Abstract:
A memory system includes a memory cell array having a plurality of memory sectors. Each memory sector includes a plurality of memory cells. The memory system further includes a controller configured to write data to the memory cell array in response to a writing signal. The controller is further configured to refresh a memory sector among the plurality of memory sectors each time a writing signal is provided. When N (N is a positive integer) memory cells are programmed, a programming current is less than or equal to about 0.75 mA*N.
Abstract:
A thermal image sensor including a chalcogenide material, and a method of fabricating the thermal image sensor are provided. The thermal image sensor includes a first metal layer formed on a substrate; a cavity exiting the first metal layer adapted for absorbing infrared rays; a bolometer resistor formed on the cavity and including a chalcogenide material; and a second metal layer formed on the bolometer resistor. The thermal image sensor includes a first metal layer formed on a substrate; an insulating layer formed on the first metal layer; a bolometer resistor formed on the insulating layer, including a chalcogenide material and having a thickness corresponding to ¼ of an infrared wavelength (λ); the thermal image sensor further includes a second metal layer formed on the bolometer resistor.
Abstract:
Disclosed may be a phase change material alloy, a phase change memory device including the same, and methods of manufacturing and operating the phase change memory device. The phase change material alloy may include Si and Sb. The alloy may be a Si—O—Sb alloy further including O. The Si—O—Sb alloy may be SixOySbz, wherein, when x/(x+z) may be x1, 0.05≦x1≦0.30, 0.00≦y≦0.50, and x+y+z may be 1. The Si—O—Sb alloy may further comprise an element other than Si, O, and Sb.
Abstract:
Provided is a phase-change memory using a single-element semimetallic thin film. The device includes a storage node having a phase-change material layer and a switching element connected to the storage node, wherein the storage node includes a single-element semimetallic thin film which is formed between an upper electrode and a lower electrode. Thus, the write speed of the phase-change memory can be increased compared with the case of a Ge—Sb—Te (GST) based material.
Abstract:
Disclosed may be a phase change material alloy, a phase change memory device including the same, and methods of manufacturing and operating the phase change memory device. The phase change material alloy may include Si and Sb. The alloy may be a Si—O—Sb alloy further including O. The Si—O—Sb alloy may be SixOySbz, wherein, when x/(x+z) may be x1, 0.05≦x1≦0.30, 0.00≦y≦0.50, and x+y+z may be 1. The Si—O—Sb alloy may further comprise an element other than Si, O, and Sb.
Abstract translation:公开了相变材料合金,包括该相变材料合金的相变存储器,以及制造和操作相变存储器件的方法。 相变材料合金可以包括Si和Sb。 该合金可以是还包含O的Si-O-Sb合金.Si-O-Sb合金可以是SixOySbz,其中当x /(x + z)可以是x1时,0.05 <= x1 <= 0.30,0.00 < = y <= 0.50,x + y + z可以为1.Si-O-Sb合金还可以包含除Si,O和Sb以外的元素。
Abstract:
A phase change material layer includes antimony (Sb) and at least one of indium (In) and gallium (Ga). A phase change memory device includes a storage node including a phase change material layer and a switching device connected to the storage node. The phase change material layer includes Sb and at least one of In and Ga.
Abstract:
Disclosed in this invention is a phase change optical recording material for a rewritable recording medium with a high speed crystallization and excellent erasibility, which comprises a composition having the formula of: (AaBbCc)x(GeaSbbTec)1−x wherein, A is an element selected from the elements belonging to the IVB group in the periodic table; B is an element selected from the elements belonging to the VB group in the periodic table; C is an element selected from the elements belonging to the VIB group in the periodic table; a, b and c are atomic ratios; x is a mole fraction in the range of 0 to 1; and at least one of A, B and C has a higher atomic number and thus a smaller diatomic bond strength than that of the corresponding element in the GeSbTe part.
Abstract:
Provided are an imaging device implementing pseudo correlated double sampling (CDS), a pixel of the imaging device and a control method of the image device. The imaging device includes: a pixel array including a pixel, the pixel including a reset transistor to control a reset of the pixel, a row select transistor to control a selection of the pixel to be read out, and a photodiode configured to generate a current in response to incident light; a readout circuit configured to read out an output signal of the pixel, based on the detected incident light, via a pixel output line; a feedback loop configured to receive a voltage from the pixel output line and to apply a reset gate voltage to a gate terminal of the reset transistor based on the received voltage; and a controller configured to control an application of a row select signal to the row select transistor to select the pixel to be read out, and to selectively add an offset to the photodiode to prevent the pixel from being reset despite the reset gate voltage applied to the reset transistor.
Abstract:
A method of operating an image sensor includes: thermoelectrically cooling a pixel using a thermoelectric element having a thermoelectric-junction integrated to the pixel; and performing a photoelectric conversion operation using the thermoelectric element. An image sensor includes a pixel and a readout circuit. The pixel includes a thermoelectric element having a thermoelectric-junction, and the readout circuit is configured to control the pixel such that the thermoelectric element performs a thermoelectric-cooling operation and a photoelectric conversion operation.
Abstract:
An image sensor includes a pixel array and a row driver block. The pixel array includes a plurality of subpixel groups, each including a plurality of subpixels. Each of the plurality of subpixels is configured to generate a subpixel signal corresponding to photocharge accumulated in response to a photon. The row driver block is configured to generate a first control signal to control the subpixels included in each of the plurality of subpixel groups to accumulate the photocharge in parallel from a first time point to a second time point.