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21.发明授权Remote component devices, systems, and methods for use with light emitting devices 有权用于发光设备的远程组件设备，系统和方法公开(公告)号：US08922108B2
公开(公告)日：2014-12-30
申请号：US13038109
申请日：2011-03-01
IPC分类号： H01J1/62 , H01J63/04 , H01J61/38 , H01J61/34 , F21V23/06 , F21V3/04 , F21K99/00 , F21Y101/02
CPC分类号： F21K9/56 , F21K9/232 , F21K9/64 , F21K9/90 , F21V3/12 , F21V23/06 , F21Y2115/10 , H01J61/34 , H01J61/38 , H01J2261/385 , Y02B20/19 , Y10T29/49002
摘要： Remote component devices, systems, and methods are disclosed. In one aspect, remote component devices, systems, and methods can include a body for lockably securing the remote component to a housing. Devices, systems, and methods can also include one or more light emitting devices disposed over the body. An optical material can be remotely located at least a first distance away from the one or more light emitting devices. Remote component devices, systems, and methods disclosed herein can be used as replacements and/or equivalent light products for standard filament light bulbs and compact fluorescent lamp (CFL) bulbs.
摘要翻译： 公开了远程组件设备，系统和方法。 在一个方面，远程组件设备，系统和方法可以包括用于将远程组件可锁定地固定到壳体的主体。 设备，系统和方法还可以包括设置在身体上的一个或多个发光装置。 光学材料可以远离一个或多个发光器件至少远离第一距离。 本文公开的远程组件装置，系统和方法可以用作标准灯丝灯泡和紧凑型荧光灯（CFL）灯泡的替代品和/或等效的轻质产品。
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公开(公告)号：US08860043B2
公开(公告)日：2014-10-14
申请号：US13019812
申请日：2011-02-02
CPC分类号： H01L33/48 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/12032 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Packages, systems and methods for light emitting devices are disclosed. An LED package in one aspect can be of various sizes and configurations and can include one or more LEDs of a size smaller than those typically provided. The LED package or packages can for example be used for backlighting or other lighting fixtures. Optimized materials and techniques can be used for the LED packages to provide energy efficiency and long lifetime.
摘要翻译： 公开了用于发光器件的封装，系统和方法。 一个方面的LED封装可以具有各种尺寸和配置，并且可以包括尺寸小于通常提供的尺寸的一个或多个LED。 LED封装或封装可以例如用于背光或其他照明灯具。 优化的材料和技术可用于LED封装，以提供能源效率和长寿命。
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公开(公告)号：USD667803S1
公开(公告)日：2012-09-25
申请号：US29407084
申请日：2011-11-22
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24.发明申请REMOTE COMPONENT DEVICES, SYSTEMS, AND METHODS FOR USE WITH LIGHT EMITTING DEVICES 有权远程组件设备，系统和使用发光设备的方法公开(公告)号：US20120223632A1
公开(公告)日：2012-09-06
申请号：US13038109
申请日：2011-03-01
CPC分类号： F21K9/56 , F21K9/232 , F21K9/64 , F21K9/90 , F21V3/12 , F21V23/06 , F21Y2115/10 , H01J61/34 , H01J61/38 , H01J2261/385 , Y02B20/19 , Y10T29/49002
摘要： Remote component devices, systems, and methods are disclosed. In one aspect, remote component devices, systems, and methods can include a body for lockably securing the remote component to a housing. Devices, systems, and methods can also include one or more light emitting devices disposed over the body. An optical material can be remotely located at least a first distance away from the one or more light emitting devices. Remote component devices, systems, and methods disclosed herein can be used as replacements and/or equivalent light products for standard filament light bulbs and compact fluorescent lamp (CFL) bulbs.
摘要翻译： 公开了远程组件设备，系统和方法。 在一个方面，远程组件设备，系统和方法可以包括用于将远程组件可锁定地固定到壳体的主体。 设备，系统和方法还可以包括设置在身体上的一个或多个发光装置。 光学材料可以远离一个或多个发光器件至少远离第一距离。 本文公开的远程组件装置，系统和方法可以用作标准灯丝灯泡和紧凑型荧光灯（CFL）灯泡的替代品和/或等效的轻质产品。
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公开(公告)号：USD650760S1
公开(公告)日：2011-12-20
申请号：US29379636
申请日：2010-11-22
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公开(公告)号：US20120127720A1
公开(公告)日：2012-05-24
申请号：US13227961
申请日：2011-09-08
CPC分类号： H01L27/153 , H01L25/0753 , H01L25/167 , H01L33/08 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/49113 , H01L2924/12032 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.
摘要翻译： 公开了用于较高电压应用的发光器件和诸如发光二极管（LED）的方法。 这里公开了LED的可变布置。 布置可以包括串联，并联和/或其组合的一个或多个LED芯片。 LED芯片可以设置在具有至少一个热元件和一个或多个电气部件的封装主体中。
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公开(公告)号：US20120126257A1
公开(公告)日：2012-05-24
申请号：US13104558
申请日：2011-05-10
IPC分类号： H01L33/62
CPC分类号： H01L33/08 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
摘要翻译： 公开了发光器件和方法。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。
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公开(公告)号：US20090153022A1
公开(公告)日：2009-06-18
申请号：US11956989
申请日：2007-12-14
CPC分类号： H01L33/50 , H01L2224/32013 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
摘要： A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin while the phosphor particles remain distributed.
摘要翻译： 公开了一种制造LED灯的方法。 该方法包括混合未固化的可固化液体树脂和荧光体，将未固化的混合物分配在LED芯片上，离心芯片和混合物以将荧光体颗粒分散在未固化的树脂中，并在荧光体颗粒保持分布的同时固化树脂。
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公开(公告)号：USD707192S1
公开(公告)日：2014-06-17
申请号：US29412168
申请日：2012-01-31
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公开(公告)号：US08564000B2
公开(公告)日：2013-10-22
申请号：US13028972
申请日：2011-02-16
IPC分类号： H01L33/40
CPC分类号： H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.
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