Abstract:
The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.
Abstract:
A method for altering surfaces of a microstructure is disclosed. The modification comprises cleaning the surfaces using an ozone-containing cleaning agent. The modification may also comprise coating the surfaces of the microstructure using a vapor phase coating agent that reacts chemically with the surface. The modification may also comprise coating the surfaces of the microstructure using a lubricant that interacts physically with the surface. The modification can be performed after removal of sacrificial materials of the microstructure during the fabrication process. In particular, the modification method is applicable during the packaging stage for the microstructure.
Abstract:
A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.
Abstract:
We disclose a precision positioner based on an inertial actuator, an optical instrument for accurate positional readout and control, and an electrostatically clamped assembly for holding any instrument or device. All aspects of the present invention present a significant improvement over the prior art: a positioner is robust and compact; an optical instrument for positional control is a profoundly simple and compact module; a clamping assembly is self-aligning and suitable for robotic hot-swapping of objects being positioned.
Abstract:
A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.
Abstract:
The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.
Abstract:
Disclosed herein is a micromirror device having in-plane deformable hinge to which a deflectable and reflective mirror plate is attached. The mirror plate rotates to different angles in response to an electrostatic field established between the mirror plate and an addressing electrode associated with the mirror plate.
Abstract:
Lubricants for lubricating surfaces of microelectromechanical devices are disclosed. Specifically, the lubricants can be applied to the contacting surfaces of the microelectromechanical devices so as to remove stiction of the contacting surfaces.
Abstract:
The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.