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公开(公告)号：US10509968B2
公开(公告)日：2019-12-17
申请号：US15883206
申请日：2018-01-30
Inventor： Jiunn-Tsair Chen , Chin-Sheng Kuan , Wei-Jen Chien , Wen-Hao Hsiao
Abstract: A data fusion based safety surveillances system has a first through Nth virtual monitoring systems and a data fusion and decision device. The data fusion and decision device defines an ith detection model of the ith virtual monitoring system, and estimates an ith detection loss probability of the ith virtual monitoring system according to detection loss sample numbers of batches of ith monitored data of the ith virtual monitoring system under conditions corresponding to the locations, batches of context data and existence of intruder, the ith detection model, the batches of ith monitored data corresponding to locations of the ith virtual monitoring system and the batches of context data. The data fusion and decision device determines a fusion parameter set according to the first through Nth detection loss probabilities, and performs data fusion on a first through Nth detection results to generate a decision result.
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公开(公告)号：US10476376B1
公开(公告)日：2019-11-12
申请号：US16223062
申请日：2018-12-17
Inventor： Kun-Feng Chen , Jung-Yang Wang , Chin-Yu Ho
Abstract: A high power factor converter is provided. The high power factor converter includes a rectifier, a reactive power control circuit and a converter circuit. The rectifier is utilized for receiving and converting an input AC voltage in to an input DC voltage. The reactive power control circuit is coupled to the rectifier for performing a reactive power control operation based on the input DC voltage. The converter circuit is coupled to the reactive power control circuit for converting the input DC voltage into an output voltage.
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公开(公告)号：US10442909B2
公开(公告)日：2019-10-15
申请号：US15813711
申请日：2017-11-15
Inventor： Teh-Long Lai , Chin-Wei Chun , Shyh-Chi Wu , Yung-Hsien Liu
IPC: C08J9/00 , C08J9/35 , A41D13/015 , C08J9/228 , C08L23/08 , C08L31/04 , C08L9/06 , C08L83/04 , B29C35/02 , A41D31/28 , C08K3/36
Abstract: A constituent for producing a shock-absorbing composite material comprises 50-80 wt % primary matrix including vinyl acetate; ethylene/vinyl acetate copolymer; 10-40 wt % secondary matrix including polyethylene; styrene-butadiene rubber; a thermoplastic elastomer; and 1-20 wt % additive. A shock-absorbing composite material which contains the constituent and a production method thereof are further introduced. The shock-absorbing composite material is applicable to sports equipment (say, shoe pads, clubs and rackets), medical care (say, care-oriented clothes for the elderly, the sick, the injured, and the handicapped), and applications related to impact protection (say, helmets and bumpers.) The shock-absorbing composite material is applied to defense industry.
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24.发明授权公开(公告)号：US10424550B2
公开(公告)日：2019-09-24
申请号：US15846966
申请日：2017-12-19
Inventor： Ching-Wen Chiang , Yen-Cheng Kuan , Chia-Jen Liang , Chien-Te Yu
IPC: H01Q1/22 , H01Q1/24 , H01Q1/52 , H01L21/48 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/66 , H01L21/683 , H01L23/498 , H01L23/522 , H01L23/538 , H01L23/552
Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.
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公开(公告)号：US10401432B2
公开(公告)日：2019-09-03
申请号：US15336423
申请日：2016-10-27
Inventor： Yu-Shan Lin , Jun-Liang Zhu , Tung-Jung Hsu , Chao-Tse Hong
Abstract: A rotary switch state detection device includes a magnetic field generating unit, a gravity sensing unit, a magnetic force sensing unit and a processing unit. The magnetic field generating unit generates a magnetic field. The magnetic force sensing unit and the gravity sensing unit are disposed at a rotary switch to detect a gravity value and a magnetic force value of the magnetic field and generate a gravity strength signal and magnetic field strength signal, respectively. The processing unit is connected to the gravity sensing unit and the magnetic force sensing unit to calculate a gravity value variation and a magnetic force value variation and thereby precisely locate a rotation head of the rotary switch upon completion of rotation thereof.
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Patent Agency Ranking
公开(公告)号：US10384941B2
公开(公告)日：2019-08-20
申请号：US15839995
申请日：2017-12-13
Inventor： Chun-Te Wu , Kuan-Ting Lai , Cheng-Hung Shih , Yang-Kuo Kuo
IPC: C01B21/082
Abstract: A method utilizes easily obtained carbon as carbon source for sintering, followed by high energy ball milling process with planetary ball mill for high energy homogenous mixing of the carbon source, solvent and nano-level silicon dioxide powder, along with a high energy ball milling process repeatedly performed using different sized ball mill beads, so as to formulate a spray granulation slurry with the optimal viscosity, to complete the process of micronization of carbon source evenly encapsulated by silicon dioxide powders. The optimal ratio of C/SiO2 is 1-2.5 to produce a spherical silicon dioxide powder (40-50 μm) evenly encapsulated by the carbon source. The powder is then subjected to a high temperature (1450□) sintering process under nitrogen gas. Lastly, the sintered silicon nitride powder is subjected to homogenizing carbon removal process in a rotational high temperature furnace to complete the fabricating process.
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公开(公告)号：US10365442B2
公开(公告)日：2019-07-30
申请号：US16112842
申请日：2018-08-27
Inventor： Chiang-Hsin Lin , Wei-Ting Lin , Jian-Hung Lin , Po-Tse Tai , Wei-Chung Yen
IPC: G02B6/36
Abstract: An optical housing for high power fiber components includes an upper cover, a lower base, and two isolating members. The upper cover includes a light-reflecting portion for containing the optical fiber and receiving and reflecting the light therefrom. The lower base is connected with the upper cover and includes a light-receiving portion which corresponds to the light-reflecting portion in position and surrounds the optical fiber, thereby receives the light from the light-reflecting portion. The isolating members are disposed between the upper cover and the lower base and located on two sides of the optical housing to prevent the leakage of light from the optical fiber.
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公开(公告)号：US10355354B2
公开(公告)日：2019-07-16
申请号：US15641396
申请日：2017-07-05
Inventor： Jiin-An Guu , Ching-Chyuan Lin , Chien-Te Yu
Abstract: Array antenna communication system is introduced, which is a communication system that receives a location signal generated by a mobile communication apparatus and accordingly transfers a communication signal with a corresponding phase direction. The system includes an array antenna module and a beamforming circuit. The array antenna module includes a plurality of antenna units arranged in array form. The beamforming circuit is used for receiving a plurality of location signals, a plurality of phase control signals, and transferring a plurality of output signals, wherein the beamforming circuit receives the location signal and accordingly generates the corresponding control signal, and controls the corresponding antenna unit of the array antenna module, so as to enable the antenna unit to move to a position corresponding to a phase and to transfer the plurality of output signals, thereby achieving communication signal enhancement.
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公开(公告)号：US20190193271A1
公开(公告)日：2019-06-27
申请号：US15854896
申请日：2017-12-27
Inventor： YI-YUH HWANG , WEI-GUO CHANG , LI-CHUNG LIU
CPC classification number: B25J9/1697 , G06K9/209 , G06K9/6202 , G06K9/78 , G06T7/001 , G06T7/74 , G06T2207/30164 , H04N7/181 , Y10S901/09 , Y10S901/47
Abstract: An error compensation device comprises at least one photographing module, a comparison module and a compensation module compensation module. The photographing module establish a space coordinate system relative to the object and comprises a first photographer and a second photographer which respectively photograph a first non-deformed laser speckle image on a first surface and a second non-deformed laser speckle image on a second surface, the first surface differs from the second surface by an azimuth. The comparison module respectively compares the first non-deformed laser speckle image before and after the displacement with the second non-deformed laser speckle image to calculate a displacement value between the two surfaces. The compensation module controls the movement of the object according to the displacement value. The error compensation utilizes the displacement of the non-deformed laser speckle image to obtain the absolute error of the object and compensate the error.
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30.发明申请公开(公告)号：US20190189572A1
公开(公告)日：2019-06-20
申请号：US15846966
申请日：2017-12-19
Inventor： CHING-WEN CHIANG , YEN-CHENG KUAN , CHIA-JEN LIANG , CHIEN-TE YU
IPC: H01L23/66 , H01L23/538 , H01L23/31 , H01L23/552 , H01L21/683 , H01L21/56 , H01L21/48 , H01Q1/22
CPC classification number: H01L23/66 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L23/5226 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L2221/68345 , H01L2221/68359 , H01L2223/6677 , H01L2223/6688 , H01L2224/16235 , H01L2224/221 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81005 , H01L2924/1421 , H01L2924/15311 , H01L2924/1533 , H01L2924/3025 , H01Q1/2283 , H01Q1/247 , H01Q1/526 , H01Q21/28
Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.
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