Abstract:
An illumination apparatus includes a lampshade, a light source module and a condensing plate. The light source module is disposed in the lampshade, and has a light-emitting diode (LED) device and a circuit board. The LED device is disposed on the circuit board. The condensing plate is disposed in the lampshade and disposed over the LED device. The condensing plate has a condensing element disposed corresponding to the LED device.
Abstract:
A light emitting diode comprising a semiconductor layer, a first electrode, a second electrode and a diamond-like carbon layer is provided. The semiconductor layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. Wherein, the light emitting layer locates between the first type doped semiconductor layer and the second type doped semiconductor layer. The first electrode is electrically connected to the first type doped semiconductor layer. The second electrode is electrically connected to the second type doped semiconductor layer. The diamond-like carbon layer covers on the semiconductor layer and exposes at least a portion of the first electrode. Moreover, the exposed outer surface of the diamond-like carbon layer is a rough surface. Alternatively, other passivation layer with rough surface can be substituted for the diamond-like carbon layer.
Abstract:
The present invention provides a method for increasing the adhesion of a color filter on a semiconductor wafer. The semiconductor wafer comprises a substrate, a plurality of MOS transistor sensors positioned on the substrate, and a plurality of insulators formed between two MOS transistor sensors on the substrate. The present invention first involves forming a dielectric layer on the semiconductor wafer, which covers each MOS transistor sensor and each insulator. Thereafter, a passivation layer is formed on the dielectric layer, and a plurality of recesses is formed in the passivation layer corresponding to a MOS transistor sensor. Finally, a color filter is formed in each recess. The recess is used to increase the contact areas between the color filter and the passivation layer so as to prevent stripping of the color filter.
Abstract:
A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.
Abstract:
A detecting device is used to detect the connection of an electronic device. The detecting device includes a circuit board and a connector module. The circuit board includes a power terminal and a signal processing unit. The connector module includes a body and a detecting member. The body has a connecting port and a connecting sidewall. The detecting member is disposed on the connecting sidewall and electrically connected to the power terminal and the signal processing unit, and it has a potential. When a plug of the electronic device is connected to the connecting port, the plug contacts the detecting member to change the potential. The change of the potential is detected by the signal processing unit such that the connection between the electronic device and the connector module is confirmed.
Abstract:
A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second electrode disposed on another portion of the epitaxial layer, and a protection layer, disposed over the epitaxial layer. It is noted that in the LED device, the substrate comprises, for example but not limited to, high heat-sink substrate, and the protection layer comprises, for example but not limited to, high heat-sink, high transparent material.
Abstract:
A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second electrode disposed on another portion of the epitaxial layer, and a protection layer, disposed over the epitaxial layer. It is noted that in the LED device, the substrate comprises, for example but not limited to, high heat-sink substrate, and the protection layer comprises, for example but not limited to, high heat-sink, high transparent material.
Abstract:
A multipurpose illumination device, specifically related to an illumination instrument that can be used as an electric torch, a night-light, an emergency aid or an indicator light. The device includes a column with three sections. A main section, which is a middle of the three, has a main light, a battery, circuits, a button switch and a power supply plug. An upper section located above the main section is made of transparent or semi-transparent material. A pedestal located below the main section is made of semi-transparent material.
Abstract:
A circuit board capable of indicating the temperature of hot elements thereon is disclosed. The circuit board includes a substrate, a hot element and a thermochromic material. The hot element may be a chip set or a CPU. The thermochromic material may be inorganic thermochromic materials, or organic thermochromic materials, such as polymers, liquid crystals, dyes, or combinations thereof.
Abstract:
A light emitting diode is provided, wherein a first semiconductor layer is disposed on a substrate, and a second semiconductor layer is disposed on the first semiconductor layer. The first and the second semiconductor layers are doped with different type dopants. In addition, a second electrode is disposed on the second semiconductor layer, and a first electrode is disposed on the first semiconductor layer to surround the second electrode. A dielectric layer is disposed on the substrate to isolates the first electrode from the second electrode. A redistributing circuit is disposed on the dielectric layer. The redistributing circuit is electrically connected to the first electrode and the second electrode to provide a first extending electrode and a second extending electrode. The light emitting diode can prevent the crowding effect and provide better reliability and light emitting efficiency.