公开(公告)号：US20070029682A1

公开(公告)日：2007-02-08

申请号：US11498179

申请日：2006-08-03

Applicant: Takayuki Aoki ,  Toshio Shiobara

Inventor： Takayuki Aoki ,  Toshio Shiobara

IPC: H01L23/29

CPC classification number: H01L23/293 ,  C08G59/621 ,  C08K5/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a cure accelerator, (E) an adhesion promoter, and (F) a metal oxide. The metal oxide (F) is a combination of a magnesium/aluminum ion exchanger, a hydrotalcite ion exchanger, and a rare earth oxide in a ratio of 0.5-20:0.5-20:0.01-10 pbw, relative to 100 pbw of epoxy resin (A) and curing agent (B) combined.

Abstract translation: 提供一种环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）无机填料，（D）固化促进剂，（E）粘合促进剂和（F）金属 氧化物。 金属氧化物（F）是镁/铝离子交换剂，水滑石离子交换剂和稀土氧化物的组合，相对于100pbw的环氧树脂，其比例为0.5-20:0.5-20:0.01-10pbw 树脂（A）和固化剂（B）组合。

公开(公告)号：USD528573S1

公开(公告)日：2006-09-19

申请号：US29238142

申请日：2005-09-13

Applicant: Takayuki Aoki ,  Takeo Imanaka ,  Hitoshi Mizuno

Designer： Takayuki Aoki ,  Takeo Imanaka ,  Hitoshi Mizuno

公开(公告)号：US07095125B2

公开(公告)日：2006-08-22

申请号：US10617827

申请日：2003-07-14

Applicant: Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC: H01L23/29

CPC classification number: H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31511 ,  C08L83/00 ,  H01L2924/00

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

公开(公告)号：US06894091B2

公开(公告)日：2005-05-17

申请号：US09883276

申请日：2001-06-19

Applicant: Shoichi Osada ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Shigeki Ino

Inventor： Shoichi Osada ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Shigeki Ino

IPC: C08K3/00 ,  C08G59/28 ,  C08G59/62 ,  C08K9/02 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08K5/00

CPC classification number: H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  C08L61/04 ,  H01L2924/00

Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

Abstract translation: 一种半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物和（D）每100重量份组分（A）300-900重量份， 和（B）组合的无机填料含有以组分（A）和（B）的重量计为1.5-20重量％的氮原子。 尽管没有卤化环氧树脂和三氧化锑，组合物的固化部分表现出高温能力和阻燃性。

公开(公告)号：US06860134B2

公开(公告)日：2005-03-01

申请号：US09961489

申请日：2001-09-25

Applicant: Kunio Miyauchi ,  Takayuki Aoki ,  Ichiro Takahashi

Inventor： Kunio Miyauchi ,  Takayuki Aoki ,  Ichiro Takahashi

IPC: B21D24/00 ,  B21C45/00 ,  B21D22/20 ,  B21D22/30 ,  B21D37/01

CPC classification number: B21D22/30 ,  B21C45/00

Abstract: In press forming including ironing, an elastically deformable material is used for a part of ironing die contacting to the work material under a higher pressure than designed, for taking the formed product out from the die easily in a case that the ironing die and the formed product are very close in size to each other, and thereby improving the efficiency of production.

Abstract translation: 在包括熨烫的压制成型中，可弹性变形的材料用于在比设计的更高的压力下与工件接触的一部分熨烫模具，用于在熨烫模具和形成的模具的情况下容易地将模制产品从模具中取出 产品的尺寸非常接近，从而提高了生产效率。

公开(公告)号：US06500564B1

公开(公告)日：2002-12-31

申请号：US09641817

申请日：2000-08-18

Applicant: Toshio Shiobara ,  Kazuhiro Arai ,  Hidenori Mizushima ,  Shigeki Ino ,  Yasuo Kimura ,  Takayuki Aoki

Inventor： Toshio Shiobara ,  Kazuhiro Arai ,  Hidenori Mizushima ,  Shigeki Ino ,  Yasuo Kimura ,  Takayuki Aoki

IPC: H01L2912

CPC classification number: H01L23/293 ,  C08G59/188 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31525 ,  Y10T428/31529 ,  C08L61/04 ,  H01L2924/00

Abstract: An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

Abstract translation: 包含（A）多官能环氧树脂，（B）酚醛树脂，（C）无机填料和（D）具有平均粒度为0.5-50μm的固化催化剂的微胶囊的环氧树脂组合物适用于半导体 封装封装，因为它使封装的翘曲最小化，并具有令人满意的催化剂潜伏期，储存稳定性和固化。

公开(公告)号：US06221509B1

公开(公告)日：2001-04-24

申请号：US09291285

申请日：1999-04-14

Applicant: Tatsurou Hirano ,  Nobukazu Suzuki ,  Toshio Shiobara ,  Takayuki Aoki ,  Shoichi Osada

Inventor： Tatsurou Hirano ,  Nobukazu Suzuki ,  Toshio Shiobara ,  Takayuki Aoki ,  Shoichi Osada

IPC: H01L2912

CPC classification number: H01L23/295 ,  C08K3/34 ,  C08K7/18 ,  H01B3/40 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L63/00 ,  H01L2924/00

Abstract: In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic filler, allow easy control of the coefficient of thermal expansion, and provide high-quality cured products having improved thermal conductivity and low moisture absorption.

Abstract translation: 在包含环氧树脂，固化剂和无机填料的半导体封装环氧树脂组合物中，1-90重量％的无机填料是球形方英石。 组合物能够实现更高的无机填料负载，容易控制热膨胀系数，并提供具有改善的导热性和低吸湿性的高质量固化产物。

公开(公告)号：US5668440A

公开(公告)日：1997-09-16

申请号：US443157

申请日：1995-05-17

Applicant: Shinji Inukai ,  Kazuo Takita ,  Makoto Nishizawa ,  Akira Itoh ,  Kazuyoshi Okamura ,  Kazuiki Uchida ,  Takayuki Aoki ,  Kazuhiko Yoshikawa ,  Akihiro Yonezawa ,  Hiroki Sasaki

Inventor： Shinji Inukai ,  Kazuo Takita ,  Makoto Nishizawa ,  Akira Itoh ,  Kazuyoshi Okamura ,  Kazuiki Uchida ,  Takayuki Aoki ,  Kazuhiko Yoshikawa ,  Akihiro Yonezawa ,  Hiroki Sasaki

IPC: H01J9/20 ,  H01J61/30 ,  H01J61/35 ,  H01J61/52

CPC classification number: H01J9/20 ,  H01J61/302 ,  H01J61/35 ,  H01J61/52 ,  H01J61/82 ,  H01J65/048

Abstract: In a discharge lamp having a discharge medium sealed in a discharge tube assembly including electrodes for producing a discharge, a nitride layer is formed on a surface of an envelope tube of the discharge tube assembly. The nitride layer is formed by substituting an oxygen component of an oxide constituting the tube wall of the envelope tube with nitrogen, and exhibits a continuous and smooth reduction in nitride content in the direction of depth. This chemically stable nitride layer prevents a reaction between the discharge medium and the tube wall material, and removal or injection of the discharge medium. In addition, since the nitride layer also exhibits a continuous change in thermal expansion coefficient in the direction of depth, the thermal stress is reduced, and cracking, peeling, removal, and the like do not occur.

Abstract translation: 在具有密封在包括用于产生放电的电极的放电管组件中的放电介质的放电灯中，在放电管组件的封套管的表面上形成氮化物层。 氮化物层通过用氮代替构成包络管的管壁的氧化物成分而形成，并且在深度方向上显示氮化物含量的连续且平滑的还原。 这种化学稳定的氮化物层防止了放电介质和管壁材料之间的反应，以及去除或注入放电介质。 此外，由于氮化物层在深度方向上的热膨胀系数也呈连续变化，所以热应力降低，不会发生开裂，剥离，剥离等。

公开(公告)号：US5422075A

公开(公告)日：1995-06-06

申请号：US83401

申请日：1993-05-27

Applicant: Yukio Saito ,  Koichi Sekiya ,  Yoshihiro Sato ,  Takeshi Kohno ,  Hiroaki Takahasi ,  Kunio Terada ,  Takayuki Aoki

Inventor： Yukio Saito ,  Koichi Sekiya ,  Yoshihiro Sato ,  Takeshi Kohno ,  Hiroaki Takahasi ,  Kunio Terada ,  Takayuki Aoki

IPC: G01N21/75 ,  G01J1/16 ,  G01N21/27 ,  G01N21/76 ,  G01N21/01

CPC classification number: G01N21/274 ,  G01N21/76 ,  G01J2001/161 ,  G01J2001/1663

Abstract: The present invention relates to a chemical luminescence-detecting apparatus that is provided with a plurality of optical detectors different in sensitivity in the vicinity of a photometric cell. A ratio of outputs from the optical detectors based on intensity of luminescence is previously determined and stored. Signal processing can multiply an output of a low sensitivity optical detector by a factor determined by the stored ratio to measure the intensity of luminescence so that a conversion value corresponding to an equivalent output from a high sensitivity optical detector may be obtained when the output from the high sensitivity optical detector has become saturated.

Abstract translation: 本发明涉及一种化学发光检测装置，其具有在光度计单元附近灵敏度不同的多个光学检测器。 预先确定并存储来自基于发光强度的光学检测器的输出的比率。 信号处理可以将低灵敏度光学检测器的输出乘以由存储比率确定的因子，以测量发光强度，使得当来自高灵敏度光学检测器的输出时可以获得对应于来自高灵敏度光学检测器的等效输出的转换值 高灵敏度光检测器已经饱和。

公开(公告)号：US5418266A

公开(公告)日：1995-05-23

申请号：US187262

申请日：1994-01-27

Applicant: Toshio Shiobara ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi

Inventor： Toshio Shiobara ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi

IPC: C08G59/20 ,  C08G59/00 ,  C08G59/08 ,  C08G59/32 ,  C08K3/00 ,  C08L63/00 ,  C08L63/04 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/293 ,  C08G59/08 ,  C08G59/3218 ,  C08L63/00 ,  C08L63/04 ,  H01B3/40 ,  H01L2924/0002

Abstract: An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a specific phenolic resin preferably in admixture with a conventional phenolic resin, especially naphthalene ring-containing phenolic resin, and (C) an inorganic filler shows good flow and cures to products having low modulus of elasticity, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

Abstract translation: 包含（A）含萘环的环氧树脂的环氧树脂组合物，（B）优选与常规酚醛树脂（特别是含萘环酚醛树脂）混合的特定酚醛树脂和（C）无机填料显示出良好的流动性 并且固化成具有低弹性模量，低膨胀系数，高Tg而与低应力无关的产品和最小化的吸水性。 然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。