Moisture curable compound with thiourea

    公开(公告)号:US09944770B2

    公开(公告)日:2018-04-17

    申请号:US14899625

    申请日:2014-06-19

    CPC classification number: C08K5/405 C08K5/544 C08L83/04 C08L75/02

    Abstract: The present invention provides curable compositions comprising non-tin metal accelerators that accelerate the condensation curing of moisture-curable silicones/non-silicones. In particular, the present invention provides an accelerator comprising thiourea-containing compounds that are particularly suitable as replacements for organotin in sealant and RTV formulations. Further, this thiourea-containing compound is comparable or superior to organotin such as DBTDL, exhibits certain behavior in the presence of components that allow for tuning or adjusting the cure characteristics of the compositions, and provides good adhesion and storage stability.

Patent Agency Ranking