公开(公告)号：US5585679A

公开(公告)日：1996-12-17

申请号：US450691

申请日：1995-05-25

申请人： Allen T. Bracken ,  Edward L. Rich ,  Ted R. Davis

发明人： Allen T. Bracken ,  Edward L. Rich ,  Ted R. Davis

IPC分类号： G11B21/02 ,  H02K15/02 ,  H02K33/18 ,  H02K41/035 ,  H02K41/02 ,  G11B33/00

CPC分类号： H02K41/0358 ,  H02K15/02

摘要： A one-piece magnet return path assembly for a disk drive actuator comprises an upper plate, a lower plate and a plurality of standoffs extending between the upper and lower plates and establishing a pre-determined spacing between the plates. The upper and lower plates and the plurality of standoffs are stamped from a single sheet of magnetically permeable material that is then bent at predetermined locations to form the completed one-piece magnet return path assembly.

摘要翻译： 用于盘驱动器致动器的单件式磁返回路径组件包括上板，下板和在上板和下板之间延伸的多个支架，并且在板之间建立预定的间隔。 上板和下板和多个支座从单张导磁材料冲压，然后在预定位置弯曲以形成完整的一体磁体返回路径组件。

公开(公告)号：US06979239B1

公开(公告)日：2005-12-27

申请号：US10879042

申请日：2004-06-30

申请人： Patrick K. Richard ,  Edward L. Rich, III ,  Kevin L. Ebersole ,  Angela J. Martin ,  Tapan K. Gupta ,  David W. Strack ,  John S. Fisher, III

发明人： Patrick K. Richard ,  Edward L. Rich, III ,  Kevin L. Ebersole ,  Angela J. Martin ,  Tapan K. Gupta ,  David W. Strack ,  John S. Fisher, III

IPC分类号： H01R4/02 ,  H01R13/00 ,  H01R13/03 ,  H01R13/646

CPC分类号： H01R24/50 ,  H01R13/03

摘要： Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabrication of the T/R module. The slots are formed prior to the shroud being brazed on to the module substrate. By allowing plating solution to flow through the connector, the interior of the connector can be more thoroughly plated, thereby improving the yield of the assembly while reducing cost.

摘要翻译： 在垂直于连接器的轴线的平面中，在T / R模块的连接器护罩中形成槽或孔，以便在制造过程中允许电镀液自由地流过连接器的整个内部，特别是后部 的T / R模块。 在将护罩钎焊到模块基板之前形成槽。 通过允许电镀溶液流过连接器，连接器的内部可以更彻底地镀覆，从而在降低成本的同时提高组件的产量。

公开(公告)号：US06362935B1

公开(公告)日：2002-03-26

申请号：US09294513

申请日：1999-04-20

申请人： Edward L. Rich

发明人： Edward L. Rich

IPC分类号： G11B560

CPC分类号： G11B5/6005

摘要： A read/write head for use in a disk drive having chamfered surfaces reducing possible damage to the head assembly and/or media during loading and unloading of heads form media surface. In an inadvertent collision between the media and head assembly, the media may become displaced, possibly damaging the head suspension assembly or critical electrical connections between the head assembly and media drive. Similarly, such a collision may impart irreversible physical damage to the recording medium, making the data on the medium unrecoverable. The present invention comprises chamfered surface, preferably formed into the head, which reduces the likelihood of damage caused to the head assembly or media in the event of an inadvertent collision. These chamfered surfaces deflect the media to its proper position such that damage is minimized during collision.

摘要翻译： 用于具有倒角表面的盘驱动器的读/写头，在头部的装载和卸载期间减少对头组件和/或介质的损坏，从而形成介质表面。 在介质和头部组件之间的无意的碰撞中，介质可能会发生位移，可能会损坏磁头悬挂组件或磁头组件与介质驱动器之间的关键电气连接。 类似地，这种碰撞可能给记录介质带来不可逆的物理损伤，使得介质上的数据不可恢复。 本发明包括倒角表面，优选地形成在头部中，这减少了在无意的碰撞的情况下对头部组件或介质造成损坏的可能性。 这些倒角的表面将介质偏转到适当的位置，使得在碰撞期间损坏最小化。

公开(公告)号：US6094161A

公开(公告)日：2000-07-25

申请号：US456407

申请日：1999-12-08

申请人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Andrew J. Piloto ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

发明人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Andrew J. Piloto ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

IPC分类号： G01S7/28 ,  G01S7/03 ,  H01Q21/00 ,  H04B1/40 ,  H04B1/48

CPC分类号： G01S7/03 ,  G01S7/032 ,  H01Q21/0025

摘要： Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and are bonded directly to a generally flat a heat sink plate which is secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate. DC power conditioning is also provided by a capacitive bank type of energy storage subassembly externally attached to the rear of the module package for supplying supplementary power to the module during peak power operation. The T/R module is one module of an array of like T/R modules coupled to an active aperture of a radar system.

摘要翻译： 两个离散的发射/接收（T / R）信道在单个公共T / R模块封装中实现，其具有提供组合功能，控制和功率调节的能力，同时利用单个多腔多层衬底，其包括高温 共烧陶瓷（HTCC）层。 陶瓷层具有包括接地面和带状线导体的相应金属化图案以及形成在其中的馈通或垂直通孔的外表面，用于提供屏蔽RF和DC电力和逻辑控制信号两者的三维布线，以便除其他外， 一对RF歧管信号耦合器，其嵌入在衬底中并且转变到封装前端处的多引脚盲配合压接RF连接器组件。 DC和逻辑输入/输出控制信号通过封装后部的弹簧接触焊盘连接到包括专用集成电路（ASIC）和单片微波集成电路芯片（MMIC）的多个有源电路部件。 产生基本上所有热量的MMIC位于形成在基板中的多层空腔中，并且直接结合到大致平坦的散热板上，该散热板固定到基板的底部并用作与外部的热接口 换热器如冷板。 直流功率调节也由外部连接到模块封装后部的电容式储能型存储子组件提供，用于在峰值功率操作期间向模块提供补充功率。 T / R模块是耦合到雷达系统的有效孔径的类似T / R模块的阵列的一个模块。

公开(公告)号：US6005531A

公开(公告)日：1999-12-21

申请号：US158827

申请日：1998-09-23

申请人： John W. Cassen ,  Gary N. Bonadies ,  Patrick K. Richard ,  David A. Herlihy ,  Ayn U. Fuller ,  Daniel H. Wenzlick ,  Richard C. Kapraun ,  Mark R. Schrote ,  Kerry M. Yon ,  H. Halley Lisle, IV ,  Toby Hess ,  Edward L. Rich, III ,  George T. Hall ,  Brian T. Drude

发明人： John W. Cassen ,  Gary N. Bonadies ,  Patrick K. Richard ,  David A. Herlihy ,  Ayn U. Fuller ,  Daniel H. Wenzlick ,  Richard C. Kapraun ,  Mark R. Schrote ,  Kerry M. Yon ,  H. Halley Lisle, IV ,  Toby Hess ,  Edward L. Rich, III ,  George T. Hall ,  Brian T. Drude

IPC分类号： H01Q3/26 ,  G01S7/03 ,  H01Q21/00 ,  H01Q21/06

CPC分类号： H01Q21/064 ,  H01Q21/0025 ,  H01Q21/0087 ,  G01S7/032

摘要： An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected to a coolant distribution manifold encircling the array; a DC power and logic signal distribution manifold; and, a plurality of elongated DC/logic circuit board members connected to the DC power and logic signal distribution manifold and being respectively located adjacent and coextensive with a respective coldplate for supplying DC power and logic control signals to a DC/logic interface located at the other end portion of the respective modules.

摘要翻译： 用于有源电子扫描阵列的天线组件包括：天线元件阵列; 耦合到所述天线元件并由此形成辐射结构阵列的RF信号馈送和循环器组件; 大体上平面的RF歧管组件，其中具有规则间隔的开口，位于辐射结构的正后方; 连接到辐射结构阵列的T / R模块的阵列，并且具有相应的RF连接器组件，该RF连接器组件在每个模块的一个端部处形成RF接口的一部分，其通过RF歧管中的所述隔开的开口向上突出，并且其中 其相应的连接器组件连接到至少一个紧邻的循环器，以及传送和接收RF歧管的歧管部分; 每个T / R模块在其后侧还具有散热板，该散热板被定位成抵靠围绕阵列的冷却剂分配歧管连接的多个细长的液体冷却剂循环冷却板中的一个; 直流电源和逻辑信号分配歧管; 以及多个连接到DC电力和逻辑信号分配歧管的细长DC /逻辑电路板构件，并且分别位于与相应冷板相邻并共同延伸的用于将DC电力和逻辑控制信号提供给位于所述DC / 各个模块的另一端部。

公开(公告)号：US5583710A

公开(公告)日：1996-12-10

申请号：US438255

申请日：1995-05-10

申请人： Carl F. Nicklos ,  David E. Jones ,  Edward L. Rich ,  Allen T. Bracken ,  Harold Woods ,  Clark Bruderer

发明人： Carl F. Nicklos ,  David E. Jones ,  Edward L. Rich ,  Allen T. Bracken ,  Harold Woods ,  Clark Bruderer

IPC分类号： G01P5/16 ,  G11B17/028 ,  G11B17/035 ,  G11B19/00 ,  G11B23/03 ,  G11B25/04 ,  G11B17/00

CPC分类号： G11B17/0288 ,  G11B19/00 ,  G11B23/0308

摘要： A disk drive for writing and reading data to and from a disk contained in a cartridge which is inserted through an opening into the disk drive comprises a motor ring rotatably mounted in the disk drive and a spindle motor for rotating the disk. The spindle motor is mounted in the motor ring such that rotation of the motor ring moves the spindle motor into and out of engagement with the hub of the disk cartridge. A position transducer provides an output signal indicative of the rotational position of the motor ring. A load/eject motor controls the rotation of the motor ring in response to the output signal from the position transducer.

摘要翻译： 用于向包含在通过盘片驱动器的开口插入的盒中的盘写入和读取数据的磁盘驱动器包括可旋转地安装在盘驱动器中的马达环和用于旋转盘的主轴马达。 主轴电动机安装在电动机环中，使得电动机环的旋转将主轴电动机移动到与盘盒的轮毂接合。 位置传感器提供表示电动机环的旋转位置的输出信号。 负载/弹出电机响应于位置传感器的输出信号控制电机环的旋转。

公开(公告)号：US4967201A

公开(公告)日：1990-10-30

申请号：US111328

申请日：1987-10-22

申请人： Edward L. Rich, III

发明人： Edward L. Rich, III

IPC分类号： G01S7/03 ,  H01L23/66 ,  H05K7/20

CPC分类号： H01L23/66 ,  G01S7/034 ,  H01L2223/6622 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/3011

摘要： A microwave transmit/receive module comprises a single multi-layer substrate having at least two opposed mounting surfaces. The substrate including a plurality of integrated dielectric layers, electrical conductors and thermal conductors selectively interconnected between the layers of the substrate. A microwave signal processing means is mounted on at least one of the mounting surfaces of the substrate for processing microwave radar signals. A control signal processing means is mounted on at least one of the mounting surfaces of the substrate for providing control signals for the microwave signal processing means via selected electrical conductors. A power conditioning means is mounted on at least one of the mounting surfaces of the substrate for providing power to the microwave signal processing means and the control signal processing means via selected electrical conductors. A heat sink interface means coupled to the thermal conductors is mounted on at least one of the mounting surfaces of the substrate in thermal proximity selected portions of the microwave signal processing means, the power conditioning means and the control signal processing means for conducting thermal energy away therefrom via selected thermal conductors. An optical interface interface as well as an integrated coaxial cable carrying power, control and microwave signals for the module.

摘要翻译： 微波发射/接收模块包括具有至少两个相对的安装表面的单个多层基板。 该衬底包括多个集成电介质层，电导体和选择性地互连于衬底层之间的热导体。 微波信号处理装置安装在用于处理微波雷达信号的基板的至少一个安装表面上。 控制信号处理装置安装在衬底的至少一个安装表面上，用于经由所选择的电导体为微波信号处理装置提供控制信号。 功率调节装置安装在基板的至少一个安装表面上，用于经由选定的电导体向微波信号处理装置和控制信号处理装置供电。 耦合到热导体的散热器接口装置安装在微波信号处理装置的热接近选定部分的基板的至少一个安装表面上，功率调节装置和用于传导热能的控制信号处理装置 通过选定的热导体。 光接口接口以及集成同轴电缆，为模块提供电源，控制和微波信号。

公开(公告)号：US4209491A

公开(公告)日：1980-06-24

申请号：US865017

申请日：1977-12-21

申请人： Edward L. Rich, III

发明人： Edward L. Rich, III

IPC分类号： A62B7/08 ,  B01J7/00

CPC分类号： A62B7/08 ,  B01J7/00

摘要： A control and monitoring system for an oxygen generation device having a plurality of chemical oxygen generation elements sequentially decomposed to continuously generate oxygen. The control and monitoring system has a temperature sensor operatively coupled to each of the chemical oxygen generation elements, except the one to be ignited last, for producing a first control signal in response to the heat generated by the chemical oxygen generation elements during decomposition, a gas flow sensor disposed in the oxygen outlet has the oxygen generation elements and responsive to a flow rate less than a predetermined minimum flow rate to produce a second control signal, a sequential ignition mechanism operated on the occurrence of both the first control signal and the second control signal, as an ignition signal for igniting the oxygen generation elements one after another, and an alarm operative in response to the second control signal after a time interval of not less than a predetermined magnitude for indicating the interruption of oxygen generation for an abnormally long time interval.Preferably, light emitter indicator means are provided to indicate ignition of the corresponding oxygen generating element.

摘要翻译： 一种用于具有依次分解以连续生成氧的多个化学氧产生元件的氧发生装置的控制和监视系统。 控制和监测系统具有温度传感器，其操作性地耦合到每个化学氧发生元件，除了最后点燃的一个之外，用于响应于在分解期间由化学氧产生元件产生的热产生第一控制信号， 设置在氧气出口中的气体流量传感器具有氧气产生元件，并且响应于小于预定最小流量的流量产生第二控制信号，在第一控制信号和第二控制信号两者的出现时操作的顺序点火机构 控制信号，作为点火信号，用于一个接一个地点燃氧气发生元件，以及响应于第二控制信号在不小于预定值的时间间隔之后操作的报警，用于指示异常长时间产生氧气的中断 时间间隔。 优选地，提供光发射器指示装置以指示对应的氧发生元件的点火。

公开(公告)号：US4140765A

公开(公告)日：1979-02-20

申请号：US805578

申请日：1977-06-10

申请人： Frank E. Martin ,  Edward L. Rich, III

发明人： Frank E. Martin ,  Edward L. Rich, III

IPC分类号： G01F1/36 ,  A62B7/08 ,  B01J4/00 ,  B01J7/00 ,  C01B13/02

CPC分类号： B01J7/00 ,  A62B7/08 ,  B01J4/008

摘要： The disclosed gas flow sensor has an orifice connected in an oxygen conduit and a pressure switch connected to the conduit by having a pressure chamber communicating with the conduit. The chamber terminates at a diaphram which is operatively coupled to a normally open microswitch by a spring loaded rod. As the flow rate of oxygen flowing through the conduit drops below a permissible minimum magnitude, back pressure on the orifice decreases so as to close the microswitch to provide a control signal. A bypass valve is connected across the orifice to prevent the oxygen pressure within the conduit from excessively increasing.

摘要翻译： 所公开的气体流量传感器具有连接在氧气管道中的孔口和通过具有与导管连通的压力室连接到管道的压力开关。 该室终止于一个通过弹簧加载杆可操作地连接到常开微动开关的隔膜。 当流经导管的氧气流量低于允许的最小值时，孔口上的背压减小，以便关闭微动开关以提供控制信号。 旁通阀连接在孔口上，以防止管道内的氧气压力过度增加。

公开(公告)号：US06278400B1

公开(公告)日：2001-08-21

申请号：US09450905

申请日：1999-11-29

申请人： John W. Cassen ,  Edward L. Rich, III ,  Gary N. Bonadies ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Scott C. Tolle ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko ,  Timothy L. Eder ,  Chad E. Wilson ,  Gary L. Ferrell ,  Stephanie A. Parks

发明人： John W. Cassen ,  Edward L. Rich, III ,  Gary N. Bonadies ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Scott C. Tolle ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko ,  Timothy L. Eder ,  Chad E. Wilson ,  Gary L. Ferrell ,  Stephanie A. Parks

IPC分类号： G01S728

CPC分类号： G01S7/03 ,  G01S7/032 ,  H01Q21/0025

摘要： Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package. The RF transmit power amplifiers which generate most of the heat in the module package are located in a first pair of cavities formed in the substrate directly behind the RF connector assembly and are mounted directly on a pair of flat heat sink plates which are secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate. A second pair of cavities in which are located the RF receive signal amplifiers and their respective receiver protector elements, is located beside the first pair of cavities directly behind the RF connector for reducing RF signal loss.

摘要翻译： 在单个公共T / R模块封装中实现两个离散的发送/接收（T / R）信道，其具有提供组合功能，控制和功率调节的能力，同时利用单个多腔多层衬底，其包括高或 低温共烧陶瓷层。 陶瓷层具有包括接地面和带状线导体的相应金属化图案以及形成在其中的馈通或垂直通孔的外表面，用于提供屏蔽RF和DC电力和逻辑控制信号两者的三维布线，以便除其他外， 一对RF歧管信号耦合器，其嵌入在衬底中并且转变到封装前端处的多引脚盲配合压接RF连接器组件。 DC和逻辑输入/输出控制信号通过封装后部的弹簧接触焊盘连接到包括专用集成电路（ASIC）和单片微波集成电路芯片（MMIC）的多个有源电路部件。 用于将模块的发送和接收信号耦合到RF模块的RF连接器组件位于封装的前部。 在模块封装中产生大部分热量的RF发射功率放大器位于直接位于RF连接器组件后面的衬底中形成的第一对空腔中，并直接安装在一对平坦的散热板上， 并且用作与诸如冷板之类的外部热交换器的热界面。 位于RF接收信号放大器及其各自的接收器保护器元件的第二对空腔位于RF连接器正后方的第一对空腔旁边，用于减少RF信号损失。