公开(公告)号：US08203161B2

公开(公告)日：2012-06-19

申请号：US12624156

申请日：2009-11-23

Applicant: Dmitri Simonian ,  Grigoriy Basin

Inventor： Dmitri Simonian ,  Grigoriy Basin

IPC: H01L33/00

CPC classification number: H01L33/504 ,  H01L25/167 ,  H01L33/56 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.

Abstract translation: 一种器件包括半导体结构，其包括设置在n型区域和p型区域之间的发光层。 发光材料位于由发光层发射的光的路径中。 热耦合材料设置在透明材料中。 热耦合材料的导热率大于透明材料的热导率。 热耦合材料被定位成散发来自发光材料的热量。

公开(公告)号：US10158049B2

公开(公告)日：2018-12-18

申请号：US14131686

申请日：2012-07-30

Applicant: Grigoriy Basin ,  John Edward Epler ,  Paul Scott Martin

Inventor： Grigoriy Basin ,  John Edward Epler ,  Paul Scott Martin

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L33/22

Abstract: A method according to embodiments of the invention includes positioning a flexible film (48) over a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).

公开(公告)号：US08384118B2

公开(公告)日：2013-02-26

申请号：US12767845

申请日：2010-04-27

Applicant: Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

Inventor： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

IPC: H01L33/00

CPC classification number: H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

Abstract translation: 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US08273587B2

公开(公告)日：2012-09-25

申请号：US13115475

申请日：2011-05-25

Applicant: Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

Inventor： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

IPC: H01L21/00

CPC classification number: H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

Abstract translation: 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

公开(公告)号：US20110012149A1

公开(公告)日：2011-01-20

申请号：US12503951

申请日：2009-07-16

Applicant: Grigoriy Basin ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Paul S. Martin

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

Abstract: An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.

Abstract translation: 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分离。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。

公开(公告)号：US07847302B2

公开(公告)日：2010-12-07

申请号：US11212280

申请日：2005-08-26

Applicant: Grigoriy Basin ,  Paul S. Martin ,  Robert Scott West ,  Yasumasa Morita ,  Tewe Heemstra

Inventor： Grigoriy Basin ,  Paul S. Martin ,  Robert Scott West ,  Yasumasa Morita ,  Tewe Heemstra

IPC: H01L33/00 ,  H01J1/62

CPC classification number: H01L33/504 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2224/81

Abstract: A technique for forming a white light LED is disclosed. In one embodiment, the LED emits blue light. A first phosphor for producing red, yellow, yellow-green, or green light is formed to conformably coat the LED die. One suitable deposition technique is electrophoretic deposition (EPD). Over the resulting LED structure is deposited another phosphor (to add the remaining color component) in a binder (e.g., silicone) for encapsulating the die. The blue LED light combines with the two phosphor colors to create white light. Since the two different deposition techniques are independent and easily controllable, the resulting white light temperature is highly controllable and the color emission is substantially uniform.

Abstract translation: 公开了一种用于形成白光LED的技术。 在一个实施例中，LED发射蓝光。 形成产生红色，黄色，黄绿色或绿色光的第一荧光体以适形地涂覆LED管芯。 一种合适的沉积技术是电泳沉积（EPD）。 在所得到的LED结构之外，将另一种荧光体（以将剩余的颜色成分添加）沉积在用于封装模具的粘合剂（例如硅树脂）中。 蓝色LED灯与两种荧光粉相结合，产生白光。 由于两种不同的沉积技术是独立且易于控制的，所得到的白光温度是高度可控的，并且颜色发射基本上是均匀的。

公开(公告)号：US07736945B2

公开(公告)日：2010-06-15

申请号：US11611775

申请日：2006-12-15

Applicant: Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

Inventor： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

IPC: H01L21/00

CPC classification number: H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

Abstract translation: 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US20080157114A1

公开(公告)日：2008-07-03

申请号：US12049239

申请日：2008-03-14

Applicant: Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

Inventor： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC: H01L33/00

CPC classification number: G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

Abstract translation: 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US09351348B2

公开(公告)日：2016-05-24

申请号：US13879639

申请日：2011-10-20

Applicant: Grigoriy Basin ,  Paul Scott Martin

Inventor： Grigoriy Basin ,  Paul Scott Martin

IPC: H05B33/02 ,  H05B33/10 ,  H01L25/075 ,  F21V9/00 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

CPC classification number: H05B33/02 ,  F21V9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/24 ,  H01L2933/0041 ,  H01L2933/0058 ,  H05B33/10 ,  Y10T428/24802 ,  Y10T428/2486 ,  Y10T428/24926

Abstract: Optical elements (130) are attached to a support film (110) at select locations, the select locations corresponding to locations of light emitting elements (140) on another substrate, e.g. the substrate of the title (150). The film is placed on the substrate containing the light emitting elements such that the optical elements are in contact with their corresponding light emitting elements. The optical elements are laminated to the light emitting elements, and the support film is removed. The optical elements may include wavelength conversion elements, lens elements, combinations of elements, and so on. Other elements, such as conductors and reflectors may also be positioned on the laminate film.

Abstract translation: 光学元件（130）在选定位置处附接到支撑膜（110），所述选择位置对应于另一衬底上的发光元件（140）的位置，例如。 标题（150）的底物。 将薄膜放置在含有发光元件的基板上，使得光学元件与其相应的发光元件接触。 将光学元件层压到发光元件上，并且去除支撑膜。 光学元件可以包括波长转换元件，透镜元件，元件的组合等等。 其他元件，例如导体和反射器也可以定位在层压膜上。

公开(公告)号：US09081167B2

公开(公告)日：2015-07-14

申请号：US12049239

申请日：2008-03-14

Applicant: Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

Inventor： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC: H01L33/00 ,  G02B19/00 ,  H01L23/00 ,  H01L33/54 ,  H05K3/28 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58

CPC classification number: G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

Abstract translation: 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。