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21.发明授权公开(公告)号：US11791224B2
公开(公告)日：2023-10-17
申请号：US17317232
申请日：2021-05-11
Applicant: Applied Materials, Inc.
Inventor： Kun Xu , Kiran Lall Shrestha , Doyle E. Bennett , David Maxwell Gage , Benjamin Cherian , Jun Qian , Harry Q. Lee
IPC: B24B37/013 , B24B49/10 , G06N3/08 , H01L21/321 , H01L21/66 , H01L21/304 , G06F17/15
CPC classification number: H01L22/14 , B24B37/013 , B24B49/105 , G06F17/15 , G06N3/08 , H01L21/304 , H01L21/3212 , H01L22/12 , H01L22/26
Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.
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公开(公告)号：US20220184770A1
公开(公告)日：2022-06-16
申请号：US17122819
申请日：2020-12-15
Applicant: Applied Materials, Inc.
Inventor： Kun Xu , Andrew Siordia
IPC: B24B37/005 , G01B7/06 , B24B37/04 , B24B37/10
Abstract: A method of chemical mechanical polishing includes bringing a conductive layer of a substrate into contact with a polishing pad, supplying a polishing liquid to the polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, and determining a sequence of thickness values for the conductive layer based on the sequence of signal values. Determining the sequence of thickness values includes at least partially compensating for a contribution of the polishing liquid to the signal values.
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公开(公告)号：US20210402551A1
公开(公告)日：2021-12-30
申请号：US17344779
申请日：2021-06-10
Applicant: Applied Materials, Inc.
Inventor： Kun Xu , Benjamin Cherian , Jun Qian , Kiran Lall Shrestha
IPC: B24B37/013 , G06N3/08
Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.
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24.发明申请公开(公告)号：US20210354265A1
公开(公告)日：2021-11-18
申请号：US17317232
申请日：2021-05-11
Applicant: Applied Materials, Inc.
Inventor： Kun Xu , Kiran Lall Shrestha , Doyle E. Bennett , David Maxwell Gage , Benjamin Cherian , Jun Qian , Harry Q. Lee
IPC: B24B49/10 , G06N3/08 , H01L21/321 , B24B37/013
Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.
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公开(公告)号：US11079459B2
公开(公告)日：2021-08-03
申请号：US15867543
申请日：2018-01-10
Applicant: Applied Materials, Inc.
Inventor： Kun Xu , Ingemar Carlsson , Shih-Haur Shen , Boguslaw A. Swedek , Tzu-Yu Liu
IPC: G01R35/00 , C09G1/00 , B24B37/04 , B24B37/005 , C09G1/02
Abstract: A first resistivity value and a correlation function relating thickness of a conductive layer having the first resistivity value to a signal from an in-situ monitoring system are stored. A second resistivity value for a conductive layer on a substrate is received. A sequence of signal values that depend on thickness of the conductive layer is received from an in-situ electromagnetic induction monitoring system that monitors the substrate during polishing. A sequence of thickness values is generated based on the sequence of signal values and the correlation function. For at least some thickness values of the sequence of thickness values adjusted thickness values are generated that compensate for variation between the first resistivity value and the second resistivity value to generate a sequence of adjusted thickness values. A polishing endpoint is detected or an adjustment for a polishing parameter is determined based on the sequence of adjusted thickness values.
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Patent Agency Ranking
公开(公告)号：US10994389B2
公开(公告)日：2021-05-04
申请号：US15953203
申请日：2018-04-13
Applicant: Applied Materials, Inc.
Inventor： Kun Xu , Hassan G. Iravani , Denis Ivanov , Boguslaw A. Swedek , Shih-Haur Shen , Harry Q. Lee , Benjamin Cherian
IPC: B24B37/013 , H01L21/306 , H01L21/66 , G06N3/08 , G06N3/04
Abstract: A method of polishing a layer on the substrate at a polishing station includes the actions of monitoring the layer during polishing at the polishing station with an in-situ monitoring system to generate a plurality of measured signals for a plurality of different locations on the layer; generating, for each location of the plurality of different locations, an estimated measure of thickness of the location, the generating including processing the plurality of measured signals through a neural network; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on each estimated measure of thickness.
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公开(公告)号：US10562148B2
公开(公告)日：2020-02-18
申请号：US15727288
申请日：2017-10-06
Applicant: Applied Materials, Inc.
Inventor： Shih-Haur Shen , Kun Xu , Tzu-Yu Liu
Abstract: A method of controlling processing of a substrate includes generating, based on a signal from an in-situ monitoring system, first and second sequences of characterizing values indicative of a physical property of a reference zone and a control zone, respectively, on a substrate. A reference zone rate and a control zone rate are determined from the first and sequence of characterizing values, respectively. An error value is determined by comparing characterizing values for the reference zone and control zone. An output parameter value for the control zone is generated based on at least the error value and a dynamic nominal control zone value using a proportional-integral-derivative control algorithm, and the dynamic nominal control zone value is generated in a second control loop based on at least the reference zone rate and the control zone rate. The control zone of the substrate is processed according to the output parameter value.
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公开(公告)号：US20190299356A1
公开(公告)日：2019-10-03
申请号：US16368649
申请日：2019-03-28
Applicant: Applied Materials, Inc.
Inventor： Kun Xu , Denis Ivanov , Harry Q. Lee , Jun Qian
IPC: B24B37/005 , B24B49/10 , H01L21/67 , G05B19/048 , G06N20/00 , G06N3/063
Abstract: Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data from the in-situ monitoring system. For each scan, a portion of the measured signal values are adjusted based on the thickness of the polishing pad. For each scan of the plurality of scans and each location of the plurality of different locations, a value is generated representing a thickness of the layer at the location. This includes processing the adjusted signal values using one or more processors configured by machine learning. A polishing endpoint is detected or a polishing parameter is modified based on the values representing the thicknesses at the plurality of different locations.
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公开(公告)号：US10391610B2
公开(公告)日：2019-08-27
申请号：US15726148
申请日：2017-10-05
Applicant: Applied Materials, Inc.
Inventor： Hassan G. Iravani , Kun Xu , Denis Ivanov , Shih-Haur Shen , Boguslaw A. Swedek
Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.
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公开(公告)号：US20180304435A1
公开(公告)日：2018-10-25
申请号：US15953203
申请日：2018-04-13
Applicant: Applied Materials, Inc.
Inventor： Kun Xu , Hassan G. Iravani , Denis Ivanov , Boguslaw A. Swedek , Shih-Haur Shen , Harry Q. Lee , Benjamin Cherian
IPC: B24B37/013 , H01L21/306 , H01L21/66 , G06N3/08
CPC classification number: B24B37/013 , G06N3/08 , H01L21/30625 , H01L22/26
Abstract: A method of polishing a layer on the substrate at a polishing station includes the actions of monitoring the layer during polishing at the polishing station with an in-situ monitoring system to generate a plurality of measured signals for a plurality of different locations on the layer; generating, for each location of the plurality of different locations, an estimated measure of thickness of the location, the generating including processing the plurality of measured signals through a neural network; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on each estimated measure of thickness.
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