公开(公告)号：US07749781B2

公开(公告)日：2010-07-06

申请号：US11757355

申请日：2007-06-02

申请人： Bily Wang ,  Jonnie Chuang ,  Miko Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Miko Huang

IPC分类号： H01L21/00

CPC分类号： H01L33/64 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.

摘要翻译： 一种具有高散热效率的发光二极管的制造方法，将增厚的金属形成为多个支撑体。 支撑体上具有第一电极和第二电极。 第一电极形成有槽。 发射可见光或不可见光的芯片粘附在槽中。 然后，将两根引线焊接在芯片上。 两个引线中的每一个的一端分别焊接到第一和第二电极。 各种胶水点缀在芯片，粘合剂，引线和支架上。 最后，胶水通过热压成型工艺形成具有封装芯片，粘合剂，引线和支撑体的座和透镜。

公开(公告)号：US07671373B2

公开(公告)日：2010-03-02

申请号：US11976478

申请日：2007-10-25

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L29/267 ,  H01L21/15 ,  H01L29/26 ,  H01L31/12 ,  H01L29/16 ,  H01L29/18 ,  H01L29/22 ,  H01L29/24 ,  H01L25/16

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.

摘要翻译： 使用陶瓷材料作为基板的LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，多个LED芯片和封装胶体。 陶瓷基板具有主体和从主体的三个面延伸的多个突起。 导电单元具有分别形成在突起上的多个导电层。 中空壳体固定在主体的顶面上，以形成用于暴露每个导电层顶面的容纳空间。 LED芯片被接收在接收空间中，并且每个LED芯片分别具有正极侧和负极侧，并且电连接到不同的导电层。 此外，将包装胶体填充到用于覆盖LED芯片的接收空间中。

公开(公告)号：US20080191235A1

公开(公告)日：2008-08-14

申请号：US11757356

申请日：2007-06-02

申请人： Bily WANG ,  Jonnie Chuang ,  Miko Huang

发明人： Bily WANG ,  Jonnie Chuang ,  Miko Huang

IPC分类号： H01L33/00 ,  H01L23/495

CPC分类号： H01L33/64 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A light emitting diode structure with a high heat dissipating effect includes a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, and the first electrode forms a cavity for installing the visible or invisible light chip in the cavity, and the chip is electrically coupled to two lead wires, and an end of the two lead wires is electrically and respectively coupled to the first and second electrodes, and the chip has an internal casing, and the two lead wires of the lead frame and the surface of the internal casing are wrapped by an external casing having a base and a lens.

摘要翻译： 具有高散热效果的发光二极管结构包括引线框架，芯片，两根引线，内部壳体和外部壳体。 引线框架具有第一电极和第二电极，并且第一电极形成用于将可见光或不可见光芯片安装在空腔中的空腔，并且芯片电耦合到两个引线，并且两个引线的一端 电连接并分别耦合到第一和第二电极，并且芯片具有内部壳体，并且引线框架的两个引线和内部壳体的表面被具有基部和透镜的外部壳体包裹。

公开(公告)号：US07255463B2

公开(公告)日：2007-08-14

申请号：US11108800

申请日：2005-04-19

申请人： Bily Wang ,  Jonnie Chuang ,  Chun-Cheng Weng

发明人： Bily Wang ,  Jonnie Chuang ,  Chun-Cheng Weng

IPC分类号： B60Q1/06

CPC分类号： F21V29/70 ,  F21K9/00 ,  H01L33/64 ,  Y10S362/80

摘要： A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed under the heat-dissipation plate, and has a predetermined conductive pattern arranged thereon and a through hole corresponding to the channel. The leading contact of the lighting unit penetrates through the channel of the heat-dissipation plate and the through hole of the insulative plate to electrically connect with the predetermined conductive pattern of the insulative plate.

摘要翻译： 光模块包括照明单元，散热板和绝缘板。 照明单元有一个领先的接触。 散热板与照明模块紧密接触，并具有与引导触点对应的通道。 绝缘板设置在散热板下方，并且具有布置在其上的预定导电图案和与通道对应的通孔。 照明单元的前导触头穿过绝热板的散热板的通道和通孔，以与绝缘板的预定导电图案电连接。

公开(公告)号：US07140753B2

公开(公告)日：2006-11-28

申请号：US10915539

申请日：2004-08-11

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

IPC分类号： F21V29/00

CPC分类号： F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

公开(公告)号：US20060258031A1

公开(公告)日：2006-11-16

申请号：US11488764

申请日：2006-07-19

申请人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

发明人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC分类号： H01L21/00

CPC分类号： H01L23/544 ,  H01L23/60 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wafer-level electro-optical semiconductor manufacture fabrication method improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. This is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

摘要翻译： 晶圆级电光半导体制造方法改进了传统的电光半导体晶粒封装方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接。 这是通过丝网印刷或钢板印刷焊料或银浆到晶片上完成的。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶片级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20060166477A1

公开(公告)日：2006-07-27

申请号：US11041952

申请日：2005-01-26

申请人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

发明人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC分类号： H01L21/44

CPC分类号： H01L23/60 ,  H01L23/544 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

摘要翻译： 一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接。 这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上完成。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶片级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20060071328A1

公开(公告)日：2006-04-06

申请号：US11240405

申请日：2005-10-03

申请人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC分类号： H01L23/34

CPC分类号： H01L23/3735 ,  H01L23/13 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A semiconductor substrate structure with a highly heat-conductive advantage increases packaging good rate and quality. Using semiconductor chip packaging, an electronic chip is easily made highly heat-conductive, and compared with the prior art, the present invention has superior good rate for substrate structure. The improved heat-conductive structure avoids the semiconductor chip overheating and affects the life of electronic device by directly connecting the chip to the heat-conductive base plate.

摘要翻译： 具有高导热性的半导体衬底结构增加了封装的良好率和质量。 使用半导体芯片封装，电子芯片容易制成高导热性，与现有技术相比，本发明具有优异的基板结构优良率。 改进的导热结构避免了半导体芯片过热，并通过将芯片直接连接到导热基板来影响电子器件的使用寿命。

公开(公告)号：US20060044796A1

公开(公告)日：2006-03-02

申请号：US10923687

申请日：2004-08-24

申请人： Bily Wang ,  Jonnie Chuang ,  John Lin

发明人： Bily Wang ,  Jonnie Chuang ,  John Lin

IPC分类号： F21S13/14 ,  F21V21/00

CPC分类号： G09F9/33

摘要： A mixing light board which shows specific pattern is described. The present invention have some advantages, including simple construction, easy production, thinness and cheapness. The mixing light board has a body with a front surface and a back surface. A plurality of conducting material is set on the front surface of the body. A plurality of LEDs is mounted by SMT on the front surface of the body, and the plurality of LEDs is arranged to form a specific pattern. The mixing light board can be made to fit demands.

摘要翻译： 描述具有特定图案的混合灯板。 本发明具有结构简单，生产方便，薄度小廉价等优点。 混合灯板具有前表面和后表面的主体。 多个导电材料设置在主体的前表面上。 多个LED通过SMT安装在主体的前表面上，并且多个LED被布置成形成特定图案。 混合灯板可以满足需求。

公开(公告)号：US20060034085A1

公开(公告)日：2006-02-16

申请号：US10915539

申请日：2004-08-11

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

IPC分类号： F21V29/00

CPC分类号： F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

摘要翻译： 一种用于照明模块的水冷散热装置，其包括模块化的多个LED，并且包括散热板，在散热板内凹入的至少一个弯曲槽，形成在所述散热板的一侧上的至少一个入口 选择性地形成散热片，以及至少一个出口选择性地形成在散热片的一侧上。 作为散热板的一部分产生的弯曲的管道横向延伸并且包括布置在其上的至少一个弯曲部分。 入口和出口分别与弯曲部分和弯曲管道的自由端分别连通。 照明模块直接接触散热装置的顶部。