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公开(公告)号:US20170315171A1
公开(公告)日:2017-11-02
申请号:US15652911
申请日:2017-07-18
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185 , G01R31/317
CPC classification number: G01R31/3177 , G01R31/31723 , G01R31/31724 , G01R31/31725 , G01R31/318508 , G01R31/318513 , G01R31/318555 , G01R31/318597
Abstract: This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.
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公开(公告)号:US20170261553A1
公开(公告)日:2017-09-14
申请号:US15609950
申请日:2017-05-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185
CPC classification number: G01R31/3177 , G01R31/318536 , G01R31/318544 , G01R31/318555
Abstract: The disclosure describes a novel method and apparatus for providing a shadow access port within a device. The shadow access port is accessed to perform operations in the device by reusing the TDI, TMS, TCK and TDO signals that are used to operate a test access port within the device. The presence and operation of the shadow access port is transparent to the presence and operation of the test access port. According to the disclosure, the shadow access port operates on the falling edge of the TCK signal while the test access port conventionally operates on the rising edge of the TCK signal.
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公开(公告)号:US09753085B2
公开(公告)日:2017-09-05
申请号:US15340507
申请日:2016-11-01
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185 , G01R31/317
CPC classification number: G01R31/3177 , G01R31/31723 , G01R31/31724 , G01R31/31725 , G01R31/318508 , G01R31/318513 , G01R31/318555 , G01R31/318597
Abstract: This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.
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公开(公告)号:US09746517B2
公开(公告)日:2017-08-29
申请号:US15227536
申请日:2016-08-03
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185 , G01R31/317 , H01L23/00
CPC classification number: G01R31/3177 , G01R31/31713 , G01R31/31723 , G01R31/318536 , H01L24/09 , H01L24/17 , H01L2224/16146 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15192 , H01L2924/15311 , H01L2924/00
Abstract: The disclosure describes a novel method and apparatus for improving interposers that connected stacked die assemblies to system substrates. The improvement includes the addition of IEEE 1149.1 circuitry within interposers to allow simplifying interconnect testing of digital and analog signal connections between the interposer and system substrate it is attached too. The improvement also includes the additional 1149.1 controlled circuitry that allows real time monitoring of voltage supply and ground buses in the interposer. The improvement also includes the additional of 1149.1 controlled circuitry that allows real time monitoring of functional digital and analog input and output signals in the interposer. The improvement also provides the ability to selectively serially link the 1149.1 circuitry in the interposer with 1149.1 circuitry in the die of the stack.
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公开(公告)号:US20170227606A1
公开(公告)日:2017-08-10
申请号:US15499362
申请日:2017-04-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3185 , G01R31/3177
CPC classification number: G01R31/318597 , G01R31/31723 , G01R31/3177 , G01R31/318552 , G01R31/318555 , G01R31/318558
Abstract: A falling edge controller includes a controller having an inverted TCK (Test Clock) input, a TMS (Test Mode Select) input, a shift register control output, an update register control output, and a shift output; a shift register having a TDI (Test Data In) input, a shift register control input coupled to the shift register control output, address inputs, a select input, address and select outputs, and a TDO (Test Data Out) output; an update register having address and select inputs coupled to the address and select outputs, an update register control input coupled to the update register control output, address outputs coupled to the address inputs, and a select output coupled to the select input; and address circuitry having address inputs coupled to the address outputs, and having an enable output.
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公开(公告)号:US20170227604A1
公开(公告)日:2017-08-10
申请号:US15499373
申请日:2017-04-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/317 , G01R31/28
CPC classification number: G01R31/3177 , G01R31/3172 , G01R31/318536 , G01R31/318555 , G01R31/318572 , G06F1/10
Abstract: An integrated circuit has controller circuitry having coupled to a test clock and a test mode select inputs, and having state a register clock state output, a register capture state output, and a register update state output. Register circuitry has a test data in lead input, control inputs coupled to the state outputs of the controller circuitry, and a control output. Connection circuitry has a control input connected to the control output of the register circuitry and selectively couples one of a first serial data output of first scan circuitry and a second serial data output of second scan circuitry to a test data out lead. Selection circuitry has an input connected to the serial data input lead, an input connected to a test pattern source lead, a control input coupled to the scan circuitry control output leads, and an output connected to the scan input lead.
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公开(公告)号:US09709630B2
公开(公告)日:2017-07-18
申请号:US14590502
申请日:2015-01-06
Applicant: Texas Instruments Incorporated
Inventor: Lee D. Whetsel
IPC: G01R31/3185 , G01R31/3177 , H01J37/30 , H01J37/317 , G01R31/26
CPC classification number: G01R31/318572 , G01R31/2607 , G01R31/3177 , G01R31/318513 , G01R31/318552 , G01R31/318558 , G01R31/318594 , H01J37/3007 , H01J37/3171 , H01J2237/15 , H01J2237/30472
Abstract: A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.
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公开(公告)号:US09684033B2
公开(公告)日:2017-06-20
申请号:US15270746
申请日:2016-09-20
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/317 , G01R31/3185 , G01R31/3177
CPC classification number: G01R31/318536 , G01R31/31721 , G01R31/31723 , G01R31/3177 , G01R31/318575 , G01R31/318577
Abstract: Scan architectures are commonly used to test digital circuitry in integrated circuits. The present disclosure describes a method of adapting conventional scan architectures into a low power scan architecture. The low power scan architecture maintains the test time of conventional scan architectures, while requiring significantly less operational power than conventional scan architectures. The low power scan architecture is advantageous to IC/die manufacturers since it allows a larger number of circuits (such as DSP or CPU core circuits) embedded in an IC/die to be tested in parallel without consuming too much power within the IC/die. Since the low power scan architecture reduces test power consumption, it is possible to simultaneously test more die on a wafer than previously possible using conventional scan architectures. This allows wafer test times to be reduced which reduces the manufacturing cost of each die on the wafer.
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公开(公告)号:US09671426B2
公开(公告)日:2017-06-06
申请号:US14826617
申请日:2015-08-14
Applicant: Texas Instruments Incorporated
Inventor: Lee D. Whetsel
CPC classification number: G01R1/0416 , B05C21/00 , B44D3/126 , G01R31/26 , G01R31/2853 , G01R31/2889 , G01R31/3177 , G01R31/318538 , H01L2224/16145 , H01L2224/16245 , H01L2224/17181 , H01L2924/15174 , H01L2924/15311 , H05K1/115
Abstract: The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.
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公开(公告)号:US09618581B2
公开(公告)日:2017-04-11
申请号:US15169023
申请日:2016-05-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185 , G01R31/317
CPC classification number: G01R31/3177 , G01R31/31713 , G01R31/31723 , G01R31/31727 , G01R31/318508 , G01R31/318555
Abstract: A test architecture accesses IP core test wrappers within an IC using a Link Instruction Register (LIR). An IEEE P1500 standard is in development for providing test access to these individual cores via a test structure called a wrapper. The wrapper resides at the boundary of the core and provides a way to test the core and the interconnections between cores. —The test architecture enables each of the plural wrappers in the IC, including wrappers in cores embedded within other cores, with separate enable signals.
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