公开(公告)号：US20120014069A1

公开(公告)日：2012-01-19

申请号：US13049322

申请日：2011-03-16

Applicant: Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Yi-Cheng Lin

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Yi-Cheng Lin

IPC: H05K7/20 ,  H05K13/04 ,  H05K3/34

CPC classification number: H01L23/4334 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/115 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48135 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M7/003 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.

Abstract translation: 功率模块包括第一散热器，第一和第二功率芯片，热导绝缘层，引线框架和模塑料。 第一散热器具有第一区域和第二区域。 第一功率芯片设置在第一区域中。 热导绝缘层设置在第二区域中。 第二功率芯片通过热导绝缘层设置在散热片上。 引线框架电连接到第一和第二功率芯片中的至少一个。 模制化合物覆盖第一和第二功率芯片，热导绝缘层和引线框架的一部分。 第一散热器电连接到第一和第二功率芯片中的至少一个。 由于第一功率芯片不通过导热绝缘层设置在第一散热器上，所以可以降低成本。

公开(公告)号：US20120014059A1

公开(公告)日：2012-01-19

申请号：US13074539

申请日：2011-03-29

Applicant: Jian-Hong ZENG ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Xue-Tao Guo ,  Ai-Xing Tong

Inventor： Jian-Hong ZENG ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Xue-Tao Guo ,  Ai-Xing Tong

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H05K7/209 ,  H01L24/34 ,  H01L24/45 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M7/003 ,  H05K5/065 ,  H05K7/1432 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.

Abstract translation: 功率模块包括第一功率芯片和第二功率芯片，每个芯片具有至少两个电极。 功率模块被应用于功率密度高于15W / inch 3且最大效率高于92％的功率转换器，或者功率密度高于20W / inch 3的功率转换器或具有高于 93％。 功率芯片中的至少一个以高于25kHz的频率工作。

公开(公告)号：US20120008344A1

公开(公告)日：2012-01-12

申请号：US13048534

申请日：2011-03-15

Applicant: Jian-Hong Zeng ,  Jian Jiang ,  Qifeng Ye ,  Jian-Ping Ying

Inventor： Jian-Hong Zeng ,  Jian Jiang ,  Qifeng Ye ,  Jian-Ping Ying

IPC: H02M3/335 ,  H02M3/22

CPC classification number: H03K17/691 ,  H03K17/6877

Abstract: A driver for driving a driving element includes: a signal source, for providing a square signal; a first modulation circuit, for providing on-pulses and off-pulses according to edges of the square signal; a transformer for coupling output signals of the first modulation circuit to a secondary winding of the transformer to form coupled signals; a second modulation circuit for providing first operating pulses according to coupled on-pulses of the coupled signals, and providing second operating pulses according to coupled off-pulses of the coupled signals; a switch device for turning off the switch device according to the first operating pulses and turning on the switch device according to the second operating pulses, and when the switch device is turned off, coupled on-pulses charge an equivalent capacitor of the driving element to a first driving potential to turn on the driving element, and when the switch device is turned off, the equivalent capacitor discharges to a second driving potential to turn off the driving element, and the width of the on-pulses is less than 1000 ns.

Abstract translation: 用于驱动驱动元件的驱动器包括：信号源，用于提供平方信号; 第一调制电路，用于根据平方信号的边缘提供导通脉冲和截止脉冲; 用于将所述第一调制电路的输出信号耦合到所述变压器的次级绕组以形成耦合信号的变压器; 第二调制电路，用于根据耦合信号的耦合接通脉冲提供第一工作脉冲，并根据耦合信号的耦合关断脉冲提供第二工作脉冲; 开关装置，用于根据第一操作脉冲关闭开关装置，并根据第二操作脉冲接通开关装置，并且当开关装置关闭时，将驱动元件的等效电容器的接通脉冲充电到 导通驱动元件的第一驱动电位，并且当开关器件关断时，等效电容器放电到第二驱动电位以关断驱动元件，并且导通脉冲的宽度小于1000ns。

公开(公告)号：US20100255282A1

公开(公告)日：2010-10-07

申请号：US12754021

申请日：2010-04-05

Applicant: Shou-Yu Hong ,  Wei Yang ,  Jian-Hong Zeng ,  Jian-Ping Ying

Inventor： Shou-Yu Hong ,  Wei Yang ,  Jian-Hong Zeng ,  Jian-Ping Ying

IPC: H01F27/36 ,  H01F7/00 ,  H01F1/01 ,  C08L83/00 ,  C08L79/08 ,  C08K9/00 ,  C08K3/40

CPC classification number: H01F3/08 ,  H01F1/22 ,  H01F1/36 ,  H01F5/06 ,  H01F17/04 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T428/249922 ,  Y10T428/2933

Abstract: A high temperature resistant insulating composition includes an organic polymer and an inorganic binder. The inorganic binder is ranged between 10% and 90% by weight of the high temperature resistant insulating composition. The high temperature resistant insulating composition still possesses strength and insulating property after a high temperature treatment.

Abstract translation: 耐高温绝缘组合物包括有机聚合物和无机粘合剂。 无机粘合剂的范围为耐高温绝缘组合物的10重量％至90重量％。 耐高温绝缘组合物在高温处理后仍然具有强度和绝缘性能。