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    Topography prediction using system state information
    21.
    发明授权
    Topography prediction using system state information 有权

    公开(公告)号：US10303812B2

    公开(公告)日：2019-05-28

    申请号：US15231487

    申请日：2016-08-08

    Applicant: Applied Materials, Inc.

    Inventor： Jimmy Iskandar ,  Chong Jiang ,  Michael D. Armacost ,  Bradley D. Schulze

    IPC: G06F17/50 ,  H01L21/66 ,  G01R31/28

    Abstract: Embodiments presented herein provide techniques for predicting the topography of a product produced from a manufacturing process. One embodiment includes generating a plurality of prediction models. Each of the plurality of prediction models corresponds to a respective one of a plurality of positional coordinates of a product produced from a manufacturing process. The method also includes receiving a set of user-specified input parameters to apply to the manufacturing control process. The method further includes generating a graphical representation of a topography map for the product for the user-specified of input parameters based on the plurality of prediction models.

    METHODS AND MECHANISMS FOR TRACE-BASED TRANSFER LEARNING
    22.
    发明申请
    METHODS AND MECHANISMS FOR TRACE-BASED TRANSFER LEARNING 有权

    公开(公告)号：US20250094829A1

    公开(公告)日：2025-03-20

    申请号：US18368311

    申请日：2023-09-14

    Applicant: Applied Materials, Inc.

    Inventor： Fei Li ,  Jimmy Iskandar ,  James Robert Moyne

    IPC: G06N5/022

    Abstract: An electronic device manufacturing system configured identify a machine-learning model trained to generate analytic or predictive data for a first substrate processing domain associated with a type of substrate processing system. The system is further configured to obtain first trace data pertaining to the first domain used to train the machine-learning model. The system is further configured to a transfer model for a second substrate processing domain associated with the type of substrate processing system. The transfer model is generated based on the first trace data pertaining to the first substrate processing domain and second trace data pertaining to the second substrate processing domain. Using the transfer model, at least one of the machine-learning model or current trace data associated with the second substrate processing domain is modified to enable the machine-learning model to generate analytic or predictive data associated with the second substrate processing domain.

    METHODS AND MECHANISMS FOR SECURE DATA SHARING
    24.
    发明申请
    METHODS AND MECHANISMS FOR SECURE DATA SHARING 有权

    公开(公告)号：US20240419813A1

    公开(公告)日：2024-12-19

    申请号：US18209821

    申请日：2023-06-14

    Applicant: Applied Materials, Inc.

    Inventor： Fei Li ,  Jimmy Iskandar ,  Michael D. Armacost

    IPC: G06F21/60 ,  G06F21/62 ,  H04L9/08

    Abstract: An electronic device manufacturing system configured to receive, by a first computing system, a request for manufacturing process data request. The system further uses a first cryptographic key controlled by a first entity and a second cryptographic key controlled by a second entity, a database management system to retrieve the manufacturing process data from a data store. The system further obtains, using the database management system, the manufacturing process data stored in the data store. The manufacturing process data is encrypted. The system further sends the encrypted manufacturing process data to a second computing system configured to perform one or more anonymization operations on the manufacturing process data.

    GUARDBANDS IN SUBSTRATE PROCESSING SYSTEMS
    25.
    发明公开
    GUARDBANDS IN SUBSTRATE PROCESSING SYSTEMS 审中-公开

    公开(公告)号：US20230376374A1

    公开(公告)日：2023-11-23

    申请号：US17748783

    申请日：2022-05-19

    Applicant: Applied Materials, Inc.

    Inventor： Jimmy Iskandar ,  Fei Li ,  James Robert Moyne

    IPC: G06F11/07 ,  G06F11/34

    CPC classification number: G06F11/0793 ,  G06F11/0721 ,  G06F11/3495

    Abstract: A method includes identifying trace data including a plurality of data points, the trace data being associated with production, via a substrate processing system, of substrates having property values that meet threshold values. The method further includes determining, based on a guardband, guardband violation data points of the plurality of data points of the trace data. The method further includes determining, based on the guardband violation data points, guardband violation shape characterization. Classification of additional guardband violation data points of additional trace data is to be based on the guardband violation shape characterization. Performance of a corrective action associated with the substrate processing system is based on the classification.

    Methods and systems for applying run-to-run control and virtual metrology to reduce equipment recovery time
    26.
    发明授权
    Methods and systems for applying run-to-run control and virtual metrology to reduce equipment recovery time 有权

    公开(公告)号：US11022968B2

    公开(公告)日：2021-06-01

    申请号：US16538676

    申请日：2019-08-12

    Applicant: Applied Materials, Inc.

    Inventor： Jimmy Iskandar ,  Jianping Zou ,  Parris C. M. Hawkins ,  James Moyne

    IPC: G05B23/02

    Abstract: Described herein are methods, apparatuses, and systems for reducing equipment repair time. Disclosed methods include collecting data including test substrate data or other metrology data and fault detection data for maintenance recovery of at least one manufacturing tool in a manufacturing facility. Disclosed methods include determining a relationship between tool parameter settings for the at least one manufacturing tool and at least some collected data including the test substrate data. The disclosure includes utilizing virtual metrology predictive algorithms and at least some collected data to obtain a metrology prediction and applying multivariate run-to-run (R2R) control modeling to obtain a tool parameter adjustment for at least one target parameter for the at least one manufacturing tool. The disclosure further includes applying the R2R control modeling to obtain tool parameter adjustments for at least one manufacturing tool.

    Semiconductor device search and classification
    27.
    发明授权
    Semiconductor device search and classification 有权

    公开(公告)号：US10901407B2

    公开(公告)日：2021-01-26

    申请号：US15610280

    申请日：2017-05-31

    Applicant: Applied Materials, Inc.

    Inventor： Jimmy Iskandar ,  Michael D. Armacost ,  Heng Hao

    IPC: G05B23/02 ,  G06F16/248

    Abstract: Embodiments provide techniques for compressing sensor data collected within a manufacturing environment. One embodiment monitors a plurality of runs of a recipe for fabricating one or more semiconductor devices within a manufacturing environment to collect runtime data from a plurality of sensors within the manufacturing environment. The collected runtime data is compressed by generating, for each of the plurality of sensors and for each of the plurality of runs, a respective representation of the corresponding runtime data that describes a shape of the corresponding runtime data and a magnitude of the corresponding runtime data. A query specifying one or more runtime data attributes is received and executed against the compressed runtime data to generate query results, by comparing the one or more runtime data attributes to at least one of the generated representations of runtime data.

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