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公开(公告)号：US07881578B2
公开(公告)日：2011-02-01
申请号：US12604295
申请日：2009-10-22
IPC分类号： G02B6/04 , G02B6/36 , G02B6/38 , G02B6/40 , G02B6/06 , H01R12/00 , H01R4/66 , H01R12/24 , H01R24/00 , H01R33/945 , C03B37/15
CPC分类号： H01R13/22 , H01R13/005 , H01R13/025 , H01R13/26
摘要： Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.
摘要翻译： 公开了用于超高密度连接的技术。 在一个实施例中，超高密度连接器包括大致平行的细长圆柱形元件束，其中每个圆柱形元件基本上与至少一个相邻的圆柱形元件接触。 细长圆柱形元件的端部相对于彼此差异地设置以限定三维交叉配合表面。 细长圆柱形元件中的至少一个具有定位成切向地接合配合连接器的相应电接触件的导电触点。
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22.发明申请公开(公告)号：US20100188492A1
公开(公告)日：2010-07-29
申请号：US12512188
申请日：2009-07-30
IPC分类号： H04N7/18
CPC分类号： A61B1/06 , A61B1/00188 , A61B1/05 , A61B1/051 , A61B1/0638 , A61B1/0676 , A61B1/0684 , G01N21/255
摘要： A method of imaging a target using a miniaturized imaging device is disclosed comprising providing a miniaturized imaging device having a stationary lens system and an imaging array, wherein the distance from a distal end of the stationary lens system to the imaging array is fixed. The miniaturized imaging device is advanced near the desired target and a distance from a distal end of the stationary lens system to the desired target is determined. A desired wavelength of light is calculated based on the determined distance from the distal end of the stationary lens system to the desired target and the desired wavelength of light is propagated onto the target.
摘要翻译： 公开了一种使用小型化成像装置对靶进行成像的方法，其包括提供具有固定透镜系统和成像阵列的小型化成像装置，其中固定透镜系统的远端与成像阵列的距离是固定的。 小型化成像装置在期望的目标附近进行，并且确定从静止透镜系统的远端到期望目标的距离。 基于从固定透镜系统的远端到期望的目标的确定的距离来计算期望的光波长，并且期望的光波长被传播到目标上。
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23.发明授权公开(公告)号：US07629659B2
公开(公告)日：2009-12-08
申请号：US12079741
申请日：2008-03-27
IPC分类号： H01L31/048
CPC分类号： A61B1/05 , H04N2005/2255
摘要： A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line. Alternatively, the adaptor can be a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path. The conductive path can be configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface, and the conductive line is electrically coupled to the conductive path at a second surface.
摘要翻译： 描述了一种小型化成像装置和观察小腔腔的方法。 成像装置可以用作导管的一部分，并且可以包括透镜，包括光学耦合到透镜的成像阵列的SSID; 包括导线的脐带; 以及被配置为支撑透镜并且提供SSID和导电线之间的电连通的适配器。 或者，适配器可以是被配置为通过导电路径在SSID和导线之间提供电连通的刚性适配器。 导电路径可以沿着适配器的多个相邻表面配置，使得SSID在第一表面处电耦合到导电路径，并且导电线在第二表面处电耦合到导电路径。
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公开(公告)号：US20080205829A1
公开(公告)日：2008-08-28
申请号：US12070580
申请日：2008-02-19
CPC分类号： H01R13/22 , H01R13/005 , H01R13/025 , H01R13/26
摘要： Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.
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25.发明申请公开(公告)号：US20080185672A1
公开(公告)日：2008-08-07
申请号：US12079741
申请日：2008-03-27
IPC分类号： H01L31/0232
CPC分类号： A61B1/05 , H04N2005/2255
摘要： A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line. Alternatively, the adaptor can be a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path. The conductive path can be configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface, and the conductive line is electrically coupled to the conductive path at a second surface.
摘要翻译： 描述了一种小型化成像装置和观察小腔腔的方法。 成像装置可以用作导管的一部分，并且可以包括透镜，包括光学耦合到透镜的成像阵列的SSID; 包括导线的脐带; 以及被配置为支撑透镜并且提供SSID和导电线之间的电连通的适配器。 或者，适配器可以是被配置为通过导电路径在SSID和导线之间提供电连通的刚性适配器。 导电路径可以沿着适配器的多个相邻表面配置，使得SSID在第一表面处电耦合到导电路径，并且导电线在第二表面处电耦合到导电路径。
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公开(公告)号：US20110310577A1
公开(公告)日：2011-12-22
申请号：US13213001
申请日：2011-08-18
IPC分类号： H05K1/02
CPC分类号： H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要： Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译： 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号：US20110251456A1
公开(公告)日：2011-10-13
申请号：US12896737
申请日：2010-10-01
IPC分类号： A61B1/04
CPC分类号： A61B1/042 , A61B1/00177 , A61B1/00179 , A61B1/00183 , A61B1/05 , A61B1/051
摘要： A method and apparatus to generate a planar representation of a longitudinally extending 360 degree continuous view within a body cavity of a patient is disclosed comprising advancing a portion of an imaging device into the body cavity of the patient, the imaging device having an image capture mechanism disposed on a distal end thereof configured to capture at least a 360 degree view of the inside of the body cavity. Further comprising withdrawing the imaging device at a controlled rate from the patient while simultaneously coordinating and generating 360 degree view image data from the imaging device and transmitting the image data from the imaging device to an image processor. The method further comprising processing the image data to produce a planar longitudinally continuous 360 degree view of the body cavity.
摘要翻译： 公开了一种用于在患者的体腔内产生纵向延伸的360度连续视图的平面表示的方法和装置，其包括使成像装置的一部分进入患者的体腔，所述成像装置具有图像捕获机构 设置在其远端构造成捕获体腔内部的至少360度视图。 还包括以受控的速率从患者撤回成像装置，同时从成像装置协调并产生360度视图图像数据，并将图像数据从成像装置传输到图像处理器。 该方法还包括处理图像数据以产生体腔的平面纵向连续360度视图。
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公开(公告)号：US08026447B2
公开(公告)日：2011-09-27
申请号：US12615202
申请日：2009-11-09
CPC分类号： H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要： Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译： 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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29.发明申请Miniaturized Imaging Device Including Multiple GRIN Lenses Optically Coupled to Multiple SSIDs 审中-公开包含多个GRIN镜头的微型成像设备光耦合到多个SSID公开(公告)号：US20090326321A1
公开(公告)日：2009-12-31
申请号：US12487481
申请日：2009-06-18
IPC分类号： A61B1/05
CPC分类号： A61B1/041 , A61B1/00177 , A61B1/00179 , A61B1/00181 , A61B1/00188 , A61B1/051 , A61B5/6851 , A61B2562/0233 , A61B2562/043 , A61B2562/046
摘要： A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include at least one solid state imaging device (SSID) including multiple imaging arrays respectively, and multiple graduated refractive index (GRIN) lenses optically coupled to the multiple imaging arrays.
摘要翻译： 描述了一种小型化成像装置和观察小腔腔的方法。 成像装置可以用作导管的一部分，并且可以包括分别包括多个成像阵列的至少一个固态成像装置（SSID）和与多个成像阵列光学耦合的多个刻度折射率（GRIN）透镜。
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公开(公告)号：US07626123B2
公开(公告)日：2009-12-01
申请号：US11637380
申请日：2006-12-11
CPC分类号： H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要： Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译： 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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