公开(公告)号：US09578747B2

公开(公告)日：2017-02-21

申请号：US14827668

申请日：2015-08-17

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/11 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K1/028 ,  H05K1/0298 ,  H05K3/002 ,  H05K3/426 ,  Y10T29/49165

Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。

公开(公告)号：US09468101B2

公开(公告)日：2016-10-11

申请号：US14659977

申请日：2015-03-17

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  H05K3/06

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/092 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0397 ,  H05K2201/09845 ,  H05K2201/09854

Abstract: Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.

Abstract translation: 柔性电路板的尿素微孔结构及其制造方法。 在柔性电路板的第一导电层中形成第一通孔，并且限定第一暴露区域。 第二导电层包括形成在其中的第二通孔并且限定第二暴露区域。 电介质层包括与第二导电层的第二通孔对应的电介质层通孔。 导电膏层填充在第二导电层的第二通孔，电介质层的电介质层通孔和第一导电层的第一通孔中，导电膏层覆盖并电接触 第一导电层的第一暴露区域和第二导电层的第二暴露区域。

公开(公告)号：US09468099B2

公开(公告)日：2016-10-11

申请号：US14731709

申请日：2015-06-05

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/118 ,  H05K3/3405 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/10356 ,  H05K2201/2027

Abstract: Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.

Abstract translation: 公开了用于连接导体组件和柔性电路板的接触垫连接结构。 衬底具有其上形成有多个仰角垫的顶表面，并且分别位于接触垫之间的间隔区域中。 每个仰角垫具有高于接触垫的顶部接触表面的高度。 导体组件具有分别设置成与接触焊盘的顶部接触表面接触的暴露的导体，并且施加焊料材料以将暴露的导体分别焊接并固定在接触焊盘的顶部接触表面上的适当位置。 每个仰角垫包括在朝向基板的前边缘的方向延伸的延伸部分。

公开(公告)号：US09225134B2

公开(公告)日：2015-12-29

申请号：US14138364

申请日：2013-12-23

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Chih-Heng Chuo ,  Kuo-Fu Su

IPC: H01R35/02 ,  H01R12/61 ,  H05K1/02 ,  H05K1/11 ,  H05K5/02

CPC classification number: H01R35/02 ,  H05K1/028 ,  H05K1/118 ,  H05K5/0226 ,  H05K2201/055 ,  H05K2201/2009 ,  Y10T29/49002

Abstract: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly. In other applications, a reinforcement plate is included to reinforce the terminal distribution section of the flexible circuit board.

Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组装结构。 利用形成在作为中心线的预先准备好的柔性电路板上的预折线，将柔性电路板的连接部折叠到端子分配部，然后将连接部和延伸片卷起 在朝向终端分配部分的方向上，将连接部分形成为卷绕体，其中延伸的片材缠绕在卷绕体上以提供保护效果。 然后将卷绕的主体穿过铰链组件的孔插入，使得在卷绕体完全通过铰链组件的孔之后，柔性电路板的延伸部分位于铰链组件的孔中，第一端 并且第二端分别设置在铰链组件的孔的相对端。 在其他应用中，包括加强板以加强柔性电路板的端子分配部分。

公开(公告)号：US09173284B2

公开(公告)日：2015-10-27

申请号：US14068029

申请日：2013-10-31

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/02 ,  H01B7/08 ,  H05K3/28

CPC classification number: H05K1/024 ,  H01B7/0838 ,  H01B7/0861 ,  H05K1/0242 ,  H05K1/025 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/0323 ,  H05K2201/09236 ,  H05K2201/098 ,  H05K2201/09881

Abstract: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.

Abstract translation: 柔性电路板的平面化覆盖层结构包括通过第一粘合剂层粘合到布置在柔性电路板的基板上的每个导电信号线的表面的绝缘层。 分别在相邻的导电信号线之间形成的分离区域各自形成有填充层，使得填充层在分离区域中为第一粘合剂层提供平坦化高度，并且平坦化高度基本上等于 导电信号线。 填充层可以替代地具有比导体层的表面高一个覆盖高度的高度，使得第一粘合剂层在分离区域中具有平坦化高度，并且平坦化高度基本上等于高度 的导电信号线和覆盖高度。