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    Flexible display substrate and manufacturing method thereof, and flexible display device
    21.
    发明授权
    Flexible display substrate and manufacturing method thereof, and flexible display device 有权
    灵活的显示基板及其制造方法，以及柔性显示装置

    公开(公告)号：US09337212B2

    公开(公告)日：2016-05-10

    申请号：US14408073

    申请日：2014-04-25

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Liqiang Chen ,  Tao Gao ,  Weifeng Zhou ,  Xue Mao

    IPC: H01L27/14 ,  H01L27/12

    CPC classification number: H01L27/1218 ,  H01L27/1222 ,  H01L27/1266

    Abstract: The present invention provides a flexible display substrate, comprising a flexible base; an ultraviolet reflecting layer disposed on the flexible base and capable of reflecting ultraviolet light and transmitting visible light, comprising a stacked structure consisting of alternate first transparent material layers and second transparent material layers, wherein the numbers of the two kinds of transparent material layers are equal, and are at least two respectively, and the two kinds of transparent material layers also satisfy: 4nd=λ, wherein d is the thickness of any one of the transparent material layers, n is a refractive index of the transparent material layer and λ is the wavelength of ultraviolet light; and a display structure disposed above the ultraviolet reflecting layer. The present invention is applicable to flexible display substrates, particularly flexible array substrates comprising low-temperature polycrystalline silicon thin film transistors.

    Abstract translation: 本发明提供了一种柔性显示基板，包括柔性基座; 紫外线反射层，设置在柔性基底上并能够反射紫外光并透射可见光，包括由交替的第一透明材料层和第二透明材料层组成的层叠结构，其中两种透明材料层的数量相等 ，并且分别为至少两个，并且两种透明材料层还满足：4nd =λ，其中d是透明材料层中的任一个的厚度，n是透明材料层的折射率，λ是 紫外线的波长; 以及设置在紫外线反射层上方的显示结构。 本发明可应用于柔性显示基板，特别是包括低温多晶硅薄膜晶体管的柔性阵列基板。

    Array substrate and manufacturing method thereof
    22.
    发明授权
    Array substrate and manufacturing method thereof 有权
    阵列基板及其制造方法

    公开(公告)号：US09165956B2

    公开(公告)日：2015-10-20

    申请号：US14027413

    申请日：2013-09-16

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Tao Gao ,  Weifeng Zhou ,  Feng Zhang ,  Zhijun Lv

    IPC: H01L27/12 ,  G02F1/1368 ,  G02F1/1362

    CPC classification number: H01L27/1288 ,  G02F1/136227 ,  G02F1/1368 ,  G02F2001/136236 ,  H01L27/1222 ,  H01L27/1225 ,  H01L27/124

    Abstract: Embodiments of the present invention relate to an array substrate and a manufacturing method thereof. The manufacturing method comprises: step 1: forming a gate line, a gate electrode, a first insulating layer, an active layer and ohmic contact layers on a base substrate by a first patterning process using a gray-tone or half-tone mask, in which the active layer between the ohmic contact layers corresponds to a channel region; step 2: forming a second insulating layer and a pixel electrode film on the base substrate obtained after the step 1 by a second patterning process using a gray-tone or half-tone mask; and step 3: forming a drain electrode, a source electrode, a data line and a passivation layer on the base substrate obtained after the step 2 by a third patterning process using a gray-tone or half-tone mask.

    Abstract translation: 本发明的实施例涉及一种阵列基板及其制造方法。 制造方法包括：步骤1：通过使用灰色调或半色调掩模的第一图案化处理，在基底基板上形成栅极线，栅电极，第一绝缘层，有源层和欧姆接触层， 其中欧姆接触层之间的有源层对应于沟道区; 步骤2：通过使用灰色调或半色调掩模的第二图案化处理，在步骤1之后获得的基底基板上形成第二绝缘层和像素电极膜; 步骤3：通过使用灰色调或半色调掩模的第三图案化处理，在步骤2之后获得的基底基板上形成漏电极，源电极，数据线和钝化层。

    Display apparatuses, display panels and preparation methods of display panel
    23.
    发明授权
    Display apparatuses, display panels and preparation methods of display panel 有权

    公开(公告)号：US12225803B2

    公开(公告)日：2025-02-11

    申请号：US17359470

    申请日：2021-06-25

    Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

    Inventor： Ke Yang ,  Huaisen Ren ,  Zubin Lv ,  Zhendong Li ,  Tao Gao

    IPC: H10K59/60 ,  H01L27/146 ,  G06V40/13

    Abstract: The present disclosure provides a display panel including: a substrate and a cover plate, disposed oppositely; a plurality of drive transistors, a plurality of reading transistors and a plurality of Schottky photodiodes, which are disposed on the substrate and located at a side of the substrate facing toward the cover plate; each of the Schottky photodiodes includes a photosensitive active layer and an interdigital electrode layer, the interdigital electrode layer is disposed on the photosensitive active layer and includes at least one first interdigital electrode and at least one second interdigital electrode spaced apart, each of the at least one first interdigital electrode is connected to a corresponding one of the reading transistors, and each of the at least one second interdigital electrode is connected to a bias signal terminal; a plurality of light-emitting units, disposed between the substrate and the cover plate and connected to the drive transistors one-to-one.

    DISPLAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE
    26.
    发明申请
    DISPLAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE 有权

    公开(公告)号：US20220320212A1

    公开(公告)日：2022-10-06

    申请号：US17310405

    申请日：2020-09-30

    Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Bingqiang Gui ,  Yang Yu ,  Peng Huang ,  Tao Gao ,  Wenqiang Li ,  Ke Liu

    IPC: H01L27/32 ,  H01L51/52

    Abstract: A display substrate, a display panel, and a display device are provided. The display substrate includes: a base substrate; and a first transistor on the base substrate. The first transistor includes a first active layer, a first bottom gate electrode between the base substrate and the first active layer, and a first top gate electrode on a side of the first active layer away from the base substrate. A third gate insulating layer is provided between the first bottom gate electrode and the first active layer. The first active layer contains an oxide semiconductor material, and the third gate insulating layer contains a silicon oxide material. A surface of the first bottom gate electrode away from the base substrate is in direct contact with the silicon oxide material, and a surface of the first active layer close to the base substrate is in direct contact with the silicon oxide material.

    Polycrystalline silicon thin film transistor and method of fabricating the same, and display apparatus
    28.
    发明授权
    Polycrystalline silicon thin film transistor and method of fabricating the same, and display apparatus 有权

    公开(公告)号：US10355107B2

    公开(公告)日：2019-07-16

    申请号：US15543726

    申请日：2016-07-25

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Jian Min ,  Xiaolong Li ,  Tao Gao ,  Liangjian Li ,  Zhengyin Xu

    IPC: H01L21/02 ,  H01L21/30 ,  H01L27/12 ,  H01L29/36 ,  H01L29/66 ,  H01L21/027 ,  H01L29/786

    Abstract: The present application discloses a method of fabricating a polycrystalline silicon thin film transistor, the method including forming an amorphous silicon layer on a base substrate having a pattern corresponding to a polycrystalline silicon active layer of the thin film transistor; the amorphous silicon layer having a first region corresponding to a source electrode and drain electrode contact region in the polycrystalline silicon active layer and a second region corresponding to a channel region in the polycrystalline silicon active layer; forming a first dopant layer on a side of the second region distal to the base substrate; forming a second dopant layer on a side of the first region distal to the base substrate; and crystallizing the amorphous silicon layer, the first dopant layer, and the second dopant layer to form the polycrystalline silicon active layer, the polycrystalline silicon active layer being doped with a dopant of the first dopant layer in the second region and doped with a dopant of the second dopant layer in the first region during the step of crystallizing the amorphous silicon layer.

    Flexible substrate attaching method and flexible substrate attachment structure
    30.
    发明授权
    Flexible substrate attaching method and flexible substrate attachment structure 有权
    柔性基板贴附方法和柔性基板附着结构

    公开(公告)号：US09544995B2

    公开(公告)日：2017-01-10

    申请号：US14761986

    申请日：2015-02-10

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Ce Ning ,  Tao Gao

    IPC: H05K1/02 ,  H05K1/03 ,  H05K3/06 ,  H05K3/00 ,  H05K3/46

    CPC classification number: H05K1/028 ,  H05K1/0306 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/16 ,  H05K3/467 ,  H05K2201/09781 ,  H05K2203/016 ,  H05K2203/167

    Abstract: The present disclosure relates to the technical field of flexible substrate processing, and discloses a flexible substrate attaching method. The flexible substrate attaching method comprises the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate. In this flexible substrate attaching method, a flexible substrate can be fixed on a carrier substrate and the flexible panel can be detached after the manufacture is completed. The present disclosure further provides a flexible substrate attachment structure.

    Abstract translation: 本公开涉及柔性基板加工的技术领域，并且公开了一种柔性基板附着方法。 柔性基板安装方法包括以下步骤：利用第一固定结构将柔性基板预固定在载体基板上; 在柔性基板上形成薄膜，并通过图案化工艺形成薄膜图案; 所述薄膜的图案与所述柔性基板的至少一部分和所述载体基板的至少一部分同时接触，以发挥将所述柔性基板固结到所述载体基板上的功能。 在这种柔性基板安装方法中，可以将柔性基板固定在载体基板上，并且在制造完成之后可以将柔性板分离。 本公开进一步提供了柔性基板附接结构。

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