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    Cableless battery integration
    24.
    发明授权
    Cableless battery integration 有权

    公开(公告)号：US09735528B2

    公开(公告)日：2017-08-15

    申请号：US13854820

    申请日：2013-04-01

    Applicant: Apple Inc.

    Inventor： Ron A. Hopkinson ,  Eric A. Knopf ,  Eugene Kim ,  Peter M. Arnold ,  Jim Hwang ,  Matthew P. Casebolt

    IPC: H02J7/00 ,  H01R31/06 ,  G06F1/26 ,  H01M2/10 ,  H01M10/42

    CPC classification number: H01R31/06 ,  G06F1/26 ,  H01M2/1022 ,  H01M2010/4278

    Abstract: An interposer for electrically coupling a battery-management circuit board in a power supply and a motherboard is described. The interposer includes: a substrate having a top surface and a bottom surface; first spring connectors, disposed on the top surface, which electrically couple to the battery-management circuit board; and second spring connectors, disposed on the bottom surface and electrically coupled to the first spring connectors, which electrically couple to the motherboard. Spring connectors in a first subset of the first and second spring connectors that convey power signals have a first vertical height, and spring connectors in a second subset of the first and second spring connectors that convey monitoring signals for the power supply have a second, smaller vertical height. In this way, the first subset is activated before the second subset is activated, thereby ensuring that an electrical path for the power signals is established first.

    KEYBOARD
    25.
    发明申请
    KEYBOARD 有权
    键盘

    公开(公告)号：US20160042891A1

    公开(公告)日：2016-02-11

    申请号：US14455608

    申请日：2014-08-08

    Applicant: Apple Inc.

    Inventor： Christiaan A. Ligtenberg ,  Mikael M. Silvanto ,  Ron A. Hopkinson ,  Nicholas Alan Rundle

    IPC: H01H13/79 ,  H01H13/86 ,  H01H11/00 ,  H01H13/785

    CPC classification number: H01H13/86 ,  G06F1/1616 ,  G06F1/1656 ,  G06F1/1662 ,  G06F3/02 ,  H01H11/00 ,  H01H13/702 ,  H01H13/705 ,  H01H13/785 ,  H01H13/79 ,  H01H13/83 ,  H01H13/88 ,  H01H2223/036 ,  H01H2223/04 ,  H01H2231/002

    Abstract: Embodiments of keyboards having variations of electrically connecting keys to an internal component of an electronic device are described. Some embodiments include positioning several rows of conductive layers below several rows of keys. The conductive layers may be configured to receive a signal indicating a key has been depressed. Also, the internal component may be configured to scan the conductive layers to determine whether a key or keys have been depressed. In some embodiments, the conductive layers lie outside a portion of the electronic device in which internal components are traditionally located. In some embodiments, a substrate may be integrally connected with the keyboard. The substrate may receive some internal components of the electronic device.

    Abstract translation: 描述具有将键电连接到电子设备的内部部件的变型的键盘的实施例。 一些实施例包括将多行导电层定位在几排键下面。 导电层可以被配置为接收指示已经按下键的信号。 此外，内部组件可以被配置为扫描导电层以确定键或键是否被按下。 在一些实施例中，导电层位于内部组件传统上位于其中的电子设备的一部分的外部。 在一些实施例中，衬底可以与键盘一体地连接。 基板可以接收电子设备的一些内部部件。

    SOLID-STATE DRIVE WITH PASSIVE HEAT TRANSFER
    27.
    发明申请
    SOLID-STATE DRIVE WITH PASSIVE HEAT TRANSFER 有权
    固态传动与无源传热

    公开(公告)号：US20130329352A1

    公开(公告)日：2013-12-12

    申请号：US13683955

    申请日：2012-11-21

    Applicant: APPLE INC.

    Inventor： Jay S. Nigen ,  Ron A. Hopkinson ,  Derek J. Yap ,  Eric A. Knopf ,  William F. Leggett ,  Richard H. Tan

    IPC: H05K7/20 ,  F28F21/00 ,  G06F1/20

    CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

    Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

    Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。

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