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公开(公告)号:US11063046B2
公开(公告)日:2021-07-13
申请号:US16529043
申请日:2019-08-01
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L27/10 , H01L23/13 , H01L23/64 , H01L23/00 , H01L25/065 , H01L25/16 , H01L25/18 , H01L23/498 , H01G4/228 , H01L49/02 , H01L23/48 , H01L25/10 , H01L23/50
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US10056384B2
公开(公告)日:2018-08-21
申请号:US15420572
申请日:2017-01-31
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L21/02 , H01L27/10 , H01L23/48 , H01L23/13 , H01L23/64 , H01L23/00 , H01L25/065 , H01L25/16 , H01L25/18 , H01L23/498 , H01G4/228 , H01L49/02 , H01L25/10 , H01L23/50
CPC classification number: H01L27/101 , H01G4/228 , H01L23/13 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/32225 , H01L2224/45099 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00012 , H01L2924/00014 , H01L2924/1033 , H01L2924/12042 , H01L2924/1205 , H01L2924/1427 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/15153 , H01L2924/15159 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US09720033B2
公开(公告)日:2017-08-01
申请号:US14868954
申请日:2015-09-29
Applicant: Apple Inc.
Inventor: Jafar Savoj , Brian S. Leibowitz , Emerson S. Fang
CPC classification number: G01R31/2874 , G01R31/2884 , G01R31/30 , G01R35/005 , G06F1/206 , G06F1/26 , G06F1/3203 , H03K19/003
Abstract: An apparatus and method for performing on-chip parameter measurement is disclosed. In one embodiment, an IC includes a number of functional circuit blocks each having one or more sensors for measuring parameters such as voltage and temperature. Each of the functional blocks includes circuitry coupled to receive power from a local supply voltage node. Similarly, the circuitry in each of the sensors is also coupled to receive power from the corresponding local supply voltage node. Each of the sensors may be calibrated to compensate for process, voltage, and temperature variations. Various methods based on characterization of the sensors may be used to perform the calibrations.
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公开(公告)号:US20200235856A1
公开(公告)日:2020-07-23
申请号:US16253100
申请日:2019-01-21
Applicant: Apple Inc.
Inventor: Jafar Savoj , Praveen R. Singh , Brian S. Leibowitz , Emerson S. Fang
IPC: H04L1/02 , H03K19/0175
Abstract: A system and method for efficiently transporting data in a computing system are contemplated. In various embodiments, a computing system includes a source, a destination and multiple lanes between them for transporting data. Multiple receivers in the destination has a respective termination resistor connected to a single integrating capacitor, which provides a reference voltage to the multiple receivers. The receivers reconstruct the received data by comparing the corresponding input signals to the reference voltage. The source includes a table storing code words. The source maps a generated data word to a code word, which is sent to the destination. The destination maps the received code word to the data word. The values of the code words are selected to maintain a nearly same number of Boolean ones on the multiple lanes over time as a number of Boolean zeroes.
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公开(公告)号:US10521391B1
公开(公告)日:2019-12-31
申请号:US16204252
申请日:2018-11-29
Applicant: Apple Inc.
Inventor: Jafar Savoj , Jose A. Tierno , Sanjeev K. Maheshwari , Brian S. Leibowitz , Pradeep R. Trivedi , Gin Yee , Emerson S. Fang
Abstract: A system and method for efficiently transporting data across lanes. A computing system includes an interconnect with lanes for transporting data between a source and a destination. When a source receives an indication of a bandwidth requirement change from a first data rate to a second data rate, the transmitter in the source sends messages to the receiver in the destination. The messages indicate that the data rate is going to change and reconfiguration of one or more lanes will be performed. The transmitter selects one or more lanes for transporting data at the second data rate. The transmitter maintains data transport at the first data rate while reconfiguring the selected one or more lanes to the second data rate. After completing the reconfiguration, the transmitter transports data at the second data rate on the selected one or more lanes while preventing data transport on any unselected lanes.
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公开(公告)号:US20170141116A1
公开(公告)日:2017-05-18
申请号:US15420572
申请日:2017-01-31
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L27/10 , H01L23/498 , H01L25/18 , H01L49/02 , H01L23/00 , H01L25/065 , H01L23/48 , H01L23/64
CPC classification number: H01L27/101 , H01G4/228 , H01L23/13 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/1033 , H01L2924/12042 , H01L2924/1205 , H01L2924/1427 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/15153 , H01L2924/15159 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US12068324B2
公开(公告)日:2024-08-20
申请号:US17358790
申请日:2021-06-25
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L27/10 , H01G4/228 , H01L23/00 , H01L23/13 , H01L23/48 , H01L23/498 , H01L23/64 , H01L25/065 , H01L25/16 , H01L25/18 , H01L49/02 , H01L23/50 , H01L25/10
CPC classification number: H01L27/101 , H01G4/228 , H01L23/13 , H01L23/481 , H01L23/49816 , H01L23/642 , H01L24/14 , H01L24/32 , H01L24/73 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L28/40 , H01L23/49827 , H01L23/50 , H01L24/16 , H01L24/48 , H01L25/105 , H01L2224/0401 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/32225 , H01L2224/45099 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00012 , H01L2924/00014 , H01L2924/1033 , H01L2924/12042 , H01L2924/1205 , H01L2924/1427 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/15153 , H01L2924/15159 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2924/15311 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00 , H01L2924/12042 , H01L2924/00 , H01L2924/00014 , H01L2224/45099 , H01L2924/00014 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US20210398980A1
公开(公告)日:2021-12-23
申请号:US17358790
申请日:2021-06-25
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L27/10 , H01L23/13 , H01L23/64 , H01L23/00 , H01L25/065 , H01L25/16 , H01L25/18 , H01L23/498 , H01G4/228 , H01L49/02 , H01L23/48
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US10411012B2
公开(公告)日:2019-09-10
申请号:US16042582
申请日:2018-07-23
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L27/10 , H01L23/48 , H01L23/13 , H01L23/64 , H01L23/00 , H01L25/065 , H01L25/16 , H01L25/18 , H01L23/498 , H01G4/228 , H01L49/02 , H01L25/10 , H01L23/50
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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公开(公告)号:US09595526B2
公开(公告)日:2017-03-14
申请号:US14077512
申请日:2013-11-12
Applicant: Apple Inc.
Inventor: Jared L. Zerbe , Emerson S. Fang , Jun Zhai , Shawn Searles
IPC: H01L21/02 , H01L27/10 , H01L23/48 , H01L23/13 , H01L23/64 , H01L25/16 , H01L25/18 , H01G4/228 , H01L49/02 , H01L23/00 , H01L25/065 , H01L25/10 , H01L23/498 , H01L23/50
CPC classification number: H01L27/101 , H01G4/228 , H01L23/13 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/1033 , H01L2924/12042 , H01L2924/1205 , H01L2924/1427 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/15153 , H01L2924/15159 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
Abstract translation: 描述了包括电力消耗装置(例如SOC装置)的半导体器件封装。 电力消耗装置可以包括一个或多个电流消耗元件。 无源设备可以耦合到功率消耗设备。 无源器件可以包括形成在半导体衬底上的多个无源元件。 无源元件可以布置在半导体衬底上的结构阵列中。 功率消耗装置和无源装置可以使用一个或多个终端来耦合。 无源器件和功耗器件耦合可以被配置成使得功率消耗器件功能地确定无源器件元件将被使用的方式。
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