摘要:
The device has a semiconductor chip having active circuitry in the face thereof. The circuitry has busing over it containing two conductive layers having a plurality of contacts and vias with spacings between them that alternate with respect to one another to provide current ballasting and improved switching uniformity. The spacings between the alternating contacts and vias provide regions of maximum conductor thickness and therefore reduces the busing resistance. Staggering the rows of alternating contacts and vias provides further current ballasting. A first conducting layer is used to contact and provide electrically isolated low resistive conducting paths to the various semiconductor regions while the second conducting region is used to provide selective contact to the first conductive layer, thus providing a means of busing large currents over active semiconductor area without sacrificing performance parameters.
摘要:
A top drain trench based RESURF DMOS (reduced surface field double diffused MOS) transistor structure provides improved RDSon performance by minimizing transistor cell pitch. The transistor includes a gate, a source and drain. The trench may include a nonuniform dielectric lining. A drain drift region partially surrounds the trench. Current flows laterally enabling multiple trench based RESURF DMOS transistors to be formed on a single semiconductor die. The addition of an isolation region to electrically isolate the source from the substrate allows the power transistor to be incorporated into high side driver applications as well as other application mandating electrical isolation between the source and ground.
摘要:
A transistor (10) has a thin epitaxial layer (14) of a second conductivity type on a semiconductor substrate (12) of a first conductivity type. A drift region (24) of the second conductivity type is formed extending through the thin epitaxial layer (14) to the substrate (12). A thick insulator layer (26) is formed on the drift region (24). An IGFET body (28) of the first conductivity type is formed adjacent the drift region (24). A source region (34) of the second conductivity type is formed within the IGFET body (28) and spaced from the drift region (24) defining a channel region (40) within the IGFET body (28). A conductive gate (32) is insulatively disposed over the IGFET body (28) and extends from the source region (34) to the thick insulator layer (26). A drain region (36) is formed adjacent the drift region (24).
摘要:
A MOSFET device (100) having a silicon carbide substrate (102). A channel region (106) of a first conductivity type and an epitaxial layer (104) of a second conductivity type are located above the silicon carbide substrate (102). First and second source/drain regions (118), also of the first conductivity type are located directly within the channel region (106). No well region is placed between the first and second source/drain regions (118) and the channel region (106). A gate (120) is separated from the channel region (106) by an insulator layer (110). Insulator layer (110) has a thin portion (114) and a thick portion (116).
摘要:
A silicon carbide structure (10) and method capable of using existing silicon wafer fabrication facilities. A silicon wafer (20) is provided which has a first diameter. At least one silicon carbide wafer (30) is provided which has a given width and length (or diameter). The width and length (or diameter) of the silicon carbide wafer (30) are smaller than the diameter of the silicon wafer (20). The silicon wafer (20) and the silicon carbide wafer (30) are then bonded together. The bonding layer (58) may comprise silicon germanium, silicon dioxide, silicate glass or other materials. Structures such as MOSFET (62) may be then formed in silicon carbide wafer (30).
摘要:
A thyristor (38) is formed over an insulating layer (44). A gate (70) is operable to create a depletion region through the semiconductor layer (46) in which the thyristor (38) is implemented in order to turn the thyristor off. Isolation regions (48, 52) prevent operation of the thyristor from affecting adjacent devices.
摘要:
A system and method for testing the continuity of interconnecting nets on a substrate to be used in multi-chip technology is provided. The system includes coupling a test pad (15) to the net (12) to be tested. The test pad (15) is coupled through a diode (34) to a common node (32). The voltage of a first node (16) of the net (12) is sensed by a voltmeter (38) which is coupled to ground. A predetermined current signal is applied to each node (16, 18, 20, 22) in the net through the use of a probe (42). The voltage of the remaining nets (14) is sensed by a voltmeter (44). If an erroneous interconnection (31) is present between the net (12) to be tested and any other net (14) on the substrate, the voltage of the other net (14) will fluctuate. The voltmeter (38) will indicate if there is an electrical connection between the node (16) and the test pad (15) during testing. If an electrical path is established between each node in the net (12) and test pad (15), the continuity of the net (12) is established through the operation of Ohm's law.
摘要:
A notebook computer (10) including a keyboard (14) having gas or piston expandable keys (18) which may be placed in an expanded or compressed state. While in an expanded state, the keys (18) are approximately the size of the keys on a standard keyboard. While in a compressed state, the keys are essentially flat, allowing the keyboard to be folded upon itself. Accordingly, the keyboard (18) may be folded in a compressed state when the computer is not in use to reduce keyboard area, and unfolded and expanded to provide a full size keyboard when the computer is in use.
摘要:
A source cell having reduced area and reduced polysilicon window width requirements for use as the source region in a DMOS transistor is disclosed, comprising: a source region of semiconductor material disposed on a semiconductor substrate; a plurality of backgate contact segments of predetermined size and separated by predetermined distances; and a plurality of source contact windows alternating with the backgate contact segments so that a narrow source contact region is formed of alternating source contact and backgate contact material. A DMOS transistor embodying the source region including the backgate contact segments and windowed source contacting regions of the invention is disclosed. An integrated circuit providing an array of DMOS transistors having the improved source regions of the invention is disclosed.Other devices, systems and methods are also disclosed.
摘要:
A high voltage power transistor cell is developed that provides improved RDSon performance without sacrificing breakdown performance through utilization of trench based transistor technology. A source, drain and trench are formed within a substrate. A gate is formed on the surface over a spacing between the source and the trench. A drift region is formed around the trench. An isolation region may optionally be added allowing electrical isolation between the source and the substrate. The lateral current flow feature allows multiple high voltage power transistors, electrically isolated from one another, to exist on a single semiconductor chip. The drift region formed around the trench provides RESURF transistor characteristics without sacrificing die area.