取计费规则模块和计费处理模块的计费系统。 当要求开发新服务或修改原始服务的计费规则时,可以通过相应地修改提供给计费处理模块的服务信息来实现,从而满足各种服务的收费要求。 充电系统的充电处理模块独立于服务,从而降低了充电系统的成本,提高了充电系统的稳定性,可靠性和通用性。

    Pattern transfer in device fabrication
    19.
    发明授权
    Pattern transfer in device fabrication 有权
    器件制造中的图案转移

    公开(公告)号:US07090967B2

    公开(公告)日:2006-08-15

    申请号:US10248232

    申请日:2002-12-30

    IPC分类号: G03F7/26

    摘要: A method of transferring a pattern onto a substrate, in the fabrication of ICs, is disclosed. The substrate is coated with a photoresist layer, wherein the photoresist layer is selectively exposed and developed, producing sidewalls that exhibit roughness. The roughness is smoothened out by coating the photoresist layer with a coating layer.

    摘要翻译: 公开了一种在IC的制造中将图案转印到基板上的方法。 衬底涂覆有光致抗蚀剂层,其中光致抗蚀剂层被选择性地暴露和显影,产生表现出粗糙度的侧壁。 通过用涂层涂覆光致抗蚀剂层,使粗糙度平滑化。

    Method of reducing post-development defects in and around openings formed in photoresist by use of non-patterned exposure
    20.
    发明授权
    Method of reducing post-development defects in and around openings formed in photoresist by use of non-patterned exposure 有权
    通过使用非图案曝光来减少在光致抗蚀剂中形成的开口周围和周围的显影后缺陷的方法

    公开(公告)号:US06420101B1

    公开(公告)日:2002-07-16

    申请号:US09598376

    申请日:2000-06-21

    IPC分类号: G03F720

    摘要: In the exposure and development of available deep ultraviolet (DUV) sensitive photoresist it has been observed that following the standard prior art methods of exposure and development results in a high density of undesirable pieces of components of the photoresist material, Blob Defects, remaining on the semiconductor substrate (body). A method of exposing and developing the photoresist material which results in a reduced incidence of these Blob Defects consists of introducing a low level uniform flood exposure of light in addition to the commonly used exposure to patterned light, followed by standard development. The flood exposure is in the range of 5 to 50% of the dose-to-clear for a non-patterned exposure.

    摘要翻译: 在可用的深紫外(DUV)敏感光刻胶的曝光和显影中,已经观察到遵循现有技术的标准曝光和显影方法导致光致抗蚀剂材料的不希望的部件的高密度,残留在 半导体衬底(主体)。 曝光和显影光致抗蚀剂材料的方法导致这些斑点缺陷的发生率降低,除了通常使用的图案光曝光之外,还引入低等级的均匀泛光曝光,随后进行标准开发。 对于非图案化曝光,洪水暴露在5至50%的剂量清除范围内。