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    COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT
    22.
    发明申请
    COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT 有权
    包含水平试剂的金属电镀组合物

    公开(公告)号：US20110290659A1

    公开(公告)日：2011-12-01

    申请号：US13140712

    申请日：2009-12-08

    Applicant: Cornelia Roeger-Göpfert ,  Roman Benedikt Raether ,  Sopia Ebert ,  Charlotte Emnet ,  Alexandra Haag ,  Dieter Mayer

    Inventor： Cornelia Roeger-Göpfert ,  Roman Benedikt Raether ,  Sopia Ebert ,  Charlotte Emnet ,  Alexandra Haag ,  Dieter Mayer

    IPC: C25D3/38 ,  C25D3/02

    CPC classification number: C08G73/024 ,  C08L79/02 ,  C25D3/02 ,  C25D3/38 ,  H01L21/2885 ,  H01L21/76877 ,  H05K3/423

    Abstract: A composition comprising a source of metal ions and at least one leveling agent obtainable by condensing at least one trialkanolamine of the general formula N(R1—OH)3 (Ia) and/or at least one dialkanolamine of the general formula R2—N(R1—OH)2 (Ib) to give a polyalkanolamine(II), wherein the R1 radicals are each independently selected from a divalent, linear or branched aliphatic hydrocarbon radical having from 2 to 6 carbon atoms, and the R2 radicals are each selected from hydrogen and linear or branched aliphatic, cycloaliphatic and aromatic hydrocarbon radicals having from 1 to 30 carbon atoms, or derivatives obtainable by alkoxylation, substitution or alkoxylation and substitution of said polyalkanolamine(II).

    Abstract translation: 包含金属离子源和至少一种流平剂的组合物，其可通过将至少一种通式为N（R 1 -OH）3（Ia）的三烷醇胺和/或至少一种通式R 2 -N的二链烷醇胺 R1-OH）2（Ib），得到聚链烷醇胺（II），其中R1基团各自独立地选自具有2至6个碳原子的二价，直链或支链脂族烃基，R2基团各自选自 氢和具有1至30个碳原子的直链或支链脂族，脂环族和芳族烃基，或通过所述聚链烷醇胺（II）的烷氧基​​化，取代或烷氧基化和取代得到的衍生物。

    COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
    28.
    发明申请
    COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING 审中-公开
    金属镀层组合物，用于无电离子特征填充的包含抑制剂

    公开(公告)号：US20120024711A1

    公开(公告)日：2012-02-02

    申请号：US13257716

    申请日：2010-03-25

    Applicant: Cornelia Roeger-Goepfert ,  Roman Benedikt Raether ,  Charlotte Emnet ,  Alexandra Haag ,  Dieter Mayer

    Inventor： Cornelia Roeger-Goepfert ,  Roman Benedikt Raether ,  Charlotte Emnet ,  Alexandra Haag ,  Dieter Mayer

    IPC: C25D5/02

    CPC classification number: C23C18/31 ,  C23C18/32 ,  C25D3/38 ,  C25D3/58 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76877 ,  H05K3/423

    Abstract: A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein the R1 radicals are each independently selected from a copolymer of ethylene oxide and at least one further C3 to C4 alkylene oxide, said copolymer being a random copolymer. the R2 radicals are each independently selected from R1 or alkyl. X and Y are spacer groups independently, and X for each repeating unit independently, selected from C1 to C6 alkylen and Z—(O—Z)m wherein the Z radicals are each independently selected from C2 to C6 alkylen, n is an integer equal to or greater than 0. m is an integer equal to or greater than 1.

    Abstract translation: 用于填充具有30纳米或更小孔径的亚微米尺寸特征的组合物，其包含铜离子源，以及至少一种选自式（I）化合物的抑制剂，其中R 1基团各自独立地选自乙烯的共聚物 氧化物和至少一种其它C 3至C 4环氧烷烃，所述共聚物是无规共聚物。 R 2基团各自独立地选自R 1或烷基。 X和Y独立地为间隔基，X独立地选自C 1 -C 6亚烷基和Z-（O-Z）m，其中Z基独立地选自C 2 -C 6亚烷基，n是等于 m以上的整数，m为1以上的整数。

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