DIE MOUNTED CONTACT APPLICATOR
    17.
    发明申请
    DIE MOUNTED CONTACT APPLICATOR 审中-公开
    DIE安装联系人应用

    公开(公告)号:US20170072411A1

    公开(公告)日:2017-03-16

    申请号:US15265560

    申请日:2016-09-14

    发明人: Andrew S. Ayers

    IPC分类号: B05B1/04

    摘要: A slot die assembly for applying at least one material onto a substrate includes an adapter having a passive heat transfer device, a shim package fluidically connected to the adapter, the shim package having a first material discharge slot and a second material discharge slot, and a die plate having a one or more fluid channels fluidically connected to the shim package. The assembly also includes one or more mounting studs extending from the adapter, the mounting studs configured to engage a parent machine.

    摘要翻译: 用于将至少一种材料施加到衬底上的槽模组件包括具有被动热传递装置的适配器,与适配器流体连接的垫片封装,垫片封装具有第一材料放电槽和第二材料放电槽,以及 模具板具有流体连接到垫片封装的一个或多个流体通道。 组件还包括从适配器延伸的一个或多个安装螺柱,所述安装螺柱被配置为接合母机。