公开(公告)号：US09351348B2

公开(公告)日：2016-05-24

申请号：US13879639

申请日：2011-10-20

Applicant: Grigoriy Basin ,  Paul Scott Martin

Inventor： Grigoriy Basin ,  Paul Scott Martin

IPC: H05B33/02 ,  H05B33/10 ,  H01L25/075 ,  F21V9/00 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

CPC classification number: H05B33/02 ,  F21V9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/24 ,  H01L2933/0041 ,  H01L2933/0058 ,  H05B33/10 ,  Y10T428/24802 ,  Y10T428/2486 ,  Y10T428/24926

Abstract: Optical elements (130) are attached to a support film (110) at select locations, the select locations corresponding to locations of light emitting elements (140) on another substrate, e.g. the substrate of the title (150). The film is placed on the substrate containing the light emitting elements such that the optical elements are in contact with their corresponding light emitting elements. The optical elements are laminated to the light emitting elements, and the support film is removed. The optical elements may include wavelength conversion elements, lens elements, combinations of elements, and so on. Other elements, such as conductors and reflectors may also be positioned on the laminate film.

Abstract translation: 光学元件（130）在选定位置处附接到支撑膜（110），所述选择位置对应于另一衬底上的发光元件（140）的位置，例如。 标题（150）的底物。 将薄膜放置在含有发光元件的基板上，使得光学元件与其相应的发光元件接触。 将光学元件层压到发光元件上，并且去除支撑膜。 光学元件可以包括波长转换元件，透镜元件，元件的组合等等。 其他元件，例如导体和反射器也可以定位在层压膜上。

公开(公告)号：US09081167B2

公开(公告)日：2015-07-14

申请号：US12049239

申请日：2008-03-14

Applicant: Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

Inventor： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC: H01L33/00 ,  G02B19/00 ,  H01L23/00 ,  H01L33/54 ,  H05K3/28 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58

CPC classification number: G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

Abstract translation: 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US20140008685A1

公开(公告)日：2014-01-09

申请号：US14004434

申请日：2012-03-20

Applicant: Grigoriy Basin ,  Paul Scott Martin

Inventor： Grigoriy Basin ,  Paul Scott Martin

IPC: H01L33/50

CPC classification number: H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2933/0041 ,  H01L2933/0091

Abstract: LED dies are mounted a single submount tile (or wafer). The LED dies have a light emitting top surface. A uniformly thick layer of UV sensitive silicone infused with phosphor is then deposited over the tile, including over the tops and sides of the LED dies. Only the silicone/phosphor over the top and sides of the LED dies is desired, so the silicone/phosphor directly on the tile needs to be removed. The silicone/phosphor layer is then masked to expose the areas that are to remain to UV light, which creates a cross-linked silicone. The unexposed silicone/phosphor layer is then dissolved with a solvent and removed from the tile surface. The silicone/phosphor layer may be defined to expose a wire bond electrode on the LED dies. The tile is ultimately singulated to produce individual phosphor-converted LEDs.

Abstract translation: LED芯片安装在单个底座瓦片（或晶片）上。 LED管芯具有发光顶表面。 然后将沉积有磷光体的均匀厚的UV敏感硅胶层沉积在瓷砖上，包括在LED管芯的顶部和侧面。 只需要在LED模具的顶部和侧面上的硅氧烷/磷光体，因此需要去除直接在瓷砖上的硅氧烷/磷光体。 然后将硅氧烷/磷光体层掩蔽以暴露出保持为UV光的区域，这产生交联的硅氧烷。 然后将未曝光的硅氧烷/磷光体层用溶剂溶解并从瓷砖表面除去。 可以限定硅氧烷/磷光体层以暴露LED管芯上的引线接合电极。 瓦片最终被分割以产生单个的磷光体转换的LED。

公开(公告)号：US08203161B2

公开(公告)日：2012-06-19

申请号：US12624156

申请日：2009-11-23

Applicant: Dmitri Simonian ,  Grigoriy Basin

Inventor： Dmitri Simonian ,  Grigoriy Basin

IPC: H01L33/00

CPC classification number: H01L33/504 ,  H01L25/167 ,  H01L33/56 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.

Abstract translation: 一种器件包括半导体结构，其包括设置在n型区域和p型区域之间的发光层。 发光材料位于由发光层发射的光的路径中。 热耦合材料设置在透明材料中。 热耦合材料的导热率大于透明材料的热导率。 热耦合材料被定位成散发来自发光材料的热量。

公开(公告)号：US20110121331A1

公开(公告)日：2011-05-26

申请号：US12624156

申请日：2009-11-23

Applicant: Dmitri SIMONIAN ,  Grigoriy BASIN

Inventor： Dmitri SIMONIAN ,  Grigoriy BASIN

IPC: H01L33/00

CPC classification number: H01L33/504 ,  H01L25/167 ,  H01L33/56 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.

Abstract translation: 一种器件包括半导体结构，其包括设置在n型区域和p型区域之间的发光层。 发光材料位于由发光层发射的光的路径中。 热耦合材料设置在透明材料中。 热耦合材料的导热率大于透明材料的热导率。 热耦合材料被定位成散发来自发光材料的热量。

公开(公告)号：US20110108865A1

公开(公告)日：2011-05-12

申请号：US12613924

申请日：2009-11-06

Applicant: Rafael I. ALDAZ ,  Grigoriy BASIN ,  Paul S. MARTIN ,  Michael KRAMES

Inventor： Rafael I. ALDAZ ,  Grigoriy BASIN ,  Paul S. MARTIN ,  Michael KRAMES

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/60 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.

Abstract translation: 在一个实施例中，倒装芯片LED形成有从其n层和p层的底表面延伸的高密度金柱。 金柱结合到底座电极。 然后将底部填充材料模制以填充LED底部和底座之间的空隙。 底部填充物包含硅氧烷模塑料基料和约70-80重量％的氧化铝（或其它合适的材料）。 氧化铝的导热系数比典型的硅胶底部填充物的热导率高出约25倍，这主要是二氧化硅。 氧化铝是白色粉末。 底部填充剂还可以含有约5-10重量％的TiO 2以增加反射率。 LED灯由反射底层填充物向上反射，底部填充物有效地将热量传导到底座。 底部填充物也随机化光散射，改善光提取。 分布式金柱和底层填料在生长衬底剥离过程中支持LED层。

公开(公告)号：US20110049545A1

公开(公告)日：2011-03-03

申请号：US12552328

申请日：2009-09-02

Applicant: Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

IPC: H01L33/00

CPC classification number: H01L24/97 ,  H01L33/005 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00

Abstract: After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.

Abstract translation: 在将倒装芯片LED安装在底座晶片上并且移除其生长衬底之后，将磷光体板固定到每个LED的暴露的顶表面。 然后将反射材料，例如含有至少5重量％TiO 2的硅氧烷的硅酮在晶片上旋转或模制，以覆盖荧光体板和LED的侧面。 然后使用微珠喷射来蚀刻反射材料的顶表面以暴露荧光体板的顶部并在晶片表面上形成基本上平面的反射层。 然后可以在LED上形成透镜。 然后将晶片切片。 反射材料将所有侧光反射回LED和磷光体板，使得几乎所有的光离开荧光体板的顶部以改善发光特性。

公开(公告)号：US07791093B2

公开(公告)日：2010-09-07

申请号：US11849930

申请日：2007-09-04

Applicant: Grigoriy Basin ,  Ashim Shatil Haque ,  Ching-hui Chen ,  Robert Scott West ,  Paul Martin

Inventor： Grigoriy Basin ,  Ashim Shatil Haque ,  Ching-hui Chen ,  Robert Scott West ,  Paul Martin

IPC: H01L33/00

CPC classification number: H01L33/56 ,  H01L33/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/16225 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: In one embodiment, sub-micron size granules of TiO2, ZrO2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.

Abstract translation: 在一个实施方案中，将TiO 2，ZrO 2或其它白色非荧光剂惰性颗粒的亚微米尺寸颗粒与硅氧烷密封剂混合并涂覆在LED上。 在一个实验中，当惰性材料占密封剂的约2.5-5重量％时，颗粒将GaN LED的光输出增加超过5％。 通常，大于5％的惰性材料的百分比开始降低光输出。 如果LED具有黄色的YAG荧光粉涂层，则当LED处于关闭状态时，密封剂中的白色颗粒使得LED显得更白，当LED用作小型相机中的白光闪光时，这是更令人愉快的颜色。 颗粒的添加还减少了在LED上的视角和位置上的色温变化，这对于相机闪光和投影应用是重要的。

公开(公告)号：US20090057699A1

公开(公告)日：2009-03-05

申请号：US11849930

申请日：2007-09-04

Applicant: Grigoriy Basin ,  Ashim Shatil Haque ,  Ching-hui Chen ,  Robert Scott West ,  Paul Martin

Inventor： Grigoriy Basin ,  Ashim Shatil Haque ,  Ching-hui Chen ,  Robert Scott West ,  Paul Martin

IPC: H01L33/00

CPC classification number: H01L33/56 ,  H01L33/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/16225 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: In one embodiment, sub-micron size granules of TiO2, ZrO2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.

Abstract translation: 在一个实施方案中，将TiO 2，ZrO 2或其它白色非荧光剂惰性颗粒的亚微米尺寸颗粒与硅氧烷密封剂混合并涂覆在LED上。 在一个实验中，当惰性材料占密封剂的约2.5-5重量％时，颗粒将GaN LED的光输出增加超过5％。 通常，大于5％的惰性材料的百分比开始降低光输出。 如果LED具有黄色的YAG荧光粉涂层，则当LED处于关闭状态时，密封剂中的白色颗粒使得LED显得更白，当LED用作小型相机中的白光闪光时，这是更令人愉快的颜色。 颗粒的添加还减少了在LED上的视角和位置上的色温变化，这对于相机闪光和投影应用是重要的。

公开(公告)号：US20140193931A1

公开(公告)日：2014-07-10

申请号：US14131686

申请日：2012-07-30

Applicant: Grigoriy Basin ,  John Edward Epler ,  Paul Scott Martin

Inventor： Grigoriy Basin ,  John Edward Epler ,  Paul Scott Martin

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/48 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/27436 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/8309 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2924/01074 ,  H01L2924/00

Abstract: A method according to embodiments of the invention includes positioning a flexible film (48) over a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).

Abstract translation: 根据本发明的实施例的方法包括在半导体发光器件的晶片上定位柔性膜（48），每个半导体发光器件包括半导体结构（13），该半导体结构（13）包括夹在n型区域和 一个p型区域。 半导体发光器件的晶片经由柔性膜（48）与基板（50）接合。 粘合后，柔性膜（48）与半导体结构（13）直接接触。 该方法还包括在将晶片接合到基板（50）之后分割晶片。