Surface processes in fabrications of microstructures
    22.
    发明申请
    Surface processes in fabrications of microstructures 审中-公开
    微观结构的表面处理

    公开(公告)号:US20050106774A1

    公开(公告)日:2005-05-19

    申请号:US10713671

    申请日:2003-11-13

    Abstract: A method for altering surfaces of a microstructure is disclosed. The modification comprises cleaning the surfaces using an ozone-containing cleaning agent. The modification may also comprise coating the surfaces of the microstructure using a vapor phase coating agent that reacts chemically with the surface. The modification may also comprise coating the surfaces of the microstructure using a lubricant that interacts physically with the surface. The modification can be performed after removal of sacrificial materials of the microstructure during the fabrication process. In particular, the modification method is applicable during the packaging stage for the microstructure.

    Abstract translation: 公开了一种改变微结构表面的方法。 修改包括使用含臭氧的清洁剂清洁表面。 修改还可以包括使用与表面化学反应的气相涂层剂涂覆微结构的表面。 修改还可以包括使用与表面物理相互作用的润滑剂涂覆微结构的表面。 可以在制造过程中去除显微组织的牺牲材料之后进行修改。 特别地,该修改方法适用于微结构的包装阶段。

    Wavelength converted semiconductor light emitting device
    23.
    发明授权
    Wavelength converted semiconductor light emitting device 有权
    波长转换半导体发光器件

    公开(公告)号:US08203161B2

    公开(公告)日:2012-06-19

    申请号:US12624156

    申请日:2009-11-23

    Abstract: A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.

    Abstract translation: 一种器件包括半导体结构,其包括设置在n型区域和p型区域之间的发光层。 发光材料位于由发光层发射的光的路径中。 热耦合材料设置在透明材料中。 热耦合材料的导热率大于透明材料的热导率。 热耦合材料被定位成散发来自发光材料的热量。

    Inertial positioner and an optical instrument for precise positioning
    24.
    发明授权
    Inertial positioner and an optical instrument for precise positioning 有权
    惯性定位器和用于精确定位的光学仪器

    公开(公告)号:US08063383B2

    公开(公告)日:2011-11-22

    申请号:US12264268

    申请日:2008-11-04

    Abstract: We disclose a precision positioner based on an inertial actuator, an optical instrument for accurate positional readout and control, and an electrostatically clamped assembly for holding any instrument or device. All aspects of the present invention present a significant improvement over the prior art: a positioner is robust and compact; an optical instrument for positional control is a profoundly simple and compact module; a clamping assembly is self-aligning and suitable for robotic hot-swapping of objects being positioned.

    Abstract translation: 我们公开了基于惯性致动器,用于精确位置读出和控制的光学仪器以及用于保持任何仪器或装置的静电夹紧组件的精密定位器。 与现有技术相比,本发明的所有方面都有显着的改进:定位器坚固紧凑; 用于位置控制的光学仪器是一个非常简单和紧凑的模块; 夹紧组件是自对准的,适用于被定位的物体的机器人热插拔。

    WAVELENGTH CONVERTED SEMICONDUCTOR LIGHT EMITTING DEVICE
    25.
    发明申请
    WAVELENGTH CONVERTED SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    波长转换半导体发光器件

    公开(公告)号:US20110121331A1

    公开(公告)日:2011-05-26

    申请号:US12624156

    申请日:2009-11-23

    Abstract: A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.

    Abstract translation: 一种器件包括半导体结构,其包括设置在n型区域和p型区域之间的发光层。 发光材料位于由发光层发射的光的路径中。 热耦合材料设置在透明材料中。 热耦合材料的导热率大于透明材料的热导率。 热耦合材料被定位成散发来自发光材料的热量。

    Method and apparatus for characterizing microelectromechanical devices on wafers
    26.
    发明授权
    Method and apparatus for characterizing microelectromechanical devices on wafers 有权
    用于表征晶片上的微机电装置的方法和装置

    公开(公告)号:US07345806B2

    公开(公告)日:2008-03-18

    申请号:US10875555

    申请日:2004-06-23

    CPC classification number: G01N21/956 G01N21/9501

    Abstract: The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.

    Abstract translation: 本发明提供一种用于使用谐振技术来评估具有可变形和可偏转构件的微机电装置的质量的方法和装置。 具体地说,利用晶片级上的光学共振映射机构来检查以可变形和可偏转元件的均匀性为特征的产品质量。

    Method and apparatus for characterizing microelectromechanical devices on wafers
    29.
    发明申请
    Method and apparatus for characterizing microelectromechanical devices on wafers 有权
    用于表征晶片上的微机电装置的方法和装置

    公开(公告)号:US20050286105A1

    公开(公告)日:2005-12-29

    申请号:US10875555

    申请日:2004-06-23

    CPC classification number: G01N21/956 G01N21/9501

    Abstract: The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.

    Abstract translation: 本发明提供一种用于使用谐振技术来评估具有可变形和可偏转构件的微机电装置的质量的方法和装置。 具体地说,利用晶片级上的光学共振映射机构来检查以可变形和可偏转元件的均匀性为特征的产品质量。

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