公开(公告)号：US20060220188A1

公开(公告)日：2006-10-05

申请号：US11192498

申请日：2005-07-29

Applicant: Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

Inventor： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The present invention provides a package structure, which includes a substrate, wherein the circuit has been configured within the substrate; a lead-frame having lead on the first surface of the substrate; at least one first electronic device located on the lead-frame; a second electronic device located on the first surface of the substrate whose the circuit has been configured therein; a plurality of conductive wires, which used for electrically coupling the first electronic device and second electronic device, and the second electronic device with the lead-frame; a molding compound, which used to seal the portion of substrate, the first electronic device, the second electronic device, and the portion of the lead-frame; and a metal plate, which located on the second surface of the substrate, and used to remove the heat that is generated from the first electronic device.

Abstract translation: 本发明提供一种封装结构，其包括基板，其中所述电路已经配置在所述基板内; 引线框架，其在所述基板的第一表面上具有引线; 位于引线框架上的至少一个第一电子设备; 位于基板的第一表面上的第二电子器件，其电路已经配置在其中; 用于将第一电子设备和第二电子设备电耦合的多条导线以及具有引线框架的第二电子设备; 用于密封所述基板的所述部分，所述第一电子设备，所述第二电子设备以及所述引线框架的所述部分的模塑料; 以及金属板，其位于所述基板的第二表面上，并且用于去除从所述第一电子设备产生的热量。

公开(公告)号：US20040212461A1

公开(公告)日：2004-10-28

申请号：US10422692

申请日：2003-04-25

Applicant: Cyntec Co., Ltd.

Inventor： Tseng Shin-Hsuan ,  Lin Cheng-Kuo ,  Wang Yin-Ching ,  Huang Fan-Hsiu ,  Chan Yi-Jen

IPC: H01P001/203

CPC classification number: H01P11/007 ,  H01P1/2013 ,  H01P11/003

Abstract: The present invention discloses a miniaturized multi-layer coplanar wave guide low pass filter including: a substrate; a first dielectric layer formed on and enclosing said substrate; a first metallic pattern layer formed on said first dielectric layer; a second dielectric layer formed on said first metallic pattern layer; wherein several via holes being formed on said second dielectric layer; a second metallic pattern layer formed on said second dielectric layer, wherein said via holes formed on said second dielectric layer are filled up with the metal thereof; a third dielectric layer formed on said second metallic pattern layer, wherein several via holes being formed on said third dielectric layer; and a third metallic pattern layer formed on said third dielectric layer, wherein said via holes formed on said third dielectric layer are filled with the metal thereof.

Abstract translation: 本发明公开了一种小型化的多层共面波导低通滤波器，包括：基板; 形成在所述衬底上并包围所述衬底的第一电介质层; 形成在所述第一电介质层上的第一金属图案层; 形成在所述第一金属图案层上的第二电介质层; 其中在所述第二电介质层上形成几个通孔; 形成在所述第二电介质层上的第二金属图案层，其中形成在所述第二电介质层上的所述通孔用其金属填充; 形成在所述第二金属图案层上的第三电介质层，其中在所述第三电介质层上形成几个通孔; 以及形成在所述第三电介质层上的第三金属图案层，其中形成在所述第三介电层上的所述通孔被其金属填充。

公开(公告)号：US20250125319A1

公开(公告)日：2025-04-17

申请号：US18912626

申请日：2024-10-11

Applicant: CYNTEC CO., LTD.

Inventor： Bau Ru Lu ,  Yueh Lun Lee

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L29/78

Abstract: A stacked electronic structure, wherein a molding body encapsulates a first active device with a first electrode on a top surface of the first active device and a second electrode on a bottom surface of the first active device; and a magnetic device disposed over the molding body and comprising a first inductor, wherein the second electrode of the first active device is electrically connected to the substrate, and the first electrode of the first active device tis electrically connected to the first inductor.

公开(公告)号：US20250106987A1

公开(公告)日：2025-03-27

申请号：US18373263

申请日：2023-09-26

Applicant: CYNTEC CO., LTD.

Inventor： Chia-Fu Hsu ,  Chun-Yen Chen

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/18 ,  H05K3/40

Abstract: A flexible printed circuit board with embedded optical waveguide structure, including a photoelectric transmission unit, wherein the photoelectric transmission unit includes a flexible insulation layer, a first optoelectronic unit and a second optoelectronic unit embedded in the photoelectric transmission unit, at least one redistribution layer having at least one conductive structure stacked with the flexible insulation layer and electrically connected with the first optoelectronic unit and second optoelectronic unit, an optical waveguide structure stacked with the flexible insulation layer, a first metal bump and a second metal bump adjacent to the optical waveguide structure and in optical alignment respectively with the first optoelectronic unit and the second optoelectronic unit to provide reflection planes for optical signal, wherein first metal bump and second metal bump are solid structures made of the same material as the one of redistribution layer.

公开(公告)号：US20250079970A1

公开(公告)日：2025-03-06

申请号：US18403693

申请日：2024-01-03

Applicant: CYNTEC CO., LTD.

Inventor： Yi-Jie Luo

IPC: H02M1/08 ,  H02M1/00

Abstract: An on-time controller, for controlling a switching operation of a power converter includes an on-time controlling circuit, configured to control an on-time signal of a switch circuit of the power converter according to a reference voltage, wherein the reference voltage is varied according to an output voltage of an output terminal of the switch circuit; and a frequency adjusting circuit, coupled to the on-time controlling circuit, configured to sense the output voltage of the output terminal of the switch circuit, generate a load sensing current according to the output voltage, and provide the load sensing current to the on-time controlling circuit for compensating the reference voltage to adjust the on-time signal of the switch circuit and a switching frequency of the switch circuit.

公开(公告)号：US12183499B2

公开(公告)日：2024-12-31

申请号：US17317904

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Kuan Yu Chiu ,  Ching Hsiang Yu

IPC: H01Q7/06 ,  H01F27/24 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01Q7/08 ,  H02J7/00 ,  H02J50/10 ,  H02J50/70 ,  H05K7/20 ,  H10N10/00

Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.

公开(公告)号：US12068092B2

公开(公告)日：2024-08-20

申请号：US17716504

申请日：2022-04-08

Applicant: Cyntec Co., Ltd.

Inventor： Chih Yu Hu ,  Wen Hao Wu ,  Chun Cheng Yao

IPC: H01C1/148 ,  G01R1/20 ,  G01R19/00 ,  H01C13/02

CPC classification number: H01C1/148 ,  G01R1/203 ,  G01R19/00 ,  H01C13/02

Abstract: A resistor structure includes a resistor body; and a first electrode structure disposed at and being in electric contact with a first end of the resistor body, and a second electrode structure disposed at and being in electric contact with a second end opposite to the first end of the resistor body. Each of the first electrode structure and the second electrode structure has at least one conductive protrusion. The at least one conductive protrusion of the first electrode structure and the at least one conductive protrusion of the second electrode structure both serve as voltage-sensing terminals for electric connection to an external voltage measurement device, or both serve as current-sensing terminals for electric connection to a current measurement device.

公开(公告)号：US20240234005A1

公开(公告)日：2024-07-11

申请号：US18611719

申请日：2024-03-21

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Tiao Liu ,  Lan-Chin Hsieh ,  Tsung-Chan Wu ,  Chi-Hsun Lee ,  Chih-Siang Chuang

IPC: H01F27/02 ,  H01F1/147 ,  H01F17/04 ,  H01F27/255 ,  H01F27/28 ,  H01F27/29

CPC classification number: H01F27/022 ,  H01F1/14741 ,  H01F1/14766 ,  H01F1/14791 ,  H01F17/045 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29

Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein μC×Hsat≥1800, where μC is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of μC0, where μC0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.

公开(公告)号：US11867941B2

公开(公告)日：2024-01-09

申请号：US18143089

申请日：2023-05-04

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Jui Yang

IPC: F21V8/00 ,  H01R13/717

CPC classification number: G02B6/0073 ,  G02B6/0015 ,  H01R13/7175

Abstract: A light guide assembly, comprising: a substrate and a light guide disposed on the substrate, wherein the top surface of the body comprises a first protrusion having a first slanting surface and a second slanting surface opposite to the first slanting surface for reflecting lights entering into the body, wherein a first outer surface of the body extends from a first lateral surface to the first slanting surface, wherein a highest point of the first slanting surface is located between the first lateral surface and a second lateral surface opposite to the first lateral surface, and a highest point of the second slanting surface is located between the first lateral surface and a lowest point of the second slanting surface.

公开(公告)号：US11848146B2

公开(公告)日：2023-12-19

申请号：US17317902

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chien Ming Chen

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H01F27/24 ,  H01F27/02 ,  H01F27/26 ,  H01F41/00 ,  H01L25/16 ,  H01L49/02 ,  H01F27/36 ,  H01F41/02

CPC classification number: H01F27/29 ,  H01F27/022 ,  H01F27/24 ,  H01F27/266 ,  H01F27/2804 ,  H01F27/288 ,  H01F27/2823 ,  H01F27/363 ,  H01F41/005 ,  H01F41/02 ,  H01F41/04 ,  H01L25/16 ,  H01L28/10

Abstract: A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.