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公开(公告)号:US20180025287A1
公开(公告)日:2018-01-25
申请号:US15275355
申请日:2016-09-24
Applicant: Apple Inc.
Inventor: Binu K. Mathew , Julia C. Ng , Jared L. Zerbe
Abstract: Systems and methods are disclosed for a server generating a plurality of proxy prediction models for each of a plurality of applications for use by client devices. Providing a prediction model based on a data distribution that more closely matches the user private data of the actual user of the client device, as opposed to a generic model, can improve the accuracy of predictions and improve the benefits to the user of the client device. The plurality of prediction models are generated by a server and provided to a plurality of clients. For a particular application, a client device can use previously collected private user data to select one of the plurality of prediction models for the application as being a closest matching prediction model to use for a particular user.
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公开(公告)号:US20170141116A1
公开(公告)日:2017-05-18
申请号:US15420572
申请日:2017-01-31
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L27/10 , H01L23/498 , H01L25/18 , H01L49/02 , H01L23/00 , H01L25/065 , H01L23/48 , H01L23/64
CPC classification number: H01L27/101 , H01G4/228 , H01L23/13 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/1033 , H01L2924/12042 , H01L2924/1205 , H01L2924/1427 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/15153 , H01L2924/15159 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US20200027881A1
公开(公告)日:2020-01-23
申请号:US16529043
申请日:2019-08-01
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L27/10 , H01L23/13 , H01L23/64 , H01L23/00 , H01L25/065 , H01L25/16 , H01L25/18 , H01L23/498 , H01G4/228 , H01L49/02 , H01L23/48
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US20180366466A1
公开(公告)日:2018-12-20
申请号:US16042582
申请日:2018-07-23
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L27/10 , H01L23/13 , H01L23/48 , H01L23/498 , H01G4/228 , H01L25/16 , H01L25/065 , H01L23/00 , H01L25/18 , H01L49/02 , H01L23/64 , H01L25/10 , H01L23/50
CPC classification number: H01L27/101 , H01G4/228 , H01L23/13 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/32225 , H01L2224/45099 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00012 , H01L2924/00014 , H01L2924/1033 , H01L2924/12042 , H01L2924/1205 , H01L2924/1427 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/15153 , H01L2924/15159 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US20170324417A1
公开(公告)日:2017-11-09
申请号:US15146374
申请日:2016-05-04
Applicant: Apple Inc.
Inventor: Brian S. Leibowitz , Jared L. Zerbe , Sanjay Pant
Abstract: Techniques are disclosed relating to rapidly downshifting the output frequency of an oscillator. In some embodiments, the oscillator is configured to operate in a closed-loop mode in which negative feedback is used to maintain a particular output frequency (e.g., in a phase-locked loop (PLL)). In some embodiments, the negative feedback loop is configured to maintain the output of the oscillator at a particular frequency based on a reference clock signal and the output of the oscillator. The nature of a negative feedback loop may render rapid frequency changes difficult, e.g., because of corrections by the loop. Therefore, in some embodiments, the loop is configured to switch to an open-loop mode in which a control input to the oscillator is fixed. In some embodiments, the loop switches to open-loop mode in response to a trigger signal and control circuitry forces the oscillator to a new target frequency.
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公开(公告)号:US20150041955A1
公开(公告)日:2015-02-12
申请号:US14077512
申请日:2013-11-12
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
CPC classification number: H01L27/101 , H01G4/228 , H01L23/13 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/1033 , H01L2924/12042 , H01L2924/1205 , H01L2924/1427 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/15153 , H01L2924/15159 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
Abstract translation: 描述了包括电力消耗装置(例如SOC装置)的半导体器件封装。 电力消耗装置可以包括一个或多个电流消耗元件。 无源设备可以耦合到功率消耗设备。 无源器件可以包括形成在半导体衬底上的多个无源元件。 无源元件可以布置在半导体衬底上的结构阵列中。 功率消耗装置和无源装置可以使用一个或多个终端来耦合。 无源器件和功耗器件耦合可以被配置成使得功率消耗器件功能地确定无源器件元件将被使用的方式。
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