Abstract:
An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis. The method is effective in removing particles from via openings of all sizes, including via openings having a width smaller than about 0.2 μm.
Abstract:
The present invention is generally related to compositions, kits and methods for labeling nucleic acid molecules using reverse transcriptases, preferably multi-subunit reverse transcriptases such as ASLV reverse transcriptases. Specifically, the invention relates to methods, kits and compositions for fluorescently labeling nucleic acid molecules during nucleic acid synthesis. The labeled nucleic acid molecules produced in accordance with the invention are particularly suited as labeled probes for nucleic acid detection and diagnostics.
Abstract:
A recording element printing and treating system and method are provided. The system includes a printhead for dispensing a liquid comprising a carrier onto a recording element. A carrier removal station positioned downstream from the printhead removes a predetermined percentage of carrier present in the recording element. A converting station positioned downstream from the carrier removal station increases a durability characteristic of the recording element. In one embodiment, printing, carrier removal, and converting are accomplished in a single unit. In an alternative embodiment, printing is accomplished in a stand alone unit while carrier removal and converting are accomplished in a second stand alone unit. In this alternative embodiment, transfer of the recording element can be accomplished automatically using a mechanical device or manually by a system user.
Abstract:
A controlled modulus fusing-station member inclusive of a durable, tough, elastically deformable layer incorporating hollow flexible filler particles. The elastically deformable layer is preferably a single layer on a substrate, the substrate preferably a core member of a fuser roller or a pressure roller. The elastically deformable layer is made from a dry formulation inclusive of: a fluoro-thermoplastic polymer powder; microspheres in the form of unexpanded microspheres or expanded microballoons; and solid filler particles including strength-enhancing filler particles and thermal-conductivity-enhancing filler particles. The dry formulation can be thermally cured or electron-beam cured. Preferably, the dry formulation is thermally cured and further includes a curing catalyst, preferably a peroxide catalyst. Alternatively, the curing catalyst can be a bisphenol residue.
Abstract:
This invention relates to a polymer sleeve including a polymer sidewall and a ceramer outer coating and a method for producing the polymer sleeve for use with a blanket cylinder in an electrophotographic process.
Abstract:
This invention relates to a polymer sleeve member including a polymer sidewall for use with an image cylinder or a blanket cylinder in an electrophotographic process. The sleeve has a Young's Modulus of Elasticity from about 0.5 to about 10,000 Mpa.
Abstract:
A thermal printer is adapted to prevent crease formation in a dye transfer area of a dye donor web that can cause line artifacts to be printed on a dye receiver during a dye transfer from the dye transfer area to the dye receiver in a dye transfer printer.
Abstract:
A method for preventing tungsten contact/via plug loss after a backside pressure fault defect in a deposition chamber is provided. In the method, first deposited by a silane soak step and a tungsten nucleation layer is subsequently deposited, a plasma treating step by a H2 plasma is carried out at a temperature of not higher than 480° C. for a time period of at least 15 seconds. The plasma treating step significantly improves the uniform distribution of the silicon prenucleation layer and substantially prevents the formation of any tungsten silicide layers such that during an etchback process, the dry etchant utilized does not remove a tungsten silicide layer at a much faster rate and leads to a plug loss defect.
Abstract:
A method for preventing tungsten contact plug loss problem after a backside pressure fault problem in a deposition chamber is provided. In the method, first deposited by a silane soak step and a tungsten nucleation layer is subsequently deposited, a heat treating step by a rapid thermal process is carried out at a temperature of at least 600° C. for a time period of at least 10 seconds. The heat treating step significantly improves the uniform distribution of the silicon prenucleation layer and substantially prevents the formation of any tungsten silicide layers such that during an etchback process, the dry etchant utilized does not remove a tungsten silicide layer at a much faster rate and thereby does not result in a plug loss problem.
Abstract:
A replaceable key module for a keyboard, comprising: a keycap holder, a springy member and a keycap. The keycap holder embraces an accommodation space, a first surface having an opening, and a second surface having a hole. The springy member is located on the second surface and within the accommodation space of the keycap holder. The keycap is movably connected to the springy member through the opening of the first surface of the keycap holder and capable of moving between a released position and a depressed position. The keycap is referred to as in a released position when not depressed and in a depressed position pushing the springy member to be deformed downwardly when depressed. By means of adjusting some factors such as hardness, length, material and pressing angle of the springy member, the user may obtain the key module with the specified pressure load as desired.