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公开(公告)号：US20100112865A1
公开(公告)日：2010-05-06
申请号：US12604295
申请日：2009-10-22
IPC分类号： H01R13/66
CPC分类号： H01R13/22 , H01R13/005 , H01R13/025 , H01R13/26
摘要： Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.
摘要翻译： 公开了用于超高密度连接的技术。 在一个实施例中，超高密度连接器包括大致平行的细长圆柱形元件束，其中每个圆柱形元件基本上与至少一个相邻的圆柱形元件接触。 细长圆柱形元件的端部相对于彼此差异地设置以限定三维交叉配合表面。 细长圆柱形元件中的至少一个具有定位成切向地接合配合连接器的相应电接触件的导电触点。
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公开(公告)号：US07603153B2
公开(公告)日：2009-10-13
申请号：US11637508
申请日：2006-12-11
CPC分类号： H01R11/18 , A61B5/04001 , A61B5/6868 , A61B5/6877 , A61N1/0529 , A61N1/0551 , H01R2201/12 , Y10T29/49117
摘要： A multi-element probe array suitable for sensing or stimulating is disclosed. In one embodiment, the multi-element probe array includes a plurality of microfibers extending longitudinally and oriented substantially parallel to form a bundle. Probe elements are defined by a first subset of the microfibers displaced in a forward direction alone the longitudinal axis relative to spacer elements defined by a second subset of the microfibers. Interface elements and communication elements are disposed on the probe elements.
摘要翻译： 公开了一种适用于感测或刺激的多元件探针阵列。 在一个实施例中，多元件探针阵列包括多个微纤维，其纵向延伸并且基本平行地定向以形成束。 探针元件由相对于由微纤维的第二子集限定的间隔元件的纵向轴线在向前方向上移位的微纤维的第一子集限定。 接口元件和通信元件设置在探针元件上。
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公开(公告)号：US20090180197A1
公开(公告)日：2009-07-16
申请号：US12008486
申请日：2008-01-11
IPC分类号： G02B3/00
CPC分类号： G02B21/0008 , A61B1/00188 , G02B3/0087 , G02B6/08 , G02B6/32 , G02B21/36 , G02B23/2407
摘要： A device for magnifying an object comprising an SSID having at least one imaging array disposed on a distal end thereof. The device further comprises a first optical element disposed on the distal end of the SSID wherein the first optical element has a distal end and a proximal end defining a first longitudinal length. A GRIN lens is disposed on the distal end of the first optical element and a second optical element is disposed on the distal end of the GRIN lens defining a second longitudinal length. The first longitudinal length and the second longitudinal length are configured such that when viewing the object at a predetermined wavelength of light, the object is magnified at a predetermined level of magnification and the focal plane of the magnified object is aligned at the proximal end of the first optical element.
摘要翻译： 一种用于放大对象的装置，包括具有设置在其远端上的至少一个成像阵列的SSID。 该装置还包括设置在SSID的远端上的第一光学元件，其中第一光学元件具有限定第一纵向长度的远端和近端。 GRIN透镜设置在第一光学元件的远端上，并且第二光学元件设置在限定第二纵向长度的GRIN透镜的远端上。 第一纵向长度和第二纵向长度被配置成使得当以预定波长的光线观察物体时，物体以预定的放大倍率放大，并且放大物体的焦平面在 第一光学元件。
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公开(公告)号：US08217269B2
公开(公告)日：2012-07-10
申请号：US13213001
申请日：2011-08-18
CPC分类号： H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要： Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译： 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号：US20110268914A1
公开(公告)日：2011-11-03
申请号：US13181380
申请日：2011-07-12
IPC分类号： B32B3/06
CPC分类号： A61M25/09 , A61M2025/09108 , Y10T29/49002 , Y10T29/49826 , Y10T428/24033
摘要： A method for manufacturing a complex structure from a two-dimensional layout, the method comprising: (a) obtaining a support plate having a pre-determined, patterned recess formed in a surface thereof; (b) depositing a first series of individual flexible interconnects into the recess, the flexible interconnects being aligned parallel to one another in a common plane and supported by the support plate; (c) adhering, with adhering means, at least one rigid member to each of the flexible interconnects of the first series; (d) adhering, with adhering means, a second series of individual flexible interconnects to the rigid members to form a plurality of stations, wherein each of the second series of flexible interconnects is adhered to two rigid members of adjacent flexible interconnects of the first series, the flexible interconnects of the second series being formed perpendicular to the flexible interconnects of the first series; (e) curing the adhering means to form an assembled, layered structure; (f) removing the layered structure from the support plate; and (g) folding, systematically, the layered structure on itself and causing at least some of the stations to be supported about a central spine in a segmented manner.
摘要翻译： 一种从二维布局制造复合结构的方法，所述方法包括：（a）获得在其表面形成有预定的图案化凹槽的支撑板; （b）将第一系列单独的柔性互连件沉积到所述凹部中，所述柔性互连件在公共平面中彼此平行对准并由所述支撑板支撑; （c）用粘合装置将至少一个刚性构件粘附到第一系列的每个柔性互连件; （d）以粘合方式将第二系列单独的柔性互连件粘附到所述刚性构件以形成多个工位，其中所述第二系列柔性互连件中的每一个粘附到所述第一系列的相邻柔性互连件的两个刚性构件 第二系列的柔性互连件垂直于第一系列的柔性互连件形成; （e）固化所述粘合装置以形成组装的层状结构; （f）从支撑板上移除层状结构; 并且（g）系统地折叠其自身上的分层结构，并使得至少一些站以分段的方式围绕中央脊柱被支撑。
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公开(公告)号：US20110242302A1
公开(公告)日：2011-10-06
申请号：US12896743
申请日：2010-10-01
CPC分类号： G02F1/133606 , A61B1/05 , A61B1/0676 , G02B5/0242 , G02B5/0247 , G02F1/133504 , G02F2001/133607 , H04N5/2251 , H04N5/2256
摘要： A light diffusing composition that optimizes image clarity from a SSID comprising a translucent matrix further comprising a plurality of hollow micro-particles. The plurality of hollow micro-particles are dispersed throughout the translucent matrix and a fluid is disposed within the hollow micro-particle. A refractive index of the fluid within the hollow micro-particle is different than a refractive index of the translucent matrix.
摘要翻译： 一种光漫射组合物，其从包含半透明基质的SSID优化图像透明度，还包括多个中空微粒。 多个中空微粒分散在整个半透明基质中，并且流体设置在中空微粒内。 中空微粒子内的流体的折射率与透光性基体的折射率不同。
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公开(公告)号：US07969659B2
公开(公告)日：2011-06-28
申请号：US12008486
申请日：2008-01-11
IPC分类号： G02B3/00
CPC分类号： G02B21/0008 , A61B1/00188 , G02B3/0087 , G02B6/08 , G02B6/32 , G02B21/36 , G02B23/2407
摘要： A device for magnifying an object comprising an SSID having at least one imaging array disposed on a distal end thereof. The device further comprises a first optical element disposed on the distal end of the SSID wherein the first optical element has a distal end and a proximal end defining a first longitudinal length. A GRIN lens is disposed on the distal end of the first optical element and a second optical element is disposed on the distal end of the GRIN lens defining a second longitudinal length. The first longitudinal length and the second longitudinal length are configured such that when viewing the object at a predetermined wavelength of light, the object is magnified at a predetermined level of magnification and the focal plane of the magnified object is aligned at the proximal end of the first optical element.
摘要翻译： 一种用于放大对象的装置，包括具有设置在其远端上的至少一个成像阵列的SSID。 该装置还包括设置在SSID的远端上的第一光学元件，其中第一光学元件具有限定第一纵向长度的远端和近端。 GRIN透镜设置在第一光学元件的远端上，并且第二光学元件设置在限定第二纵向长度的GRIN透镜的远端上。 第一纵向长度和第二纵向长度被配置成使得当以预定波长的光线观察物体时，物体以预定的放大倍率放大，并且放大物体的焦平面在 第一光学元件。
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公开(公告)号：US20100116869A1
公开(公告)日：2010-05-13
申请号：US12615202
申请日：2009-11-09
IPC分类号： B23K31/02
CPC分类号： H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要： Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译： 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号：US07680377B2
公开(公告)日：2010-03-16
申请号：US12070580
申请日：2008-02-19
IPC分类号： G02B6/04 , H01R12/00 , H01R13/648 , H01R12/24 , H01R33/945 , H01R33/00 , C03B37/15 , G02B6/36 , G02B6/38 , G02B6/40 , G02B6/44
CPC分类号： H01R13/22 , H01R13/005 , H01R13/025 , H01R13/26
摘要： Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.
摘要翻译： 公开了用于超高密度连接的技术。 在一个实施例中，超高密度连接器包括大致平行的细长圆柱形元件束，其中每个圆柱形元件基本上与至少一个相邻的圆柱形元件接触。 细长圆柱形元件的端部相对于彼此差异地设置以限定三维交叉配合表面。 细长圆柱形元件中的至少一个具有定位成切向地接合配合连接器的相应电接触件的导电触点。
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公开(公告)号：US07591780B2
公开(公告)日：2009-09-22
申请号：US10391513
申请日：2003-03-17
IPC分类号： A61B1/05
CPC分类号： A61B1/05 , H04N2005/2255
摘要： A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line. Alternatively, the adaptor can be a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path. The conductive path can be configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface, and the conductive line is electrically coupled to the conductive path at a second surface.
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