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29 条记录 (耗时 0.029 秒)

    Flame retarding epoxy resin composition containing no halogen
    21.
    发明申请
    Flame retarding epoxy resin composition containing no halogen 有权
    不含卤素的阻燃环氧树脂组合物

    公开(公告)号：US20070088136A1

    公开(公告)日：2007-04-19

    申请号：US11340638

    申请日：2006-01-27

    申请人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu ,  Yu-Lin Huang

    发明人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu ,  Yu-Lin Huang

    IPC分类号： C08L63/02

    CPC分类号： C08G59/22 ,  C08G59/38 ,  C08G59/621 ,  H05K1/0326

    摘要： The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.

    摘要翻译： 本发明涉及不含卤素的阻燃性环氧树脂组合物，其包含不含卤素的环氧树脂，增韧剂和阻燃剂。 本发明的阻燃性环氧树脂组合物具有高耐热性和优异的粘合性，并且可用作柔性印刷电路板中的粘合剂。

    Soluble polyimide resin and method of preparing the same
    23.
    发明申请
    Soluble polyimide resin and method of preparing the same 审中-公开
    可溶性聚酰亚胺树脂及其制备方法

    公开(公告)号：US20060287467A1

    公开(公告)日：2006-12-21

    申请号：US11441662

    申请日：2006-05-26

    申请人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

    发明人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

    IPC分类号： C08G73/00

    CPC分类号： H05K1/0346 ,  C08G73/16 ,  H05K1/0393

    摘要： The present invention provides a polyimide resin, which is prepared by epolycondensing a dianhydride monomer including at least a dianhydride represented by formula (I) wherein R is O or O(CH2)nO, n is an integer of 1 to 2 and a diamine monomer represented by formula (II) H2N—Ar—NH2   (II) wherein Ar is defined as in the text then imidizing the resulting polyamic acid resin to form a polyimide resin. Through using the dianhydride represented by formula (I) as the polymerizing unit, a biphenyl moiety and an ester moiety are introduced into the main chain of the polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller linear thermal expansion coefficient and therefore have satisfactory heat resistance and dimensional stability, in addition, become more soluble in organic solvents.

    摘要翻译： 本发明提供一种聚酰亚胺树脂，其通过将至少包含式（I）表示的二酐的二酐单体进行缩聚来制备，其中R为O或O（CH 2） SUB，O，n为1〜2的整数，式（II）表示的二胺单体<？in-line-formula description =“In-Line Formulas”end =“lead”？> H＆ N-Ar-NH 2（II）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中Ar定义如下， 酰亚胺化得到的聚酰胺酸树脂以形成聚酰亚胺树脂。 通过使用由式（I）表示的二酐作为聚合单元，将联苯部分和酯部分引入聚酰亚胺树脂的主链中，使得所得聚酰亚胺树脂具有较低的吸湿性和较小的线性热膨胀系数， 因此具有令人满意的耐热性和尺寸稳定性，另外在有机溶剂中变得更易溶。

    Phosphorus compound and method for preparing the same
    25.
    发明授权
    Phosphorus compound and method for preparing the same 有权
    磷化合物及其制备方法

    公开(公告)号：US08785696B2

    公开(公告)日：2014-07-22

    申请号：US12611591

    申请日：2009-11-03

    申请人： I-Cheng Hsu ,  Ping-Chieh Wang ,  An-Pang Tu ,  Kuen-Yuan Hwang

    发明人： I-Cheng Hsu ,  Ping-Chieh Wang ,  An-Pang Tu ,  Kuen-Yuan Hwang

    IPC分类号： C07F9/02 ,  C07F9/28 ,  C09K21/12

    CPC分类号： C07F9/657172

    摘要： The present invention provides a phosphorus compound of formula (I). The phosphorus compound is prepared by reacting a compound of formula (II) with alkylene carbonate. As compared with the conventional phosphorus compounds as flame-resistant additives, the phosphorus compound of the present invention has not only a high pyrolysis temperature but also excellent solubility in most of the organic solvents with high or low polarity, and is therefore a suitable flame-resistant additive for use in thermosetting or thermoplastic resins.

    摘要翻译： 本发明提供式（I）的磷化合物。 磷化合物通过使式（II）的化合物与碳酸亚烷基酯反应来制备。 与作为阻燃添加剂的常规磷化合物相比，本发明的磷化合物不仅具有高的热分解温度，而且在大多数具有高或低极性的有机溶剂的大部分中具有优异的溶解性，因此， 用于热固性或热塑性树脂的耐热添加剂。

    METHOD FOR PREPARING MELAMINE SALT OF BIS(PENTAERYTHRITOL PHOSPHATE) PHOSPHORIC ACID
    27.
    发明申请
    METHOD FOR PREPARING MELAMINE SALT OF BIS(PENTAERYTHRITOL PHOSPHATE) PHOSPHORIC ACID 审中-公开
    磷酸二甲酯盐酸盐（PENTAERYTHRITOL PHOSPHICIC酸）的制备方法

    公开(公告)号：US20080255353A1

    公开(公告)日：2008-10-16

    申请号：US12020454

    申请日：2008-01-25

    申请人： Kuen-Yuan HWANG ,  An-Pang Tu ,  Gai-Chi Chen

    发明人： Kuen-Yuan HWANG ,  An-Pang Tu ,  Gai-Chi Chen

    IPC分类号： C07D251/12

    CPC分类号： C07D251/56 ,  C07D251/18

    摘要： A method for producing a melamine salt of bis(pentaerythritol phosphate) phosphoric acid is proposed. The method includes the steps of reacting and mixing pentaerythritol and diphosphorous pentaoxide in an extruder to carry out esterification to produce bis(pentaerythritol phosphate) phosphoric acid; and mixing bis(pentaerythritol phosphate) phosphoric acid with melamine or a derivative thereof to carry out quaternization in the presence of a solvent, followed by removing water to obtain a melamine salt of bis(pentaerythritol phosphate) phosphoric acid. Diphosphorous pentaoxide is used in the method as a reactant, so that no hydrogen chloride is produced and it is not necessary to recollect trichlorophosphoric acid. Moreover, in the method of the present invention, such that esterification time can be shortened and a high pressure in a closed reaction system that causes explosion can be avoided.

    摘要翻译： 提出了制备双（季戊四醇磷酸酯）磷酸三聚氰胺盐的方法。 该方法包括在挤出机中使季戊四醇与五氧化二磷反应混合，进行酯化反应，生成双（季戊四醇磷酸酯）磷酸; 并将双（季戊四醇磷酸酯）磷酸与三聚氰胺或其衍生物混合，在溶剂的存在下进行季铵化，然后除去水，得到双（季戊四醇磷酸酯）磷酸的三聚氰胺盐。 在该方法中使用五氧化二磷作为反应物，使得不产生氯化氢，并且不需要回收三氯磷酸。 此外，在本发明的方法中，可以缩短酯化时间，并且可以避免引起爆炸的封闭反应体系中的高压。

    Azaoxa heterocyclic compound and method of preparing the same
    28.
    发明申请
    Azaoxa heterocyclic compound and method of preparing the same 有权
    氮杂杂环化合物及其制备方法

    公开(公告)号：US20050085634A1

    公开(公告)日：2005-04-21

    申请号：US10982589

    申请日：2004-11-04

    申请人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Shyh Liao

    发明人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Shyh Liao

    IPC分类号： C07D265/16 ,  C08G14/06 ,  C08G59/40 ,  C08G73/06 ,  C08K5/357 ,  C08L101/00 ,  C09J11/06 ,  C09J201/00 ,  H01L23/29 ,  H01L23/31 ,  C07D413/02

    CPC分类号： C07D265/16 ,  C08G14/06

    摘要： Disclosed is an azaoxa heterocyclic compound represented by the following formula (I): (wherein, each symbol is defined the same as in the specification) and a method for preparing the same. This compound of the present invention is prepared by the reaction of a phenolic compound, an aromatic diamine compound and an aldehyde compound. The azaoxa heterocyclic compound of the present invention can be used as a hardening resin or a hardener for an epoxy resin, polyether and a resin containing active hydrogen atoms, wherein the composition formed by the azaoxa heterocyclic compound and the epoxy resin is useful in the application of laminates, adhesive, semiconductor packaging materials and phenolic resin forming materials.

    摘要翻译： 公开了由下式（I）表示的氮杂唑杂环化合物及其制备方法：（其中，每个符号定义与说明书中相同）。 本发明的化合物是通过酚类化合物，芳族二胺化合物和醛化合物的反应来制备的。 本发明的氮杂唑杂环化合物可以用作环氧树脂，聚醚和含有活性氢原子的树脂的硬化树脂或硬化剂，其中由氮杂杂环化合物和环氧树脂形成的组合物可用于该应用 层压板，粘合剂，半导体包装材料和酚醛树脂成型材料。

    Polyoxyalkylene amine-modified polyamideimide resin and composition thereof
    29.
    发明申请
    Polyoxyalkylene amine-modified polyamideimide resin and composition thereof 审中-公开
    聚氧亚烷基胺改性聚酰胺酰亚胺树脂及其组合物

    公开(公告)号：US20060241239A1

    公开(公告)日：2006-10-26

    申请号：US11373738

    申请日：2006-03-09

    申请人： Kuan-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

    发明人： Kuan-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

    IPC分类号： C08G18/08 ,  C08G73/00

    CPC分类号： C08G18/603 ,  C08G73/14 ,  C09D175/12 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0209

    摘要： The present invention provides a polyoxyalkylene amine-modified polyamideimide resin and a polyamideimide resin composition includes said polyoxyalkylene amine-modified polyamideimide resin, a thermosetting resin and a rubber elastomer, and may further include an inorganic filler. The polyamideimide resin composition of the present invention has high heat resistance and high bond strength and can achieve sufficient adhesion at lower temperature, for example, 160 to 180° C. Thus, the resin composition of the present invention is suitable for use in bonding circuit boards and IC members.

    摘要翻译： 本发明提供聚氧亚烷基胺改性的聚酰胺酰亚胺树脂和聚酰胺酰亚胺树脂组合物，其包含所述聚氧亚烷基胺改性的聚酰胺酰亚胺树脂，热固性树脂和橡胶弹性体，还可以包括无机填料。 本发明的聚酰胺酰亚胺树脂组合物具有高耐热性和高粘合强度，并且可以在较低温度例如160-180℃下实现足够的粘合。因此，本发明的树脂组合物适用于接合电路 董事会和IC成员。