Abstract:
A method of fabricating an integrated circuit with less susceptibility to gate-edge fringing field effect is disclosed. The transistor includes a low-k dielectric spacer and a high-k gate dielectric. The high-k gate dielectric can be tantalum pentaoxide or titanium dioxide. The process can be utilized for P-channel or N-channel metal oxide field semiconductor effect transistors (MOSFETs).
Abstract:
A method for making a ULSI MOSFET chip includes forming transistor gates on a substrate. The gates are formed by depositing a polysilicon layer on the substrate, implanting germanium into the polysilicon layer at a comparatively low dose, and then oxidizing the doped polysilicon layer. Under the influence of the oxidation, the germanium is repelled from an upper sacrificial region of the polysilicon layer into a lower gate region of the polysilicon layer, thereby increasing the germanium concentration in the lower gate region. The sacrificial region is then etched away and an undoped polysilicon film deposited on the gate region. Subsequently, the gate region with undoped polysilicon film is patterned to establish a MOSFET gate, with the substrate then being appropriately processed to establish MOSFET source/drain regions.
Abstract:
An ultra-large-scale integrated (ULSI) circuit includes MOSFETs which have different threshold voltages and yet have the same channel characteristics. The MOSFETs include gate structures with a polysilicon material. The polysilicon material is implanted with lower concentrations of germanium where lower threshold voltage MOSFETs are required. Over a range of 0-60% concentration of germanium, the threshold voltage can be varied by roughly 240 mV. A damascene process can be utilized to fabricate the MOSFETs.
Abstract:
A method of forming a dielectric gate insulator in a transistor is disclosed herein. The method includes depositing a layer of material over a semiconductor structure; depositing a covering layer over the layer of material; selectively creating an aperture in the covering layer, wherein an area of the layer of material is exposed; providing thermal oxidation to the exposed area of the layer of material to produce an oxidized area; providing a gate over the oxidized area; and removing the covering layer.
Abstract:
A thin filmed fully-depleted silicon-on-insulator (SOI) metal oxide semiconductor field defect transistor (MOSFET) utilizes a local insulation structure. The local insulative structure includes a buried silicon dioxide region under the channel region. The MOSFET body thickness is very small and yet silicon available outside of the channel region and buried silicon dioxide region is available for sufficient depths of silicide in the source and drain regions. The buried silicon dioxide region can be formed by a trench isolation technique or a LOCOS technique.
Abstract:
A method of fabricating an integrated circuit with ultra-shallow source/drain junctions utilizes a dummy or sacrificial gate structure. Dopants are provided through the openings associated with sacrificial spacers to form the source and drain extensions. The openings can be filled with spacers The process can be utilized for P-channel or N-channel metal oxide field semiconductor effect transistors (MOSFETS).
Abstract:
A punch-through diode transient suppression device has a base region of varying doping concentration to improve leakage and clamping characteristics. The punch-through diode includes a first region comprising an n+ region, a second region comprising a p- region abutting the first region, a third region comprising a p+ region abutting the second region, and a fourth region comprising an n+ region abutting the third region. The peak dopant concentration of the n+ layers should be about 1.5E18 cm.sup.-3, the peak dopant concentration of the p+ layer should be between about 1 to about 5 times the peak concentration of the n+ layer, and the dopant concentration of the p- layer should be between about 0.5E14 cm.sup.-3 and about 1.0E17 cm.sup.-3. The junction depth of the fourth (n+) region should be greater than about 0.3 um. The thickness of the third (p+) region should be between about 0.3 um and about 2.0 um, and the thickness of the second (p-) region should be between about 0.5 um and about 5.0 um.
Abstract:
The present disclosure provides a method for reducing the transmission power of an uplink signal, comprising: performing, by a User Equipment (UE), Component Carrier (CC) grouping on configured uplink CCs; and comparing correspondingly the transmission power of an uplink signal in each CC group with a maximum transmission power configured for the each CC group by an evolved Node B (eNB), and performing a power reduction within the CC group when the comparison result meets an intra-group power reduction condition; and/or comparing the sum of transmission powers of uplink signals in all CC groups with a maximum transmission power configured for the UE by the eNB, when the comparison result meets an inter-group power reduction condition, performing a power reduction between the CC groups. The present disclosure further provides a device for reducing the transmission power of an uplink signal. The technical solution of the present disclosure can improve the covering capability and reliability of the uplink signal in an Inter-band CA scenario, and to improve a utilization rate of a UE's uplink transmission power.
Abstract:
A method for transmitting feedback information and a user equipment are disclosed in the present document, wherein, one method includes: a User Equipment (UE) performing time domain extension on feedback information within one subframe; and mapping respectively data which go through the time domain extension and demodulation reference signals corresponding to the data which go through the time domain extension to multiple uplink Single Carrier-Frequency Division Multiple Access (SC-FDMA) symbols within the subframe, and transmitting the data which go through the time domain extension and the demodulation reference signals corresponding to the data which go through the time domain extension in the same frequency domain position in a way of time division multiplexing; wherein, each uplink SC-FDMA symbol occupies n successive physical resource blocks in the frequency domain, and n is a positive integer.
Abstract:
The disclosure discloses a method and terminal for transmitting uplink control information. The method includes: coding the uplink control information required to be transmitted and data information corresponding to one or two transport blocks respectively, obtaining an encoded sequence according to a target length, and forming a corresponding coded modulation sequence from the encoded sequence according to a modulation mode (401); interleaving the obtained coded modulation sequence, and transmitting the interleaved coded modulation sequence on a layer corresponding to a Physical Uplink Shared Channel (PUSCH) (402). By adopting the method and terminal according to the disclosure the transmission of uplink control information with greater bits on the PUSCH is realized. The disclosure also provides a method for determining a number of code symbols required in each layer when transmitting uplink control information on the PUSCH, thus the purpose of determining a number of code symbols required in each layer when transmitting uplink control information on the PUSCH is realized.