公开(公告)号：US08206776B2

公开(公告)日：2012-06-26

申请号：US12753146

申请日：2010-04-02

Applicant: Jun Li ,  Lianhua Fan ,  Ching-Ping Wong ,  Franklin Cook Lambert

Inventor： Jun Li ,  Lianhua Fan ,  Ching-Ping Wong ,  Franklin Cook Lambert

IPC: B05D5/12 ,  H05H1/24

CPC classification number: H01B3/306 ,  H01B3/441 ,  H01B3/445 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/294 ,  Y10T428/2976 ,  Y10T428/2978

Abstract: Methods of reducing pollution problems in power lines systems are disclosed herein. In one embodiment, the method comprises applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications. Further disclosed are methods of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability. Other aspects, features, and embodiments are also discussed and claimed.

Abstract translation: 本文公开了减少电力线系统中的污染问题的方法。 在一个实施方案中，该方法包括将Lotus Effect材料应用于外部电绝缘系统应用的（超疏水性）保护涂层。 进一步公开了制备/制备莲花效应涂层的方法。 选择的无机或聚合物材料被施加在绝缘材料表面上，并且可以制造稳定的超疏水涂层。 可以将各种UV稳定剂和UV吸收剂掺入涂料体系中以增强涂料的UV稳定性。 还讨论和要求保护其他方面，特征和实施例。

公开(公告)号：US07189795B2

公开(公告)日：2007-03-13

申请号：US10621022

申请日：2003-07-16

Applicant: William Franklin Burgoyne, Jr. ,  Ching-Ping Wong ,  Silvia Liong

Inventor： William Franklin Burgoyne, Jr. ,  Ching-Ping Wong ,  Silvia Liong

IPC: C08G65/48

CPC classification number: C08G65/40 ,  C08G65/48 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: A poly(arylene ether) polymer includes polymer repeat units of the following structure: —(O—Ar1—O—Ar2)m—(O—Ar3—O—Ar4)n— where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0.05 to 0.95, n is 1-m, and at least one of the aryl radicals is grafted to at least one hydroxyalkyl group, such as 2-undecanol. The polymer is especially useful in electrically conductive adhesives.

Abstract translation: 聚（亚芳基醚）聚合物包括具有以下结构的聚合物重复单元：<？in-line-formula description =“In-line formula”end =“lead”→ - （O-Ar 1 n - <？in-line-formula description =“In-line Formulas”end =“tail”？>其中Ar <1> ，Ar <2> Ar 3 3和Ar 4是相同或不同的芳基，m为0.05至0.95，n为1-m，并且至少一个芳基被接枝到 至少一个羟烷基，如2-十一烷醇。 聚合物特别适用于导电粘合剂。

公开(公告)号：US06498260B2

公开(公告)日：2002-12-24

申请号：US09820549

申请日：2001-03-29

Applicant: Lejun Wang ,  Haiying Li ,  Ching-Ping Wong

Inventor： Lejun Wang ,  Haiying Li ,  Ching-Ping Wong

IPC: C07D30302

CPC classification number: C08G59/686 ,  C07D303/16 ,  C07D303/36 ,  C08G59/24 ,  C08G59/28 ,  C08G59/4215 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/799 ,  H01L24/98 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00

Abstract: A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

Abstract translation: 提供了一种用于电子封装系统中的可再加工的环氧底层填充物，该电子封装系统包括集成电路，有机印刷线路板以及在它们之间形成的至少一个共晶焊点。 密封剂的示例性实施方案包括：脂环族环氧化物; 有机硬化剂; 和固化促进剂; 其中所述脂环族环氧化物包括碳酸酯或氨基甲酸酯基团。 密封剂还可以包括填料，例如二氧化硅填料。 还提供了一种用于形成上述可再加工环氧底层填料的方法。

公开(公告)号：US06180696B2

公开(公告)日：2001-01-30

申请号：US09025532

申请日：1998-02-18

Applicant: Ching-Ping Wong ,  Song-Hua Shi

Inventor： Ching-Ping Wong ,  Song-Hua Shi

IPC: C08K310

CPC classification number: C08G59/68 ,  C08G59/42 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

Abstract: An epoxy material suitable for no-flow underfilling processes with high glass transition temperature can be obtained by curing a solvent free formulation containing an epoxy resin, an organic carboxylic acid anhydride hardener, a curing accelerator, a fluxing agent, a viscosity controlling agent, a coupling agent, and a surfactant.

Abstract translation: 通过固化含有环氧树脂，有机羧酸酐固化剂，固化促进剂，助熔剂，粘度控制剂，固化剂，固化剂等的无溶剂制剂，可以得到适用于高玻璃化转变温度的无流动底填充方法的环氧树脂材料。 偶联剂和表面活性剂。

公开(公告)号：US06172141B2

公开(公告)日：2001-01-09

申请号：US09226876

申请日：1999-01-07

Applicant: Ching-Ping Wong ,  Lejun Wang

Inventor： Ching-Ping Wong ,  Lejun Wang

IPC: C08K520

CPC classification number: C08K3/36 ,  C08K5/0008 ,  C08L63/00

Abstract: A reworkable epoxy underfill encapsulant is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. A preferred embodiment of the encapsulant includes: a cycloaliphatic diepoxide; an organic hardener; a curing accelerator; a silica filler; and an additive, with the additive providing thermal reworkability to the composition. A method is also provided for forming the aforementioned reworkable epoxy underfill encapsulants.

Abstract translation: 提供了一种用于电子封装系统的可再加工的环氧底层填料密封剂，该电子封装系统包括集成电路，有机印刷线路板以及形成在其间的至少一个共晶焊点。 密封剂的优选实施方案包括：脂环族二环氧化物; 有机硬化剂; 固化促进剂; 二氧化硅填料; 和添加剂，其中添加剂为组合物提供热可再加工性。 还提供了一种用于形成上述可再加工环氧底层填料密封剂的方法。

公开(公告)号：US5510153A

公开(公告)日：1996-04-23

申请号：US102178

申请日：1993-08-04

Applicant: Peter F. Lilienthal, II ,  Ivan Pawlenko ,  Ching-Ping Wong

Inventor： Peter F. Lilienthal, II ,  Ivan Pawlenko ,  Ching-Ping Wong

IPC: B05D3/02 ,  H01R13/52 ,  B05D7/20 ,  H01B7/02

CPC classification number: B05D3/029 ,  H01R13/5216 ,  Y10S439/936

Abstract: Glass particles (14) are mixed within an uncured silicone resin (13). The fluid uncured resin is placed in a portion of a terminal block (11) and cured to form a gel (13') by subjecting it to microwaves in a microwave oven (22). Conductors (25, 26) to be interconnected are next inserted into the cured silicone gel and interconnected. The cured gel containing the glass particles thereafter constitutes a dependable insulator for the conductors, particularly the portions of the conductors that are interconnected.

Abstract translation: 玻璃颗粒（14）在未固化的硅树脂（13）内混合。 将流体未固化的树脂放置在端子块（11）的一部分中并通过在微波炉（22）中将其经受微波来固化以形成凝胶（13'）。 待互连的导体（25,26）接着插入固化的硅氧烷凝胶中并相互连接。 含有玻璃颗粒的固化凝胶构成导体的可靠绝缘体，特别是互连的导体部分。

公开(公告)号：US5470217A

公开(公告)日：1995-11-28

申请号：US332310

申请日：1994-10-31

Applicant: Peter F. Lilienthal, II ,  Ivan Pawlenko ,  Ching-Ping Wong

Inventor： Peter F. Lilienthal, II ,  Ivan Pawlenko ,  Ching-Ping Wong

IPC: B29C33/00 ,  B29C39/06 ,  B29C39/10

CPC classification number: B29C39/06 ,  B29C33/0016 ,  B29C33/0038 ,  B29C39/10 ,  B29K2105/0061 ,  Y10S425/044 ,  Y10S439/936

Abstract: A module, such as a terminal block (10), configured of a body (12) having an open end (20) and at least one window (24) spaced from the open end, is fixtured and sealed by way of a channel (28) comprised of a pair of parallel, spaced-apart, generally elastic walls (30,32) jointed by a bottom member (34). The walls (30,32) and the bottom member (34) run longitudinally a distance at least as long as the width of the terminal block (10) to allow the block to be received between, and to be held by, the walls. At least one protrusion extends out from a separate one of the walls (30,32) and the base member (34) for receipt in the window (24) in the terminal block to seal the same.

Abstract translation: 诸如端子块（10）的模块由具有开口端（20）的主体（12）和与开口端间隔开的至少一个窗口（24）构成，通过通道（...）固定和密封 28）包括由底部构件（34）连接的一对平行的，间隔开的，大致弹性的壁（30,32）。 壁（30,32）和底部构件（34）纵向延伸至少与端子块（10）的宽度一样长的距离，以允许块被容纳在壁之间并由壁保持。 至少一个突出部从单独的一个壁（30,32）和基部构件（34）中伸出，以便接收在端子块中的窗口（24）中以将其密封。

公开(公告)号：US5439849A

公开(公告)日：1995-08-08

申请号：US191378

申请日：1994-02-02

Applicant: Richard McBride ,  Ching-Ping Wong

Inventor： Richard McBride ,  Ching-Ping Wong

IPC: H01L23/29 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/291 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2924/0002 ,  H01L2924/12044

Abstract: An encapsulant comprised of alternate layers of polymer and glass gives enhanced protection to semiconductor integrated circuit devices, which is much more effective than either glass or polymer encapsulations by themselves. In one embodiment, a semiconductor device (11) is covered by a polymer layer (13), the polymer layer being covered by a glass layer (14), and the glass layer being covered by a second polymer layer (15). The glass is preferably deposited by a plasma enhanced chemical vapor deposition apparatus (17 of FIG. 2 ).

Abstract translation: 由聚合物和玻璃的交替层组成的密封剂对半导体集成电路器件提供了增强的保护，其比玻璃或聚合物封装本身更有效。 在一个实施例中，半导体器件（11）由聚合物层（13）覆盖，聚合物层被玻璃层（14）覆盖，玻璃层被第二聚合物层（15）覆盖。 玻璃优选通过等离子体增强化学气相沉积装置（图2的17）沉积。

公开(公告)号：US4564562A

公开(公告)日：1986-01-14

申请号：US614898

申请日：1984-05-29

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C08L83/04 ,  H01L23/29 ,  H01L23/31 ,  B32B9/04

CPC classification number: H01L23/3121 ,  C08L83/04 ,  H01L23/296 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  Y10S528/901 ,  Y10T428/31663

Abstract: An article of manufacture comprises an electronic device having a silicone resin encapsulant thereover, wherein the silicone resin is an oxime and water free formulation derived from curing a mixture consisting essentially of a heat curable silicone elastomer prepolymer and a dialkylaminoalkoxysilane. The mixture may also contain fillers and a small amount of curing catalyst and stabilizer.

Abstract translation: 制品包括其上具有硅树脂密封剂的电子装置，其中硅树脂是基于由可热固化的硅氧烷弹性体预聚物和二烷基氨基烷氧基硅烷组成的混合物固化的肟和无水配方。 混合物还可以含有填料和少量固化催化剂和稳定剂。

公开(公告)号：US4282314A

公开(公告)日：1981-08-04

申请号：US145176

申请日：1980-04-30

Applicant: Donald Dinella ,  Ching-Ping Wong

Inventor： Donald Dinella ,  Ching-Ping Wong

IPC: B32B15/08 ,  G03F1/00 ,  H05K3/00 ,  H05K3/18 ,  B29C17/08 ,  G03C5/24

CPC classification number: B32B15/08 ,  G03F1/50 ,  H05K3/0002 ,  H05K3/185 ,  Y10T156/1082

Abstract: A mask for selectively transmitting therethrough a desired light radiant energy is disclosed. The mask comprises a stress-relieved, essentially dimensionally stable base, comprising a copolymer of tetrafluoroethylene and hexafluoropropylene, which is capable of transmitting therethrough the light radiant energy. A blocking film is deposited on at least a portion of the base for blocking the transmission of the light radiant energy through the portion of the base.