公开(公告)号：US09734944B2

公开(公告)日：2017-08-15

申请号：US14532021

申请日：2014-11-04

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Kai-Peng Chiang ,  Da-Jung Chen ,  Tsung-Chan Wu

IPC: H01L27/08 ,  H01F27/30 ,  H01L23/31 ,  H01L23/495 ,  H01L23/64 ,  H01F27/29 ,  H01L23/00

CPC classification number: H01F27/306 ,  H01F27/29 ,  H01F2027/297 ,  H01L23/3121 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An inductive component is disclosed. The inductive component comprises a magnetic body and a coil in the magnetic body, wherein a first protrusion and a second protrusion are formed on the bottom surface of the magnetic body, wherein the first protrusion comprises a first electrode disposed on the peak surface of the first protrusion, and the second protrusion comprises a second electrode disposed on the peak surface of the second protrusion, wherein the first electrode and the second electrode are electrically connected to a first end and a second end of the coil, and a space is formed by the first protrusion, the second protrusion and the bottom surface of the magnetic body for accommodating electronic devices.

公开(公告)号：US11744009B2

公开(公告)日：2023-08-29

申请号：US17477530

申请日：2021-09-17

Applicant: CYNTEC CO., LTD.

Inventor： Kaipeng Chiang ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun Hsien Lu

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0262 ,  H05K1/0209 ,  H05K1/141

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

公开(公告)号：US11651890B2

公开(公告)日：2023-05-16

申请号：US16870969

申请日：2020-05-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chi-Feng Huang

IPC: H01F27/32 ,  H05K1/16 ,  H01F27/29 ,  H01F27/28 ,  H01F27/24

CPC classification number: H01F27/327 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/292 ,  H05K1/165

Abstract: An electronic structure comprises: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, the transformer comprises a first coil, a second coil, and a magnetic body, wherein a molding body encapsulates at least one portion of the outer surface of the first coil, at least one portion of the outer surface of the second coil, and the plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.

公开(公告)号：US11031255B2

公开(公告)日：2021-06-08

申请号：US16782039

申请日：2020-02-04

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US10593561B2

公开(公告)日：2020-03-17

申请号：US15955696

申请日：2018-04-18

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

Abstract: A package structure comprises: a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material; a first insulating layer, disposed over a top of the plurality of metal parts and the top surface of a conductive element; and a first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern electrically connects a first terminal of the conductive element to a first metal part through at least one first via disposed in the first insulating layer, wherein a bump is disposed in the first insulating layer and electrically connected to a second terminal of the conductive element.

公开(公告)号：US20180240738A1

公开(公告)日：2018-08-23

申请号：US15438781

申请日：2017-02-22

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Shih-Chang Huang

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L21/52

CPC classification number: H01L23/49541 ,  H01L21/52 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/552 ,  H01L2224/18 ,  H01L2924/3025

Abstract: An electronic package includes an electronic component, a leadframe surrounding at least one sidewall surface of the electronic component, a molding compound encapsulating the leadframe and the electronic component, and a metal shielding layer conformally covering the molding compound and being electrically connected with the leadframe. The leadframe includes at least one opening for accommodating the electronic component. A lower portion of the electronic component is situated in the opening and a bottom surface of the electronic component is exposed from the opening.

公开(公告)号：US10034379B2

公开(公告)日：2018-07-24

申请号：US15297190

申请日：2016-10-19

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

IPC: H05K1/18 ,  H01F27/29 ,  H01F27/06

Abstract: A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.

公开(公告)号：US09538660B2

公开(公告)日：2017-01-03

申请号：US14594084

申请日：2015-01-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K5/00 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。