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公开(公告)号:US20160143157A1
公开(公告)日:2016-05-19
申请号:US15004395
申请日:2016-01-22
发明人: Yi-Li Hsiao , Su-Chun Yang , Chih-Hang Tung , Da-Yuan Shih , Chen-Hua Yu
IPC分类号: H05K3/42
CPC分类号: H05K3/422 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/43 , H01L24/45 , H01L24/742 , H01L24/745 , H01L2224/0401 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13016 , H01L2224/13147 , H01L2224/13562 , H01L2224/13578 , H01L2224/13644 , H01L2224/13655 , H01L2224/43125 , H01L2224/45147 , H01L2224/4556 , H01L2224/45578 , H01L2224/45644 , H01L2224/45655 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/742 , H01L2224/745 , H05K3/4015 , H05K2201/10318 , Y10T29/49208 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , Y10T29/49222 , Y10T29/49149
摘要: A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
摘要翻译: 一种方法包括形成多个金属柱。 多个金属柱相互连接以通过在多个金属柱中的相邻金属柱之间的弱部分形成金属柱。 弱部包括与多个金属柱相同的金属。 多个金属柱中的每一个的大部分与多个金属柱中的相应的相邻的金属柱分离。 多个金属柱中的每一个的端部镀有金属。 多个金属柱设置在金属后储存器中。 该方法还包括从金属柱储存器中取出一个金属柱,并将金属柱中的一个接合在金属垫上。
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公开(公告)号:US08217269B2
公开(公告)日:2012-07-10
申请号:US13213001
申请日:2011-08-18
CPC分类号: H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝,其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘,以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝,以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号:US20100116869A1
公开(公告)日:2010-05-13
申请号:US12615202
申请日:2009-11-09
IPC分类号: B23K31/02
CPC分类号: H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝,其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘,以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝,以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号:US20110310577A1
公开(公告)日:2011-12-22
申请号:US13213001
申请日:2011-08-18
IPC分类号: H05K1/02
CPC分类号: H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝,其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘,以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝,以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号:US08026447B2
公开(公告)日:2011-09-27
申请号:US12615202
申请日:2009-11-09
CPC分类号: H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝,其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘,以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝,以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号:US07626123B2
公开(公告)日:2009-12-01
申请号:US11637380
申请日:2006-12-11
CPC分类号: H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝,其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘,以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝,以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号:US09263407B2
公开(公告)日:2016-02-16
申请号:US13926905
申请日:2013-06-25
发明人: Yi-Li Hsiao , Su-Chun Yang , Chih-Hang Tung , Da-Yuan Shih , Chen-Hua Yu
IPC分类号: H01R43/00 , H01L23/00 , H05K3/40 , H01L23/498
CPC分类号: H05K3/422 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/43 , H01L24/45 , H01L24/742 , H01L24/745 , H01L2224/0401 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13016 , H01L2224/13147 , H01L2224/13562 , H01L2224/13578 , H01L2224/13644 , H01L2224/13655 , H01L2224/43125 , H01L2224/45147 , H01L2224/4556 , H01L2224/45578 , H01L2224/45644 , H01L2224/45655 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/742 , H01L2224/745 , H05K3/4015 , H05K2201/10318 , Y10T29/49208 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , Y10T29/49222 , Y10T29/49149
摘要: A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
摘要翻译: 一种方法包括形成多个金属柱。 多个金属柱相互连接以通过在多个金属柱中的相邻金属柱之间的弱部分形成金属柱。 弱部包括与多个金属柱相同的金属。 多个金属柱中的每一个的大部分与多个金属柱中的相应的相邻的金属柱分离。 多个金属柱中的每一个的端部镀有金属。 多个金属柱设置在金属后储存器中。 该方法还包括从金属柱储存器中取出金属柱中的一个,并将金属柱中的一个接合在金属垫上。
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公开(公告)号:US20140262470A1
公开(公告)日:2014-09-18
申请号:US13926905
申请日:2013-06-25
发明人: Yi-Li Hsiao , Su-Chun Yang , Chih-Hang Tung , Da-Yuan Shih , Chen-Hua Yu
CPC分类号: H05K3/422 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/43 , H01L24/45 , H01L24/742 , H01L24/745 , H01L2224/0401 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13016 , H01L2224/13147 , H01L2224/13562 , H01L2224/13578 , H01L2224/13644 , H01L2224/13655 , H01L2224/43125 , H01L2224/45147 , H01L2224/4556 , H01L2224/45578 , H01L2224/45644 , H01L2224/45655 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/742 , H01L2224/745 , H05K3/4015 , H05K2201/10318 , Y10T29/49208 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , Y10T29/49222 , Y10T29/49149
摘要: A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
摘要翻译: 一种方法包括形成多个金属柱。 多个金属柱相互连接以通过在多个金属柱中的相邻金属柱之间的弱部分形成金属柱。 弱部包括与多个金属柱相同的金属。 多个金属柱中的每一个的大部分与多个金属柱中的相应的相邻的金属柱分离。 多个金属柱中的每一个的端部镀有金属。 多个金属柱设置在金属后储存器中。 该方法还包括从金属柱储存器中取出一个金属柱,并将金属柱中的一个接合在金属垫上。
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公开(公告)号:US20070132109A1
公开(公告)日:2007-06-14
申请号:US11637380
申请日:2006-12-11
申请人: Stephen Jacobsen , David Marceau , Shayne Zurn
发明人: Stephen Jacobsen , David Marceau , Shayne Zurn
IPC分类号: H01L23/52
CPC分类号: H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝,其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘,以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝,以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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