Recording element printing and treating system and method
    23.
    发明授权
    Recording element printing and treating system and method 有权
    记录元素印刷和处理系统及方法

    公开(公告)号:US07025450B2

    公开(公告)日:2006-04-11

    申请号:US10731705

    申请日:2003-12-09

    CPC classification number: B41J11/002

    Abstract: A recording element printing and treating system and method are provided. The system includes a printhead for dispensing a liquid comprising a carrier onto a recording element. A carrier removal station positioned downstream from the printhead removes a predetermined percentage of carrier present in the recording element. A converting station positioned downstream from the carrier removal station increases a durability characteristic of the recording element. In one embodiment, printing, carrier removal, and converting are accomplished in a single unit. In an alternative embodiment, printing is accomplished in a stand alone unit while carrier removal and converting are accomplished in a second stand alone unit. In this alternative embodiment, transfer of the recording element can be accomplished automatically using a mechanical device or manually by a system user.

    Abstract translation: 提供了一种记录元件印刷和处理系统和方法。 该系统包括用于将包括载体的液体分配到记录元件上的打印头。 位于打印头下游的载体移除台移除存在于记录元件中的载体的预定百分比。 位于载体移除站下游的转换站增加了记录元件的耐久性。 在一个实施例中,打印,载体移除和转换在单个单元中完成。 在替代实施例中,印刷是在独立单元中实现的,而载体移除和转换在第二独立单元中完成。 在该备选实施例中,记录元件的传送可以使用机械装置自动完成或由系统用户手动完成。

    Fusing-station roller
    24.
    发明授权
    Fusing-station roller 失效
    定影辊

    公开(公告)号:US07001653B2

    公开(公告)日:2006-02-21

    申请号:US10668014

    申请日:2003-09-22

    Abstract: A controlled modulus fusing-station member inclusive of a durable, tough, elastically deformable layer incorporating hollow flexible filler particles. The elastically deformable layer is preferably a single layer on a substrate, the substrate preferably a core member of a fuser roller or a pressure roller. The elastically deformable layer is made from a dry formulation inclusive of: a fluoro-thermoplastic polymer powder; microspheres in the form of unexpanded microspheres or expanded microballoons; and solid filler particles including strength-enhancing filler particles and thermal-conductivity-enhancing filler particles. The dry formulation can be thermally cured or electron-beam cured. Preferably, the dry formulation is thermally cured and further includes a curing catalyst, preferably a peroxide catalyst. Alternatively, the curing catalyst can be a bisphenol residue.

    Abstract translation: 一种受控模量定影站构件,包括耐用,坚韧,可弹性变形的层,其中包含中空柔性填料颗粒。 可弹性变形层优选地是在基底上的单层,该基底优选地是定影辊或加压辊的芯构件。 弹性变形层由干式制剂制成,包括:氟 - 热塑性聚合物粉末; 未膨胀微球或膨胀微球形式的微球; 以及固体填料颗粒,包括强度增强填料颗粒和导热性增强填料颗粒。 干燥制剂可以热固化或电子束固化。 优选地,干燥制剂被热固化,并且还包括固化催化剂,优选过氧化物催化剂。 或者,固化催化剂可以是双酚残基。

    Method for preventing tungsten contact/via plug loss after a backside pressure fault
    28.
    发明授权
    Method for preventing tungsten contact/via plug loss after a backside pressure fault 有权
    背面压力故障后防止钨接触/堵头损失的方法

    公开(公告)号:US06245654B1

    公开(公告)日:2001-06-12

    申请号:US09283063

    申请日:1999-03-31

    CPC classification number: H01L21/76862 H01L21/76843 H01L21/76877

    Abstract: A method for preventing tungsten contact/via plug loss after a backside pressure fault defect in a deposition chamber is provided. In the method, first deposited by a silane soak step and a tungsten nucleation layer is subsequently deposited, a plasma treating step by a H2 plasma is carried out at a temperature of not higher than 480° C. for a time period of at least 15 seconds. The plasma treating step significantly improves the uniform distribution of the silicon prenucleation layer and substantially prevents the formation of any tungsten silicide layers such that during an etchback process, the dry etchant utilized does not remove a tungsten silicide layer at a much faster rate and leads to a plug loss defect.

    Abstract translation: 提供了一种用于在沉积室中的背面压力故障缺陷之后防止钨接触/经由插塞损失的方法。 在该方法中,首先通过硅烷浸渍步骤和钨成核层沉积,通过H 2等离子体的等离子体处理步骤在不高于480℃的温度下进行至少15 秒。 等离子体处理步骤显着地改善了硅预核层的均匀分布,并且基本上防止了任何硅化钨层的形成,使得在回蚀工艺期间,所用的干蚀刻剂不会以更快的速率除去硅化钨层,并导致 插头损失缺陷。

    Method for preventing tungsten contact plug loss after a backside pressure fault
    29.
    发明授权
    Method for preventing tungsten contact plug loss after a backside pressure fault 有权
    背面压力故障后防止钨触头堵塞的方法

    公开(公告)号:US06174795B1

    公开(公告)日:2001-01-16

    申请号:US09282993

    申请日:1999-03-31

    Abstract: A method for preventing tungsten contact plug loss problem after a backside pressure fault problem in a deposition chamber is provided. In the method, first deposited by a silane soak step and a tungsten nucleation layer is subsequently deposited, a heat treating step by a rapid thermal process is carried out at a temperature of at least 600° C. for a time period of at least 10 seconds. The heat treating step significantly improves the uniform distribution of the silicon prenucleation layer and substantially prevents the formation of any tungsten silicide layers such that during an etchback process, the dry etchant utilized does not remove a tungsten silicide layer at a much faster rate and thereby does not result in a plug loss problem.

    Abstract translation: 提供了一种用于在沉积室中的背面压力故障问题之后防止钨接触塞损耗问题的方法。 在该方法中,首先通过硅烷浸渍步骤和钨成核层沉积,通过快速热处理的热处理步骤在至少600℃的温度下进行至少10 秒。 热处理步骤显着地改善了硅预核层的均匀分布,并且基本上防止了任何硅化钨层的形成,使得在回蚀工艺期间,所用的干蚀刻剂不会以更快的速度除去硅化钨层,从而 不会导致插头丢失问题。

    Replaceable key module and keyboard with the same
    30.
    发明授权
    Replaceable key module and keyboard with the same 有权
    可更换的键盘模块和键盘相同

    公开(公告)号:US08927884B2

    公开(公告)日:2015-01-06

    申请号:US13482852

    申请日:2012-05-29

    Abstract: A replaceable key module for a keyboard, comprising: a keycap holder, a springy member and a keycap. The keycap holder embraces an accommodation space, a first surface having an opening, and a second surface having a hole. The springy member is located on the second surface and within the accommodation space of the keycap holder. The keycap is movably connected to the springy member through the opening of the first surface of the keycap holder and capable of moving between a released position and a depressed position. The keycap is referred to as in a released position when not depressed and in a depressed position pushing the springy member to be deformed downwardly when depressed. By means of adjusting some factors such as hardness, length, material and pressing angle of the springy member, the user may obtain the key module with the specified pressure load as desired.

    Abstract translation: 一种用于键盘的可替换的键模块,包括:键帽保持器,弹性构件和键帽。 键帽保持器包括容纳空间,具有开口的第一表面和具有孔的第二表面。 弹性构件位于第二表面上并且在键帽保持器的容纳空间内。 键帽通过键帽保持器的第一表面的开口可移动地连接到弹性构件,并且能够在释放位置和按压位置之间移动。 键帽在未被按压时被称为处于释放位置,并且处于按压位置时推动弹性构件在压下时向下变形。 通过调整弹性构件的硬度,长度,材料和按压角等因素,用户可根据需要获得具有规定压力载荷的关键模块。

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