公开(公告)号：US20110241054A1

公开(公告)日：2011-10-06

申请号：US13159846

申请日：2011-06-14

Applicant: Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

Inventor： Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

IPC: H01L33/62 ,  H01L33/50

CPC classification number: H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Abstract translation: 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US20110108866A1

公开(公告)日：2011-05-12

申请号：US12746447

申请日：2008-12-02

Applicant: Chung Hoon Lee ,  Yoon Hee Kim ,  Byung Yeol Park ,  Bang Hyun Kim ,  Eun Jung Seo ,  Hyouk Won Kwon

Inventor： Chung Hoon Lee ,  Yoon Hee Kim ,  Byung Yeol Park ,  Bang Hyun Kim ,  Eun Jung Seo ,  Hyouk Won Kwon

IPC: H01L33/52 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2933/005 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package is disclosed herein. The disclosed LED package comprises a base having an LED chip mounted thereon, an encapsulation member formed by a light-transmittable resin to encapsulate the LED chip, and a housing formed to expose a top portion of the encapsulation member and to encompass a side surface of the encapsulation member, wherein the encapsulation member is formed by a transfer molding process using a mold to have a predetermined shape. Further, the housing may be light-transmittable.

Abstract translation: 本文公开了LED封装。 所公开的LED封装包括其上安装有LED芯片的基座，由可透光树脂形成以封装LED芯片的封装构件，以及形成为暴露封装构件的顶部部分并且包围侧壁表面的壳体 封装件，其中通过使用模具的传递模制工艺形成封装件以具有预定形状。 此外，壳体可以是可透光的。

公开(公告)号：US20110050090A1

公开(公告)日：2011-03-03

申请号：US12767253

申请日：2010-04-26

Applicant: Chung Hoon LEE ,  Walter Tews ,  Gundula Roth ,  Detlef Starick

Inventor： Chung Hoon LEE ,  Walter Tews ,  Gundula Roth ,  Detlef Starick

IPC: H01J1/63

CPC classification number: C09K11/7792 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19107 ,  H05B33/14 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting device having oxyorthosilicate luminophores is disclosed. The light emitting device includes a light emitting diode and luminescent substances disposed around the light emitting diode, to adsorb at least a portion of light emitted from the light emitting diode and emitting light having different wavelength from that of the absorbed light. The luminescent substances have Eu2+-doped silicate luminophores in which solid solutions in the form of mixed phases between alkaline earth metal oxyorthosilicates and rare earth metal oxyorthosilicates are used as base lattices for the Eu2+ activation leading to luminescence. The luminescent substances are used as radiation converters to convert a higher-energy primary radiation, for example, ultra violet (UV) radiation or blue light, into a longer-wave visible radiation and are therefore preferably employed in corresponding light-emitting devices.

Abstract translation: 公开了一种具有氧硅酸发光体的发光器件。 发光器件包括发光二极管和布置在发光二极管周围的发光物质，以吸附从发光二极管发射的光的至少一部分，并发射具有不同波长的光，其吸收光的波长不同。 发光物质具有Eu 2+掺杂的硅酸盐发光体，其中使用碱土金属氧化硅酸钙和稀土金属氧化硅酸盐之间的混合相形式的固溶体作为导致发光的Eu 2+激活的基质晶格。 发光物质用作辐射转换器以将较高能量的一次辐射（例如紫外线（UV）辐射或蓝光）转换成更长波的可见光，因此优选地应用于相应的发光器件中。

公开(公告)号：US20110031891A1

公开(公告)日：2011-02-10

申请号：US12908692

申请日：2010-10-20

Applicant: Chung Hoon LEE ,  James S. SPECK ,  Hong San KIM ,  Jae Jo KIM ,  Sung Han KIM ,  Jae Ho LEE

Inventor： Chung Hoon LEE ,  James S. SPECK ,  Hong San KIM ,  Jae Jo KIM ,  Sung Han KIM ,  Jae Ho LEE

IPC: H05B41/16

CPC classification number: H05B33/0827 ,  H01L27/153 ,  H01L27/156 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05B33/02 ,  H05B33/08 ,  H05B33/0806 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0824 ,  H05B33/083 ,  H05B33/0848 ,  H05B37/029

Abstract: Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor. Further, there is provided an AC light-emitting device, wherein a plurality of arrays having the different numbers of light emitting cells are employed to increase light emission time and to reduce a flicker effect.

Abstract translation: 公开了一种用于AC电力操作的改进的发光装置。 传统的发光器件采用具有反向并联连接的发光单元阵列的交流发光二极管。 现有技术中的阵列响应于AC电源的相变而交替重复开/关，导致在1/2周期期间的短发光时间和闪烁效应的发生。 根据本发明的交流发光装置采用各种手段，响应于​​交流电源的相变而在1/2周期期间发光时间延长，并且可以减少闪烁效应。 例如，装置可以是分别连接到发光单元，连接到多个阵列的切换块或延迟荧光体之间的节点的切换块。 此外，提供了一种交流发光装置，其中采用具有不同数量的发光单元的多个阵列来增加发光时间并减少闪烁效果。

公开(公告)号：US07880183B2

公开(公告)日：2011-02-01

申请号：US12774525

申请日：2010-05-05

Applicant: Chung Hoon Lee ,  Hong San Kim ,  James S. Speck

Inventor： Chung Hoon Lee ,  Hong San Kim ,  James S. Speck

IPC: H01L33/00

CPC classification number: H01L27/153 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48095 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01079

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells.

Abstract translation: 公开了具有多个发光单元的发光器件。 发光器件包括具有高于蓝宝石衬底的热导率的导热衬底，例如SiC衬底。 多个发光单元串联连接在导热基板上。 同时，在导热基板和发光单元之间插入半绝缘缓冲层。 例如，半绝缘缓冲层可以由AlN或半绝缘GaN形成。 由于采用具有高于蓝宝石基板的导热性的导热性基板，所以与以往的蓝宝石基板相比，能够提高散热性能，从而能够增大驱动下的发光元件的最大光输出 高压交流电源。 此外，由于采用了半绝缘缓冲层，因此可以防止通过导热基板和发光单元之间的漏电流的增加。

公开(公告)号：US20100327229A1

公开(公告)日：2010-12-30

申请号：US12773514

申请日：2010-05-04

Applicant: Chung Hoon LEE ,  Walter Tews ,  Gundula Roth ,  Detlef Starick

Inventor： Chung Hoon LEE ,  Walter Tews ,  Gundula Roth ,  Detlef Starick

IPC: C09K11/77 ,  C09K11/54

CPC classification number: C09K11/7792 ,  H05B33/14 ,  Y02B20/181

Abstract: Exemplary embodiments of the present invention disclose inorganic luminescent substances with Eu2+-doped silicate luminophores, in which solid solutions in the form of mixed phases between alkaline earth metal oxyorthosilicates and rare earth metal oxyorthosilicates are used as base lattices for the Eu2+ activation leading to the luminescence. These luminophores are described by the general formula (1-x) MII3SiO5.xSE2SiO5:Eu, in which MII preferably represents strontium ion or another alkaline earth metal ion, or another divalent metal ion selected from the group consisting of the magnesium, calcium, barium, copper, zinc, and manganese. These ions may be used in addition to strontium and also as mixtures with one another.

Abstract translation: 本发明的示例性实施方案公开了具有Eu 2+掺杂的硅酸盐发光体的无机发光物质，其中使用碱土金属氧化硅酸钙和稀土金属氧化硅酸盐之间的混合相形式的固溶体作为用于Eu 2+活化的基底晶格，导致发光 。 这些发光体由通式（1-x）MII3SiO5.xSE2SiO5：Eu表示，其中MII优选表示锶离子或另一碱土金属离子，或另外选自镁，钙，钡的二价金属离子 ，铜，锌和锰。 这些离子除了锶之外还可以彼此混合使用。

公开(公告)号：US20100277084A1

公开(公告)日：2010-11-04

申请号：US12837805

申请日：2010-07-16

Applicant: Chung Hoon LEE ,  James S. Speck ,  Hong San Kim ,  Jae Jo Kim ,  Sung Han Kim ,  Jae Ho Lee

Inventor： Chung Hoon LEE ,  James S. Speck ,  Hong San Kim ,  Jae Jo Kim ,  Sung Han Kim ,  Jae Ho Lee

IPC: H05B37/00

CPC classification number: H05B33/0827 ,  H01L27/153 ,  H01L27/156 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05B33/02 ,  H05B33/08 ,  H05B33/0806 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0824 ,  H05B33/083 ,  H05B33/0848 ,  H05B37/029

Abstract: Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor. Further, there is provided an AC light-emitting device, wherein a plurality of arrays having the different numbers of light emitting cells are employed to increase light emission time and to reduce a flicker effect.

Abstract translation: 公开了一种用于AC电力操作的改进的发光装置。 传统的发光器件采用具有反向并联连接的发光单元阵列的交流发光二极管。 现有技术中的阵列响应于AC电源的相变而交替重复开/关，导致在1/2周期期间的短发光时间和闪烁效应的发生。 根据本发明的交流发光装置采用各种手段，响应于​​交流电源的相变而在1/2周期期间发光时间延长，并且可以减少闪烁效应。 例如，装置可以是分别连接到发光单元，连接到多个阵列的切换块或延迟荧光体之间的节点的切换块。 此外，提供了一种交流发光装置，其中采用具有不同数量的发光单元的多个阵列来增加发光时间并减少闪烁效果。

公开(公告)号：US07772601B2

公开(公告)日：2010-08-10

申请号：US11815255

申请日：2005-07-05

Applicant: Chung Hoon Lee ,  Hong San Kim ,  James S. Speck

Inventor： Chung Hoon Lee ,  Hong San Kim ,  James S. Speck

IPC: H01L33/00

CPC classification number: H01L27/153 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48095 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01079

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells.

Abstract translation: 公开了具有多个发光单元的发光器件。 发光器件包括具有高于蓝宝石衬底的热导率的导热衬底，例如SiC衬底。 多个发光单元串联连接在导热基板上。 同时，在导热基板和发光单元之间插入半绝缘缓冲层。 例如，半绝缘缓冲层可以由AlN或半绝缘GaN形成。 由于采用具有高于蓝宝石基板的导热性的导热性基板，所以与以往的蓝宝石基板相比，能够提高散热性能，从而能够增大驱动下的发光元件的最大光输出 高压交流电源。 此外，由于采用了半绝缘缓冲层，因此可以防止通过导热基板和发光单元之间的漏电流的增加。

公开(公告)号：US07737463B2

公开(公告)日：2010-06-15

申请号：US12196028

申请日：2008-08-21

Applicant: Chung Hoon Lee ,  Do Hyung Kim ,  Keon Young Lee

Inventor： Chung Hoon Lee ,  Do Hyung Kim ,  Keon Young Lee

IPC: H01L29/00 ,  H01L23/04 ,  H01L23/34

CPC classification number: H01L33/52 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals and a heat sink inserted into a heat sink support ring. At least portions of the pair of lead terminals and the heat sink are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.

Abstract translation: 公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子和插入散热器支撑环的散热器。 一对引线端子和散热片的至少一部分嵌入在封装主体中。 包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。 第一模塑树脂覆盖LED芯片。 具有比第一成型体硬度高的第二成型树脂覆盖第一成型树脂。 因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

公开(公告)号：US20090272971A1

公开(公告)日：2009-11-05

申请号：US12481998

申请日：2009-06-10

Applicant: Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/10 ,  H01L33/00 ,  H01L21/00 ,  H01L29/15

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。