Abstract:
A method of making nanosized copper (I) compounds, in particular, copper (I) halides, pseudohalides, and cyanocuprate complexes, in reverse micelles or microemulsions is disclosed herein. The method of the invention comprises (a) dissolving a copper (II) compound in the polar phase of a first reverse micelle or microemulsion, (b) dissolving a copper (II) to copper (I) reducing agent or a pseudohalide salt in the polar phase of a second sample of the same reverse micelle or microemulsion, (c) mixing the two reverse micelle/microemulsions samples to form nanometer sized copper (I) compounds and (d) recovering said nanometer sized copper (I) compounds. The present invention is also directed to the resultant nanosized copper (I) compounds, such as copper (I) chloride, copper (I) cyanide, and potassium cyanocuprate complexes having an average particle size of about 0.1 to 600 nanometers.
Abstract:
An article with an etch resistant coating is disclosed. The article is a heating element, wafer carrier, or electrostatic chuck. The article has a base substrate made of a ceramic or other material, and further has one or more electrodes for resistance heating or electromagnetic chucking or both. The eth resistant coating has a plurality of regions made from materials having different electrical volume resistivities, such that the overall coating has a bulk resistivity that can be tailored by varying the relative size of each region.
Abstract:
A composition is provided that may include a sulfur-functional linear polyorganosiloxane. The sulfur-functional linear polyorganosiloxane may include a chemically protected sulfur group. Under certain conditions, the sulfur group may react with an unsaturated elastomer. The invention may include embodiments that relate to method of making and using the sulfur-functional linear polyorganosiloxane.
Abstract:
A method may produce a resonant cavity light emitting device. A seed gallium nitride crystal and a source material in a nitrogen-containing superheated fluid may provide a medium for mass transport of gallium nitride precursors therebetween. A seed crystal surface may be prepared by applying a first thermal profile between the seed gallium nitride crystal and the source material. Gallium nitride material may be grown on the prepared surface of the seed gallium nitride crystal by applying a second thermal profile between the seed gallium nitride crystal and the source material while the seed gallium nitride crystal and the source material are in the nitrogen-containing superheated fluid. A stack of group III-nitride layers may be deposited on the single-crystal gallium nitride substrate. The stack may include a first mirror sub-stack and an active region adaptable for fabrication into one or more resonant cavity light emitting devices.
Abstract:
The present invention provides for a mixture comprising a siloxane having the formula: M1DM2 wherein M1=(R1)(R2)(R3)SiO1/2; M2=(R4)(R5)(R6)SiO1/2 and D=(R7)(Z)SiO2/2 where R1, R2, R3 R4, R5, R6 and R7 are each independently selected from the group consisting of 1 to 4 carbon monovalent hydrocarbon radicals, aryl, and a hydrocarbon group of 4 to 9 carbons containing an aryl group; Z is a pendant hydrophilic ionic group selected from the group consisting of R8-RA, R9-RC, and R10-RZ; RA being an anionic substituent, RC a cationic substituent or RZ a zwitterionic substituent on the D group and an additional component selected from the group consisting of agricultural components, coating components, personal care components, home care components, oil or gas treating components, water processing components, and pulp or paper treating components, wherein said mixture has an enhanced resistance to hydrolysis.
Abstract:
A hydrido-silicone resin is incompletely reacted with an olefin under hydrosilylation conditions to produce a partially substituted hydrido-silicone that is further reacted under hydrosilylation conditions with a vinyl containing silicone to consume the remaining hydride species to produce a composition that is useful as an anti-mist agent in the coating of flexible supports.
Abstract:
A curable composition comprising a hydrolysable silyl-containing polymer and a silicone-containing paint adhesion additive that provide curable silyl-containing polymer composition which has improved adhesion of coatings, paints, adhesives, and other surface treatments thereto.
Abstract:
A moisture-curable, graft-modified resin composition includes at least one thermoplastic polymer (i) and at least one silyl group containing polymer (ii) possessing at least one hydrolyzable silyl group that is bonded to the polymer through a linking group containing at least one heteroatom selected from the group consisting of oxygen and nitrogen, each of polymers (i) and (ii) having grafted thereto at least one same or different silane (iii) which, prior to being grafted, possesses at least one reactive carbon-carbon unsaturated bond.
Abstract:
A process for preparing a rubber composition comprises: (a) forming a mixture of: (i) at least one thiocarboxyl-functional hydrolyzable silane, (ii) at least one rubber containing carbon-carbon double bonds, (iii) at least one silane-reactive filler, (iv) at least one activating agent, and (v) water; (b) mixing the composition formed in step (a) under reactive-mechanical-working conditions and in the absence of vulcanizing agent(s); (c) adding at least one vulcanizing agent (vi) to the composition of step (b); (d) mixing the composition of step (c) under non-reactive-mechanical-working conditions; and, (e) optionally, curing the rubber composition of step (d).
Abstract:
A wafer processing apparatus is fabricated by depositing a film electrode onto the surface of a base substrate, the structure is then overcoated with a protective coating film layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof. The film electrode has a coefficient of thermal expansion (CTE) that closely matches the CTE of the underlying base substrate layer as well as the CTE of the protective coating layer.