公开(公告)号：US08283769B2

公开(公告)日：2012-10-09

申请号：US12903734

申请日：2010-10-13

Applicant: Craig J. Rotay ,  John Ni ,  David Lam ,  David Lee DeWire ,  John W. Roman ,  Richard J. Ross

Inventor： Craig J. Rotay ,  John Ni ,  David Lam ,  David Lee DeWire ,  John W. Roman ,  Richard J. Ross

IPC: H01L21/00

CPC classification number: H01L23/562 ,  H01L23/66 ,  H01L25/115 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.

Abstract translation: 保护性模块化封装盖具有位于相对的第一和第二端处的第一和第二紧固部分，其中设置有一个或多个子组件接收部分并且构造成将保护性模块化封装盖紧固到芯部。 每个紧固部分具有位于紧固部分的底表面上并且构造成与芯部接触的脚表面，构造成接收紧固件的安装孔和扭矩元件。 每个子组件接收部分构造成接收子组件并且具有沿着保护性模块化封装盖的下侧形成的横向构件。 第一扭矩元件的激活通过一个或多个子组件接收部分中的每一个的横向构件将在紧固元件处产生的向下夹持力传递到设置在一个或多个子组件接收部分中的一个或多个子组件的顶表面。

公开(公告)号：US08275144B2

公开(公告)日：2012-09-25

申请号：US11692184

申请日：2007-03-27

Applicant: Oleg Logvinov ,  Brion John Ebert

Inventor： Oleg Logvinov ,  Brion John Ebert

IPC: H04B3/00 ,  G05B11/01

CPC classification number: H04B3/54 ,  H04B2203/5408 ,  H04B2203/5445 ,  H04B2203/545 ,  H04B2203/5454 ,  H04R27/00 ,  H04R2227/003

Abstract: An intelligent audio speaker that uses a power line communication element to provide audio distribution within homes, businesses, apartment complexes, and other buildings. Multiple intelligent audio speakers may be networked together, with common control. The intelligent audio speaker may, in some embodiments of the present invention, contain enhanced ambient backlight effects to further enhance the listener's experience. In some embodiments of the present invention, an existing audio speaker is retrofitted to an intelligent audio speaker using a retrofit kit.

Abstract translation: 一个智能音频扬声器，使用电力线通信元件在家庭，企业，公寓大楼和其他建筑物内提供音频分配。 多个智能音频扬声器可以联网在一起，具有共同的控制。 在本发明的一些实施例中，智能音频扬声器可以包含增强的环境背光效应，以进一步增强听众的体验。 在本发明的一些实施例中，使用改装套件将现有音频扬声器改装到智能音频扬声器。

公开(公告)号：US08259760B2

公开(公告)日：2012-09-04

申请号：US11395001

申请日：2006-03-31

Applicant: Michele Chiabrera

Inventor： Michele Chiabrera

IPC: H04J3/02

CPC classification number: H04L25/14 ,  H04L12/413 ,  H04L25/4908

Abstract: A method includes receiving first encoded data associated with one or more first lanes and decoding the first encoded data to produce decoded data. The method also includes encoding the decoded data to produce second encoded data associated with one or more second lanes and transmitting the second encoded data. In some embodiments, the method may further include multiplexing a plurality of code group sequences (the second encoded data) into the one or more second lanes, and the number of first lanes may be greater than the number of second lanes. In other embodiments, the method may also include demultiplexing a plurality of code group sequences from the one or more first lanes into a plurality of the second lanes, and the number of first lanes may be less than the number of second lanes.

Abstract translation: 一种方法包括接收与一个或多个第一通道相关联的第一编码数据并对第一编码数据进行解码以产生解码数据。 该方法还包括编码解码数据以产生与一个或多个第二通道相关联的第二编码数据并发送第二编码数据。 在一些实施例中，该方法还可以包括将多个码组序列（第二编码数据）复用到一个或多个第二车道中，并且第一车道的数量可以大于第二车道的数量。 在其他实施例中，该方法还可以包括将多个代码组序列从一个或多个第一通道解复用到多个第二通道中，并且第一通道的数量可以小于第二通道的数量。

公开(公告)号：US08237229B2

公开(公告)日：2012-08-07

申请号：US12125852

申请日：2008-05-22

Applicant: Prasanna Khare

Inventor： Prasanna Khare

IPC: H01L27/06

CPC classification number: H01L21/8249 ,  H01L27/0623

Abstract: Methods and apparatus of integrating a buried-channel PMOS into a BiCMOS process. The apparatus comprises at least one bipolar transistor and at least one MOS device coupled to the at least one bipolar transistor, such that a gate of the at least one MOS device may be coupled to an emitter of the at least one bipolar transistor. The MOS device comprises a buried channel having mobility means, such as strained silicon for promoting hole mobility in the buried channel, and confinement means, such as a cap layer disposed proximate to the buried channel for limiting leakage of holes from the buried channel. The apparatus may be formed by exposing a substrate in a PMOS, forming a SiGe layer on the substrate, forming an oxide layer on the SiGe layer, masking the PMOS, and removing at least some of the oxide and at least some of the SiGe layer.

Abstract translation: 将掩埋沟道PMOS集成到BiCMOS工艺中的方法和装置。 该装置包括至少一个双极晶体管和耦合到至少一个双极晶体管的至少一个MOS器件，使得至少一个MOS器件的栅极可以耦合到至少一个双极晶体管的发射极。 MOS器件包括具有移动性装置的掩埋沟道，例如用于促进掩埋沟道中的空穴迁移率的应变硅，以及限制装置，例如靠近掩埋沟道布置的盖层，用于限制孔从掩埋沟道泄漏。 该装置可以通过在PMOS中暴露衬底而形成，在衬底上形成SiGe层，在SiGe层上形成氧化物层，掩蔽PMOS，以及除去至少一些氧化物和至少一些SiGe层 。

公开(公告)号：US20120170475A1

公开(公告)日：2012-07-05

申请号：US13014181

申请日：2011-01-26

Applicant: Steven SREBRANIG

Inventor： Steven SREBRANIG

IPC: H04L12/28 ,  H04L12/26

CPC classification number: H04L47/824 ,  H04L47/525 ,  H04W72/0453

Abstract: A system and method for optimal allocation of bandwidth in a multichannel transmission channel. In an embodiment, a system may allocate a specific amount of bandwidth in the transmission channel in order to maximize the value of the data that is transmitted on a per-channel basis. Typically, a transmission channel has enough bandwidth to accommodate the minimum bandwidth for all data across all channels. The excess bandwidth may be allocated in an optimal manner so as to provide additional bandwidth for the most valuable channels. The maximum allocation of bandwidth is a point in which allocating additional bandwidth to a channel does not yield any additional value. Such an allocation may be accomplished using an iterative analysis of the available bandwidth and a microeconomic-based analysis of the subjective value of each channel.

Abstract translation: 一种用于在多信道传输信道中最佳分配带宽的系统和方法。 在一个实施例中，系统可以在传输信道中分配特定量的带宽，以便最大化在每个信道的基础上发送的数据的值。 通常，传输信道具有足够的带宽以适应所有信道上的所有数据的最小带宽。 可以以最佳方式分配超额带宽，以便为最有价值的信道提供额外的带宽。 带宽的最大分配是向频道分配附加带宽不产生任何附加值的点。 可以使用可用带宽的迭代分析和对每个信道的主观价值的基于微观经济的分析来实现这种分配。

公开(公告)号：US20120168920A1

公开(公告)日：2012-07-05

申请号：US12982743

申请日：2010-12-30

Applicant: Jerry Tan ,  William Cabreros

Inventor： Jerry Tan ,  William Cabreros

IPC: H01L23/495 ,  H01L21/64 ,  H01L21/60

CPC classification number: H01L23/49575 ,  H01L21/4828 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and bond pads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and bond pads, back surfaces of which remain exposed at a back face of the body. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of bond pads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract translation: 无引线半导体封装包括在引线框上的封装体，其包括管芯焊盘和多个接合焊盘，其中没有一个延伸到主体的侧面。 在包装的制造期间，将模塑料沉积在引线框的面上，在其上定位有管芯焊盘和焊盘。 在模塑料固化之后，对引线框架的背面进行蚀刻以隔离模板和粘结垫，焊盘的背面在主体的背面保持暴露。 在引线框的制造期间，蚀刻母基板以限定管芯焊盘和在衬底的一侧上的多个接合焊盘和在相对的面上的多个空腔。

公开(公告)号：US20120164792A1

公开(公告)日：2012-06-28

申请号：US13406697

申请日：2012-02-28

Applicant: Craig J. Rotay

Inventor： Craig J. Rotay

IPC: H01L21/98

CPC classification number: H01L25/115 ,  H01L23/047 ,  H01L23/32 ,  H01L23/562 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of manufacturing a modular semiconductor subassembly: providing at least one semiconductor subassembly having a modular sidewall element of modular dimensions and a semiconductor substrate base element coupled to the modular sidewall element that has at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element. If a modular package protective cover is to be used: providing the modular package protective cover configured to accommodate the semiconductor subassembly in accordance with a modular design; securing the semiconductor subassembly in the modular package protective cover to create a modular package assembly; and mounting the modular package assembly to a core, with a base side of the semiconductor substrate base element in contact with the core; otherwise: mounting the at semiconductor subassembly to the core, with the base side of the semiconductor substrate base element in contact with the core.

Abstract translation: 一种制造模块化半导体子组件的方法：提供具有模块化尺寸的模块化侧壁元件的至少一个半导体子组件和耦合到所述模块化侧壁元件的半导体衬底基座元件，所述半导体衬底基座元件具有至少一个半导体元件，所述半导体元件的尺寸设计成由 模块化侧壁元件的模块化尺寸。 如果要使用模块化封装保护盖：提供模块化封装保护盖，其配置为根据模块化设计容纳半导体子组件; 将半导体子组件固定在模块化封装保护盖中以产生模块化封装组件; 以及将所述模块化封装组件安装到芯部，所述半导体衬底基底元件的基极侧与所述芯体接触; 否则：将半导体子组件安装到芯部，半导体衬底基底元件的基极侧与芯体接触。

公开(公告)号：US20120163264A1

公开(公告)日：2012-06-28

申请号：US13335590

申请日：2011-12-22

Applicant: Liwen Chu ,  George A. Vlantis

Inventor： Liwen Chu ,  George A. Vlantis

IPC: H04W28/00 ,  H04W52/02

CPC classification number: H04W52/0222 ,  H04L29/1232 ,  H04L29/12839 ,  H04L61/2092 ,  H04L61/6022 ,  H04W8/26 ,  H04W12/06 ,  H04W52/0216 ,  H04W74/006 ,  H04W74/08 ,  H04W76/14 ,  H04W84/12 ,  Y02D70/142

Abstract: Multiple virtual MAC addresses may be added to WGA devices that may have different traffic streams to another device that requires different services, thus creating distinct MAC and device level implications. Beamforming training can be done at the device level for all virtual MAC addresses. Wakeup, doze, and ATIM power save can be done at the device level depending on the frames received. Authentication, deauthentication, association, and deassociation can be done variously at both levels. Further MSDUs can be aggregated for the multiple MAC addresses.

Abstract translation: 可以向可能具有不同业务流的WGA设备添加多个虚拟MAC地址到另一个需要不同服务的设备，从而产生不同的MAC和设备级别的含义。 波束形成训练可以在所有虚拟MAC地址的设备级进行。 唤醒，打盹和ATIM节电可以根据所接收的帧在设备级进行。 认证，认证，关联和关联可以在两个层次上进行。 可以针对多个MAC地址聚合其他MSDU。

公开(公告)号：US20120162506A1

公开(公告)日：2012-06-28

申请号：US12979103

申请日：2010-12-27

Applicant: Anatoliy Vasilevich Tsyrganovich

Inventor： Anatoliy Vasilevich Tsyrganovich

IPC: H04N7/01

CPC classification number: H04N7/014

Abstract: One or more digital video frames are interpolated using motion compensated temporal interpolation (MCTI). The quality of motion vectors corresponding to object motion between the two adjacent second video frames is detected. An average of forward motion vectors and an average of backward motion vectors representing motion of the object are compared by calculating the absolute value difference of the averaged forward and backward motion vectors to detect the quality of the motion vectors and a control signal is generated corresponding to the detected quality. Customized Image segmentation based on a first mode of image processing, a second mode of image processing or a combination of the first and second modes of image processing is then performed based on the detected accuracy to generate the interpolated frame.

Abstract translation: 使用运动补偿时间插值（MCTI）对一个或多个数字视频帧进行内插。 检测与两个相邻的第二视频帧之间的对象运动相对应的运动矢量的质量。 通过计算平均的前向和后向运动矢量的绝对值差来检测运动矢量的质量来比较平均的向前运动矢量和表示物体的运动的反向运动矢量的平均值，并且生成对应于 检测质量。 然后基于检测的精度执行基于图像处理的第一模式，图像处理的第二模式或第一和第二模式的图像处理的组合的定制图像分割，以生成内插帧。

公开(公告)号：US20120158166A1

公开(公告)日：2012-06-21

申请号：US13406722

申请日：2012-02-28

Applicant: Craig J. Rotay

Inventor： Craig J. Rotay

IPC: G06F17/50

CPC classification number: H01L25/115 ,  H01L23/32 ,  H01L23/562 ,  H01L23/66 ,  H01L25/105 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of designing a desired modular assembly: determining a package outline of a modular package assembly; determining seating plane and overall package length characteristics; calculating minimum package height of the modular package assembly; designing the dimensions and the configuration of semiconductor subassemblies by receiving semiconductor subassembly user input design data at the design tool, each semiconductor subassembly of the one or more semiconductor subassemblies comprising a modular sidewall element and a semiconductor substrate base element coupled to the modular sidewall element, the semiconductor substrate base element having at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element and the semiconductor substrate base element configured to form a base of the semiconductor subassembly; and incorporating the configuration and dimensions of the modular package assembly and the one or more semiconductor subassemblies into a manufacturing assembly process.

Abstract translation: 一种设计所需模块化组件的方法：确定模块化封装组件的封装外形; 确定座面和整体包装长度特征; 计算模块化包装组件的最小包装高度; 通过在设计工具处接收半导体子组件用户输入设计数据来设计半导体子组件的尺寸和配置，所述一个或多个半导体子组件的每个半导体子组件包括耦合到模块化侧壁元件的模块化侧壁元件和半导体衬底基座元件， 所述半导体衬底基底元件具有至少一个半导体元件，所述半导体元件的尺寸设计成由所述模块化侧壁元件和所述半导体衬底基底元件的模块化尺寸来容纳，所述半导体元件配置成形成所述半导体子组件的 并将模块化封装组件和一个或多个半导体子组件的结构和尺寸结合到制造组装过程中。