公开(公告)号：US20240133736A1

公开(公告)日：2024-04-25

申请号：US18490312

申请日：2023-10-18

Applicant: INVENSENSE, INC. ,  TDK Electronics AG

Inventor： Pirmin Rombach ,  Kurt Rasmussen ,  Dennis Mortensen ,  Jan Ravnkilde ,  Cheng-Yen Liu ,  Jotaro Akiyama ,  Sushil Bharatan ,  Troy Chase

IPC: G01H11/06 ,  H04R7/10 ,  H04R7/12 ,  H04R19/04 ,  H04R31/00

CPC classification number: G01H11/06 ,  H04R7/10 ,  H04R7/12 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/023

Abstract: Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.

公开(公告)号：US20240069061A1

公开(公告)日：2024-02-29

申请号：US18502444

申请日：2023-11-06

Applicant: INVENSENSE, INC.

Inventor： Matthew Julian Thompson ,  Robert Walmsley

IPC: G01P15/08

CPC classification number: G01P15/08 ,  G01P2015/0871

Abstract: A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.

公开(公告)号：US11844282B2

公开(公告)日：2023-12-12

申请号：US16802436

申请日：2020-02-26

Applicant: InvenSense, Inc.

Inventor： Andre Guedes ,  Fabian Goericke ,  Stefon Shelton ,  Benedict Costello ,  David Horsley

IPC: H01L41/083 ,  H10N30/50 ,  H04R17/00 ,  H10N30/057 ,  H10N30/87 ,  H10N30/88

CPC classification number: H10N30/50 ,  H04R17/00 ,  H10N30/057 ,  H10N30/871 ,  H10N30/883

Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.

公开(公告)号：US11841228B2

公开(公告)日：2023-12-12

申请号：US17467145

申请日：2021-09-03

Applicant: INVENSENSE, INC.

Inventor： Doruk Senkal ,  Robert Hennessy ,  Houri Johari-Galle ,  Joe Seeger

IPC: G01C19/5712 ,  G01C19/5783

CPC classification number: G01C19/5712 ,  G01C19/5783

Abstract: The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.

公开(公告)号：US11821731B2

公开(公告)日：2023-11-21

申请号：US17400102

申请日：2021-08-11

Applicant: INVENSENSE, INC.

Inventor： Carlo Pinna ,  Sriraman Dakshinamurthy

IPC: H03M3/00 ,  G01C19/5712

CPC classification number: G01C19/5712 ,  H03M3/358 ,  H03M3/402 ,  H03M3/458

Abstract: Facilitating minimization of non-linearity effects of a delay of a capacitance-to-voltage (C2V) converter on an output of a gyroscope is presented herein. A sense output signal of a sense mass of the gyroscope and a drive output signal of a drive mass of the gyroscope are electronically coupled to respective analog-to-digital converter (ADC) inputs of bandpass sigma-delta ADCs of the gyroscope. The bandpass sigma-delta ADCs include respective C2V converters that are electronically coupled, via respective feedback loops, to the respective ADC inputs to facilitate reductions of respective propagation delays of the bandpass sigma-delta ADCs. Respective ADC outputs of the bandpass sigma-delta ADCs are electronically coupled to demodulator inputs of a demodulator of the gyroscope that transforms the sense output into an output of the MEMS gyroscope representing an external stimulus that has been applied to the sense mass.

公开(公告)号：US11819361B2

公开(公告)日：2023-11-21

申请号：US16870929

申请日：2020-05-09

Applicant: InvenSense, Inc.

Inventor： Fabian T. Goericke ,  Richard J. Przybyla ,  Benjamin E. Eovino

IPC: G01S7/521 ,  G01N29/24 ,  B06B1/06 ,  H10N30/87 ,  A61B8/00

CPC classification number: A61B8/4483 ,  B06B1/0688 ,  G01N29/2437 ,  G01S7/521 ,  H10N30/87

Abstract: An ultrasonic transducer device comprises a piezoelectric micromachined ultrasonic transducer (PMUT), a transmitter with first and second differential outputs, and a controller. The PMUT includes a membrane layer. A bottom electrode layer, comprising a first bottom electrode and a second bottom electrode, is disposed above the membrane layer. The piezoelectric layer is disposed above the bottom electrode layer. The top electrode layer is disposed above the piezoelectric layer and comprises a segmented center electrode disposed above a center of the membrane layer and a segmented outer electrode spaced apart from the segmented center electrode. The controller, responsive to the PMUT being placed in a transmit mode, is configured to couple the first and second segments of the bottom electrode layer with ground, couple the first output of the transmitter with the segments of the segmented center electrode, and couple the second output with the segments of the segmented outer electrode.

公开(公告)号：US11774585B2

公开(公告)日：2023-10-03

申请号：US17561959

申请日：2021-12-26

Applicant: InvenSense, Inc.

Inventor： Florence Gris ,  Agnes Duval

IPC: G01S15/10

CPC classification number: G01S15/101

Abstract: A device comprises a processor coupled with an ultrasonic transducer coupled which is configured to emit an ultrasonic pulse and receive returned signals received after a ringdown period of the transducer and corresponding to the emitted ultrasonic pulse. The processor is configured to evaluate the returned signals to find a candidate echo, from an object located in a ringdown blind spot area, in a time window between one and two times the ringdown period; locate multiple echoes from the object of higher order than the candidate echo; validate the candidate echo as at least a secondary echo associated of the object; and determine, based on analysis of the returned signals, an estimated distance from the transducer to the object in the ringdown blind spot area, wherein the ringdown blind spot area is located between the transducer and a closest distance at which objects can be sensed by the transducer.

公开(公告)号：US20230296461A1

公开(公告)日：2023-09-21

申请号：US18113541

申请日：2023-02-23

Applicant: InvenSense, Inc.

Inventor： Yoshitaka Sasaki ,  Jotaro Akiyama ,  Sal Akram ,  Yaoching Wang ,  Weng Shen Su ,  Tsung Lin Tang ,  Ting-Yuan Liu ,  Yuki Shibano ,  Chung-Hsien Lin

IPC: G01L9/12 ,  B81C1/00

CPC classification number: G01L9/12 ,  B81C1/00198 ,  B81C2201/0132

Abstract: A pressure sensor includes a first electrode, a plurality of cavities, and a second electrode. The second electrode is disposed opposite the first electrode through the plurality of cavities. The second electrode includes a flat structure spanning two adjacent cavities of the plurality of cavities.

公开(公告)号：US11754397B2

公开(公告)日：2023-09-12

申请号：US17317787

申请日：2021-05-11

Applicant: INVENSENSE, INC.

Inventor： Sriraman Dakshinamurthy ,  Carlo Pinna ,  Ronak Chetan Desai

IPC: G01C19/5776

CPC classification number: G01C19/5776

Abstract: Microelectromechanical systems (MEMS) gyroscopes and related sense frequency tracking techniques are described. Various embodiments facilitate sense frequency tracking and offset and/or sensitivity change compensation. Exemplary embodiments can comprise receiving a sense signal at an output of a MEMS gyroscope and determining a sense resonant frequency of the sense signal. In addition, exemplary methods can comprise generating an input sine wave with a frequency of the sense resonant frequency of the sense signal injecting the input sine wave into the MEMS gyroscope, to facilitate sense frequency tracking.

公开(公告)号：US20230246617A1

公开(公告)日：2023-08-03

申请号：US18298065

申请日：2023-04-10

Applicant: INVENSENSE, INC.

Inventor： Igor Mucha ,  Michael Perrott

IPC: H03G3/30 ,  H03F3/68 ,  H04R3/04 ,  H04R29/00

CPC classification number: H03G3/3005 ,  H03F3/68 ,  H04R3/04 ,  H04R29/004 ,  H03F2200/171 ,  H03G2201/103 ,  H03F2200/375 ,  H03F2200/165 ,  H03F2200/03

Abstract: Exemplary multipath digital microphones described herein can comprise exemplary embodiments of automatic gain control and multipath digital audio signal digital signal processing chains, which allow low power and die size to be achieved as described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can facilitate switching between multipath digital audio signal digital signal processing chains while minimizing audible artifacts associated with either the change in the gain automatic gain control amplifiers switching between multipath digital audio signal digital signal processing chains.