公开(公告)号：US20220376147A1

公开(公告)日：2022-11-24

申请号：US17623268

申请日：2020-04-21

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Yunyuan ZHANG ,  Jinhui ZHANG ,  Yikai YUAN ,  Cheng LI

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: The disclosure provides a full-color light emitting device and a display module. A light emitting layer, a refractive layer, a spacer layer and a light processing layer are included. The refractive layer is disposed above the light emitting layer, the spacer layer is disposed above the refractive layer, and the light processing layer is disposed above the spacer layer. The light emitting layer includes a first light emitting part, a second light emitting part and a third light emitting part. The light processing layer includes a first light processing part, a second light processing part, and a third light processing part, and a baffle wall is disposed between any two adjacent light processing parts in the first light processing part, the second light processing part and the third light processing part. A light refractive index of the refractive layer is greater than a light refractive index of the spacer layer.

公开(公告)号：US20220231206A1

公开(公告)日：2022-07-21

申请号：US17574586

申请日：2022-01-13

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Kuai QIN ,  Heng GUO ,  Xiaobo OUYANG ,  Hongwen CHEN ,  Qiang ZHAO ,  Bin CAI ,  Nianpu LI ,  Junyong WANG

IPC: H01L33/56 ,  H01L25/075 ,  H01L23/00 ,  H01L33/62

Abstract: The disclosure provides a light-emitting device and a displayer. Herein, the light-emitting device includes a substrate, a light-emitting chip, a first light-transmitting layer, a second light-transmitting layer and a nano coating. The light transmittance of the second light-transmitting layer is greater than the light transmittance of the first light-transmitting layer. A reference surface corresponding to the light-emitting chip is arranged above the substrate, and the reference surface is higher than the bottom surface of the light-emitting chip and not higher than the top surface of the light-emitting chip. The first light-transmitting layer covers the surface of the light-emitting chip below the reference surface, and the second light-transmitting layer covers the surface of the light-emitting chip above the reference surface. The nano coating covers the outer surface of the first light-transmitting layer, the outer surface of the second light-transmitting layer and the side surface of the substrate.

公开(公告)号：US11380827B2

公开(公告)日：2022-07-05

申请号：US16908771

申请日：2020-06-23

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Fuhai Li ,  Penghui Dong ,  Dongzi Chen ,  Zhiguo Xie ,  Quan Xie

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/54 ,  H01L33/52 ,  H01L33/46 ,  F21V19/00 ,  F21Y115/10

Abstract: Provided are a Light Emitting Diode (LED) device and a backlight module. The LED device includes a substrate, a chip, an encapsulation structure and a top reflective shielding layer; the chip is disposed on the substrate; the encapsulation structure covers the substrate and covers the chip; and the top reflective shielding layer is disposed on the encapsulation structure and located at a central position of an upper surface of the encapsulation structure, and covers a part of the upper surface of the encapsulation structure.

公开(公告)号：US20210193629A1

公开(公告)日：2021-06-24

申请号：US16995850

申请日：2020-08-18

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Kailiang FAN ,  Kuai QIN ,  Heng GUO ,  Qiang ZHAO ,  Zongxian XIE ,  Chungan JIANG

IPC: H01L25/075

Abstract: Some embodiments provide a full-color display module and display device. The full-color display module includes at least two light-emitting layers. Any one of the at least two light-emitting layers includes a substrate and a plurality of light-emitting portions encapsulated on the substrate. A type of any one of the plurality of light-emitting portions is one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion. The at least two light-emitting layers are successively laminated in a laminating direction and form a plurality of pixel points. Any one of the plurality of pixel points is a surrounding area on the full-color display module, which is surrounded by a surrounding curved surface. The surrounding area of the any one of the plurality of pixel points includes at least one red light-emitting portion, at least one green light-emitting portion, and at least one blue light-emitting portion.

公开(公告)号：US20190252584A1

公开(公告)日：2019-08-15

申请号：US16151733

申请日：2018-10-04

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Chuanbiao Liu ,  Lu Yang ,  Danwei Li ,  Feng Gu ,  Zhuang Peng

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L25/13

Abstract: Provided are an LED holder, an LED device and an LED display screen. The LED holder includes a metal frame and a cup cover wrapping the metal frame. The cup cover includes a reflective cup. The cup cover has a first lateral surface and a second lateral surface disposed opposite to each other. A height of the first lateral surface is greater than a height of the second lateral surface. The metal frame includes metal pins exposed outside the cup cover and disposed on the first lateral surface and/or the second lateral surface. The bottom of the cup cover is of a sloping structure, so that the light emitted by an LED chip in the reflective cup propagates along a specified direction.

公开(公告)号：US20190244939A1

公开(公告)日：2019-08-08

申请号：US16340150

申请日：2017-10-17

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Chuanbiao LIU ,  Xiaofeng LIU ,  Feng GU ,  Kuai QIN

IPC: H01L25/075

Abstract: A Chip-on-Board (COB) display module is provided, which includes a Printed Circuit Board (PCB) a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage. The COB display module further includes a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer. A manufacturing method for the COB display module is also disclosed.

公开(公告)号：US10256384B2

公开(公告)日：2019-04-09

申请号：US15764319

申请日：2016-06-04

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Chuanbiao Liu ,  Kuai Qin ,  Mingjun Zhu ,  Xiaolong Huang ,  Tinghong Yang

IPC: H01L29/18 ,  H01L33/00 ,  H01L33/60 ,  G09F9/33 ,  H01L33/48 ,  H01L33/52 ,  H01L33/58

Abstract: A light emitting diode (LED) support frame (10), LED device adopting the same, and LED display module. The LED support frame (10) comprises a base board (101) and a reflection cup (102). A light converging component (103) is arranged on the reflection cup (102). A concave light converging surface (1030) is provided at a side of the light converging component (103) and adjacent to a reflection cup mouth (1021). A part of a light beam emitted from an LED chip is directed to the light converging surface (1030), reflected by the light converging surface (1030), and finally converged with other light beams emitted from the LED chip to focus at a visual field observed by an observer. Therefore, the embodiment effectively reduces optical loss of lights from different directions in the light converging component (103).

公开(公告)号：US20180277726A1

公开(公告)日：2018-09-27

申请号：US15764319

申请日：2016-06-04

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Chuanbiao Liu ,  Kuai Qin ,  Mingjun Zhu ,  Xiaolong Huang ,  Tinghong Yang

IPC: H01L33/60 ,  G09F9/33 ,  H01L33/48 ,  H01L33/52

CPC classification number: H01L33/60 ,  G09F9/33 ,  H01L33/486 ,  H01L33/52 ,  H01L33/58

Abstract: A light emitting diode (LED) support frame (10), LED device adopting the same, and LED display module. The LED support frame (10) comprises a base board (101) and a reflection cup (102). A light converging component (103) is arranged on the reflection cup (102). A concave light converging surface (1030) is provided at a side of the light converging component (103) and adjacent to a reflection cup mouth (1021). A part of a light beam emitted from an LED chip is directed to the light converging surface (1030), reflected by the light converging surface (1030), and finally converged with other light beams emitted from the LED chip to focus at a visual field observed by an observer. Therefore, the embodiment effectively reduces optical loss of lights from different directions in the light converging component (103).

公开(公告)号：US20250107265A1

公开(公告)日：2025-03-27

申请号：US18758619

申请日：2024-06-28

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Mingjun ZHU ,  Zishan LU ,  Yurong LI ,  Canbiao WU ,  Yan CHEN ,  Haojie GUO ,  Danwei LI ,  Yinling ZHENG

IPC: H01L31/173 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232

Abstract: A light-emitting device includes a light-emitting assembly and a light-transmissive component. The light-emitting assembly includes a first bracket, a light-emitting element, and a first photosensitive element. The first bracket has a first surface and a second surface opposite to each other. Multiple first electrodes and multiple second electrodes are disposed at intervals on the first surface, and the light-emitting element and the first photosensitive element are disposed at intervals on the second surface. The light-emitting element is electrically connected to at least one of the multiple first electrodes. The first photosensitive element is electrically connected to at least one of the multiple second electrodes. The light-transmissive component includes a light-transmissive encapsulation layer and a light-concentrating portion which are sequentially disposed on a side of the light-emitting assembly facing away from the first surface, and the light-concentrating portion is disposed in correspondence with the light-emitting element.

公开(公告)号：US12183868B2

公开(公告)日：2024-12-31

申请号：US17788151

申请日：2020-12-18

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Kuai Qin ,  Heng Guo ,  Kailiang Fan ,  Caineng Huo ,  Zhuang Peng

IPC: H01L33/62 ,  H01L23/544 ,  H01L25/075 ,  H01L33/32 ,  H01L33/44 ,  H01L33/46 ,  H01L33/50

Abstract: A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step S1 and step S2. In step S1, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S2, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.