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    MOUSE PAD WITH ACCOMMODATING STRUCTURE
    21.
    发明申请
    MOUSE PAD WITH ACCOMMODATING STRUCTURE 审中-公开
    具有住宿结构的鼠标垫

    公开(公告)号：US20120062462A1

    公开(公告)日：2012-03-15

    申请号：US12879116

    申请日：2010-09-10

    Applicant: Yin-Yu Lin ,  Po-Jen Shih ,  Sue-Yi Chen

    Inventor： Yin-Yu Lin ,  Po-Jen Shih ,  Sue-Yi Chen

    IPC: G06F3/033 ,  G09G5/08

    CPC classification number: G06F3/0395

    Abstract: A mouse device pad with accommodating structure includes a mouse pad body and a plurality of fasten members, wherein the fasten members are positioned respectively at each side edge of the body's right/wrong side, and the fasten members are corresponding to one another for bonding together, such that when the fasten members are corresponding to the other ones for bonding together, the mouse pad body are bended to form an accommodated room within the mouse pad body.

    Abstract translation: 具有容纳结构的鼠标装置垫包括鼠标垫体和多个紧固构件，其中，所述紧固构件分别位于身体的右/侧的每个侧边缘处，并且所述紧固构件彼此对应用于粘合在一起 使得当紧固构件对应于用于粘合在一起的其它构件时，鼠标垫体被弯曲以在鼠标垫体内形成容纳的房间。

    KEYBOARD MODULE
    22.
    发明申请
    KEYBOARD MODULE 有权
    键盘模块

    公开(公告)号：US20120050077A1

    公开(公告)日：2012-03-01

    申请号：US12873314

    申请日：2010-08-31

    Applicant: Po-Jen Shih ,  Shu-I Chen

    Inventor： Po-Jen Shih ,  Shu-I Chen

    IPC: H01H13/04

    CPC classification number: H01H13/06 ,  H01H13/86 ,  H01H2223/00

    Abstract: A keyboard structure including a first cover, a second cover, a circuit board and a dirt-proof structure is provided. The circuit board is disposed between the first cover and the second cover, and the dirt-proof structure disposed between the circuit board and the first cover is assembled with the circuit board and the second cover.

    Abstract translation: 提供了包括第一盖，第二盖，电路板和防尘结构的键盘结构。 电路板设置在第一盖和第二盖之间，并且布置在电路板和第一盖之间的防尘结构与电路板和第二盖组装在一起。

    Sealant gun
    23.
    外观设计
    Sealant gun 有权
    密封枪

    公开(公告)号：USD619863S1

    公开(公告)日：2010-07-20

    申请号：US29341394

    申请日：2009-08-04

    Applicant: Po-Jen Shih

    Designer： Po-Jen Shih

    Copper plating of semiconductor devices using intermediate immersion step
    28.
    发明申请
    Copper plating of semiconductor devices using intermediate immersion step 有权
    使用中间浸渍步骤的半导体器件的镀铜

    公开(公告)号：US20050250327A1

    公开(公告)日：2005-11-10

    申请号：US10840095

    申请日：2004-05-06

    Applicant: Chao-Lung Chen ,  Kei-Wei Chen ,  Shih-Ho Lin ,  Ying-Lang Wang ,  Yu-Ku Lin ,  Ching-Hwanq Su ,  Po-Jen Shih ,  Shang-Chin Sung

    Inventor： Chao-Lung Chen ,  Kei-Wei Chen ,  Shih-Ho Lin ,  Ying-Lang Wang ,  Yu-Ku Lin ,  Ching-Hwanq Su ,  Po-Jen Shih ,  Shang-Chin Sung

    IPC: C25D3/02 ,  C25D5/10 ,  C25D5/18 ,  C25D7/12 ,  H01L21/288 ,  H01L21/44

    CPC classification number: C25D7/123 ,  C25D3/02 ,  C25D5/10 ,  C25D5/18 ,  H01L21/2885

    Abstract: A method of electroplating a metal layer on a semiconductor device includes a sequence of biasing operations that includes a first electroplating step at a first current density followed by a second immersion step at a second current density being less than the first current density, and subsequent electroplating steps of increasing current densities beginning with a third electroplating step having a third current density that is greater than the first current density. The second, low current density immersion step improves the quality of the plating process and produces a plated film that completely fills openings such as vias and trenches and avoids hollow vias and pull-back on the bottom corners of via and trench openings. The low current density second immersion step produces an electrochemical deposition process that provides low contact resistance and therefore reduces device failure.

    Abstract translation: 在半导体器件上电镀金属层的方法包括一系列偏置操作，其包括第一电流密度的第一电镀步骤，随后是第二电流密度小于第一电流密度的第二浸入步骤，随后的电镀 从具有大于第一电流密度的第三电流密度的第三电镀步骤开始增加电流密度的步骤。 第二，低电流密度浸没步骤提高了电镀工艺的质量，并且产生完全填充诸如通孔和沟槽等开口的电镀膜，并避免了通孔和沟槽开口的底角上的中空通孔和拉回。 低电流密度第二浸入步骤产生电化学沉积工艺，其提供低接触电阻并因此减少器件故障。

    Recording element printing and treating system and method
    29.
    发明申请
    Recording element printing and treating system and method 有权
    记录元素印刷和处理系统及方法

    公开(公告)号：US20050122383A1

    公开(公告)日：2005-06-09

    申请号：US10731705

    申请日：2003-12-09

    Applicant: Timothy Wojcik ,  Arthur Gooray ,  James Pickering ,  James Reczek ,  Hwei-Ling Yau ,  Po-Jen Shih ,  Simon Yandila ,  Charles Scaglione ,  Kwok-Leung Yip

    Inventor： Timothy Wojcik ,  Arthur Gooray ,  James Pickering ,  James Reczek ,  Hwei-Ling Yau ,  Po-Jen Shih ,  Simon Yandila ,  Charles Scaglione ,  Kwok-Leung Yip

    IPC: B41J11/00 ,  B41J2/01

    CPC classification number: B41J11/002

    Abstract: A recording element printing and treating system and method are provided. The system includes a printhead for dispensing a liquid comprising a carrier onto a recording element. A carrier removal station positioned downstream from the printhead removes a predetermined percentage of carrier present in the recording element. A converting station positioned downstream from the carrier removal station increases a durability characteristic of the recording element. In one embodiment, printing, carrier removal, and converting are accomplished in a single unit. In an alternative embodiment, printing is accomplished in a stand alone unit while carrier removal and converting are accomplished in a second stand alone unit. In this alternative embodiment, transfer of the recording element can be accomplished automatically using a mechanical device or manually by a system user.

    Abstract translation: 提供了一种记录元件印刷和处理系统和方法。 该系统包括用于将包括载体的液体分配到记录元件上的打印头。 位于打印头下游的载体移除台移除存在于记录元件中的载体的预定百分比。 位于载体移除站下游的转换站增加了记录元件的耐久性。 在一个实施例中，打印，载体移除和转换在单个单元中完成。 在替代实施例中，印刷是在独立单元中实现的，而载体移除和转换在第二独立单元中完成。 在该备选实施例中，记录元件的传送可以使用机械装置自动完成或由系统用户手动完成。

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