公开(公告)号：US11186060B2

公开(公告)日：2021-11-30

申请号：US15205284

申请日：2016-07-08

Applicant: CORNING INCORPORATED

Inventor： Kristopher Allen Wieland ,  Garrett Andrew Piech ,  John Tyler Keech ,  Jeffrey Mathew Clark

IPC: B32B3/26 ,  B32B17/06 ,  B23K26/53 ,  C03C15/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/15 ,  C03B33/02 ,  C03C17/06 ,  B23K26/06 ,  B23K103/00

Abstract: Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

公开(公告)号：US11059131B2

公开(公告)日：2021-07-13

申请号：US16430985

申请日：2019-06-04

Applicant: CORNING INCORPORATED

Inventor： Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23K26/364 ,  C03C23/00 ,  B23K103/00

Abstract: A method for laser processing a substrate stack includes forming a defect in a transparent workpiece of the substrate stack having a black matrix layer. Forming the defect includes directing a portion of a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ ⁢ w 0 , 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. The pulsed laser beam directed into the transparent workpiece of the substrate stack forms a pulsed laser beam focal line disposed within the transparent workpiece, where a center of the pulsed laser beam focal line is offset from an edge of the black matrix layer by a distance that is about 20% or less of a total thickness of the substrate stack and generates an induced absorption within the transparent workpiece.

公开(公告)号：US10752534B2

公开(公告)日：2020-08-25

申请号：US15795870

申请日：2017-10-27

Applicant: Corning Incorporated

Inventor： Albert Roth Nieber ,  Kristopher Allen Wieland

IPC: B23K26/53 ,  B23K26/57 ,  C03B33/07 ,  B32B17/10 ,  B23K26/08 ,  B23K26/55 ,  B23K26/0622 ,  B23K26/00 ,  B23K26/073 ,  B23K26/70 ,  B23K26/38 ,  B23K26/402 ,  C03B33/02 ,  C03B33/04 ,  B23K101/18 ,  B23K101/00 ,  B23K103/00 ,  B23K103/18 ,  B23K103/16

Abstract: A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer.

公开(公告)号：US20190119150A1

公开(公告)日：2019-04-25

申请号：US16162644

申请日：2018-10-17

Applicant: CORNING INCORPORATED

Inventor： Robert Carl Burket ,  Daniel Wayne Levesque, JR. ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Heather Nicole Vanselous ,  Kristopher Allen Wieland

IPC: C03C15/00 ,  C03C23/00

Abstract: A method for processing a transparent workpiece includes forming a closed contour line having a plurality of defects in the transparent workpiece such that the closed contour line defines a closed contour. Forming the closed contour line includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, and translating the transparent workpiece and the pulsed laser beam relative to each other along the closed contour line. The method further includes etching the transparent workpiece with a chemical etching solution at an etching rate of about 2.5 μm/min or less to separate a portion of the transparent workpiece along the closed contour line, thereby forming an aperture extending through the transparent workpiece, the aperture comprising an aperture perimeter extending along the closed contour.

公开(公告)号：US20180105451A1

公开(公告)日：2018-04-19

申请号：US15782946

申请日：2017-10-13

Applicant: Corning Incorporated

Inventor： Kristopher Allen Wieland

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/04 ,  B23K26/046 ,  B23K26/06 ,  B23K26/082 ,  B23K26/382 ,  B23K26/38

CPC classification number: C03B33/0222 ,  B23K26/043 ,  B23K26/046 ,  B23K26/0626 ,  B23K26/0648 ,  B23K26/0652 ,  B23K26/082 ,  B23K26/359 ,  B23K26/38 ,  B23K26/382 ,  B23K26/402 ,  B23K26/53 ,  B23K2103/54

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the strengthened (e.g., ion exchanged) glass substrate, that may be followed by use of another, focused, laser beam to promote full separation about the perforated line.

公开(公告)号：US20160279895A1

公开(公告)日：2016-09-29

申请号：US15078097

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B32B3/26 ,  B32B17/06

Abstract: A gas permeable glass window, suitable for use with liquid interface additive manufacturing, has an optically transparent glass article greater than about 0.5 millimeters in thickness defining a first surface and a second surface. A plurality of gas channels are disposed through the article from the first surface to the second surface. The gas channels occupy less than about 1.0% of a surface area of the article and are configured such that the article has a gas permeability between about 10 barrers and about 2000 barrers.

Abstract translation: 适用于液界面添加剂制造的透气玻璃窗具有大于约0.5毫米厚度的光学透明玻璃制品，其限定第一表面和第二表面。 多个气体通道穿过物品从第一表面到第二表面设置。 气体通道占据制品的表面积的约1.0％，并且构造成使得制品的气体渗透性介于约10巴与约2000巴之间。