Abstract:
Health and usage monitoring systems for aircraft hoist systems are described herein. In some embodiments, a health and usage monitoring system comprises a capacitive load cell and a processing unit for communication with the capacitive load cell, the capacitive load cell comprising a load receiving surface and a capacitive assembly coupled to the load receiving surface, the capacitive assembly comprising parallel electrically conductive plates separated by a reversibly deformable spacer construction wherein the parallel plates comprise aligned apertures providing a passageway through the capacitive assembly for the hoist system cable.
Abstract:
The invention provides a sensor for determining when a latch for securing an engine cowl on an aircraft is secured by detecting the proximity of a latch hook and a latch pin. The sensor includes a resonant circuit configured and adapted to transmit a status signal when the latch is in a secured state. The sensor also includes a means for conveying status information of the latch to a location remote from the latch based on the status signal, the conveying means being operably connected to the resonant circuit. The invention also provides a method of determining when a latch is open or secured by detecting the proximity of a latch hook and a latch pin.
Abstract:
A monitoring system for a landing gear system comprising a plurality of sensors for monitoring respective parameters of the aircraft landing system, and a monitor which receives the outputs of the sensors.
Abstract:
An optical cross-connect switch comprises a base (216), a flap (211) and one or more electrically conductive landing pads (222) connected to the flap (211). The flap (211) has a bottom portion that is movably coupled to the base (216) such that the flap (211) is movable with respect to a plane of the base (216) from a first orientation to a second orientation. The one or more landing pads (222) are electrically isolated from the flap (211) and electrically coupled to be equipotential with a landing surface.
Abstract:
A method and apparatus are described for reducing stiction in a MEMS device having a movable element and a substrate. The method generally comprises providing the substrate with an anti-stiction member and interposing the anti-stiction member between the moveable element and the substrate. The apparatus generally comprises an anti-stiction member that is interposable between the moveable element and the substrate. Another embodiment of the invention of the invention is directed to a MEMS device, comprising: a substrate, a moveable element moveably coupled to the substrate, and an anti-stiction member that is interposable between the moveable element and the substrate. A further embodiment of the invention is directed to an optical switch having one or more moveable elements moveably coupled to a substrate, and an anti-stiction member that is interposable between at least one of the moveable elements and the substrate. The anti-stiction member may be in the form of a flexible cantilevered structure that overhangs the moveable element. Actuating the moveable element causes the anti-stiction member to flex and snap into place between the moveable element and the substrate. An additional embodiment of the invention is directed to a method of fabricating a MEMS device. The method proceeds by providing a silicon-on-insulator (SOI) substrate; defining a moveable element from a device layer of the SOI substrate; and depositing a flexible material over the device layer and the moveable element. One or more portions of the flexible material overhang the moveable element, whereby the flexible material forms one or more anti-stiction members.
Abstract:
A microelectromechanical systems (MEMS) element, MEMS optical switch and MEMS fabrication method are described. The MEMS element comprises a crystalline and moveable element is moveably attached to the substrate. The moveable element includes a perpendicular portion oriented substantially perpendicular to a plane of the substrate. The crystal structure of the perpendicular portion and substrate are substantially similar. The moveable element moveable is moveably attached to the substrate for motion substantially constrained to a plane oriented substantially perpendicular to a plane of the substrate. In at least one position, a part of a perpendicular portion of the moveable element projects beyond a surface of the substrate. The moveable element may be retained in place by a latch. The perpendicular portion may be formed substantially perpendicular portion to the substrate. An array of such structures can be implemented to work as an optical switch. The optical switch may comprise a crystalline substrate and one or more moveable elements moveably attached to the substrate. The MEMS elements may be fabricated by providing a substrate; forming one or more trenches in the substrate to define a perpendicular portion of a element; and moveably attaching the moveable element to a first surface of the substrate; removing a portion of the substrate such that at least a part of the perpendicular portion projects beyond a second surface of the substrate. The various embodiments provide for a robust and reliable MEMS elements that may be simply fabricated and densely packed.
Abstract:
The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
Abstract:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.