公开(公告)号：US06498260B2

公开(公告)日：2002-12-24

申请号：US09820549

申请日：2001-03-29

Applicant: Lejun Wang ,  Haiying Li ,  Ching-Ping Wong

Inventor： Lejun Wang ,  Haiying Li ,  Ching-Ping Wong

IPC: C07D30302

CPC classification number: C08G59/686 ,  C07D303/16 ,  C07D303/36 ,  C08G59/24 ,  C08G59/28 ,  C08G59/4215 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/799 ,  H01L24/98 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00

Abstract: A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

Abstract translation: 提供了一种用于电子封装系统中的可再加工的环氧底层填充物，该电子封装系统包括集成电路，有机印刷线路板以及在它们之间形成的至少一个共晶焊点。 密封剂的示例性实施方案包括：脂环族环氧化物; 有机硬化剂; 和固化促进剂; 其中所述脂环族环氧化物包括碳酸酯或氨基甲酸酯基团。 密封剂还可以包括填料，例如二氧化硅填料。 还提供了一种用于形成上述可再加工环氧底层填料的方法。

公开(公告)号：US06172141B2

公开(公告)日：2001-01-09

申请号：US09226876

申请日：1999-01-07

Applicant: Ching-Ping Wong ,  Lejun Wang

Inventor： Ching-Ping Wong ,  Lejun Wang

IPC: C08K520

CPC classification number: C08K3/36 ,  C08K5/0008 ,  C08L63/00

Abstract: A reworkable epoxy underfill encapsulant is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. A preferred embodiment of the encapsulant includes: a cycloaliphatic diepoxide; an organic hardener; a curing accelerator; a silica filler; and an additive, with the additive providing thermal reworkability to the composition. A method is also provided for forming the aforementioned reworkable epoxy underfill encapsulants.

Abstract translation: 提供了一种用于电子封装系统的可再加工的环氧底层填料密封剂，该电子封装系统包括集成电路，有机印刷线路板以及形成在其间的至少一个共晶焊点。 密封剂的优选实施方案包括：脂环族二环氧化物; 有机硬化剂; 固化促进剂; 二氧化硅填料; 和添加剂，其中添加剂为组合物提供热可再加工性。 还提供了一种用于形成上述可再加工环氧底层填料密封剂的方法。

公开(公告)号：US06570029B2

公开(公告)日：2003-05-27

申请号：US09860081

申请日：2001-05-17

Applicant: Lejun Wang ,  Haiying Li ,  Ching-Ping Wong

Inventor： Lejun Wang ,  Haiying Li ,  Ching-Ping Wong

IPC: C07D30302

CPC classification number: H01L21/563 ,  C07D303/16 ,  C07D303/36 ,  C08G59/24 ,  C08G59/28 ,  C08G59/4215 ,  C08G59/686 ,  C08L63/00 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/01322

Abstract: A no-flow reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; a curing accelerator; and a fluxing agent wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

公开(公告)号：US11213690B2

公开(公告)日：2022-01-04

申请号：US13524253

申请日：2012-06-15

Applicant: Mark R. Boone ,  Mohsen Askarinya ,  Randolph E. Crutchfield ,  Erik J. Herrmann ,  Mark S. Ricotta ,  Lejun Wang

Inventor： Mark R. Boone ,  Mohsen Askarinya ,  Randolph E. Crutchfield ,  Erik J. Herrmann ,  Mark S. Ricotta ,  Lejun Wang

IPC: H01L23/48 ,  A61N1/39 ,  H01L23/495 ,  H01L25/16

Abstract: A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.

公开(公告)号：US20130335937A1

公开(公告)日：2013-12-19

申请号：US13524368

申请日：2012-06-15

Applicant: Mohsen Askarinya ,  Mark R. Boone ,  Andreas A. Fenner ,  Lejun Wang ,  Kenneth Heames

Inventor： Mohsen Askarinya ,  Mark R. Boone ,  Andreas A. Fenner ,  Lejun Wang ,  Kenneth Heames

IPC: H05K1/18

CPC classification number: H01L25/00 ,  A61N1/3758 ,  A61N1/3968 ,  H01F27/2804 ,  H01F2027/2819 ,  H01L23/647 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

Abstract translation: 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。

公开(公告)号：US07199342B2

公开(公告)日：2007-04-03

申请号：US10624830

申请日：2003-07-21

Applicant: Glenn Ratificar ,  Carlos Gonzalez ,  Lejun Wang

Inventor： Glenn Ratificar ,  Carlos Gonzalez ,  Lejun Wang

IPC: H05B6/74 ,  B23K31/02

CPC classification number: B23K1/008 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/81805

Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.

Abstract translation: 本发明包括通过微波能量回流的管芯和衬底之间的机械接头以及通过在衬底上印刷焊料形成这种机械接头的方法，将焊料与模具上的凸块接触，回流 用微波能量焊接，并从焊料和凸块形成机械接头。

公开(公告)号：US20050195582A1

公开(公告)日：2005-09-08

申请号：US10791048

申请日：2004-03-02

Applicant: Juan Landeros ,  Jason Zhang ,  Lejun Wang

Inventor： Juan Landeros ,  Jason Zhang ,  Lejun Wang

IPC: H05K7/06

CPC classification number: B23K1/0016 ,  B23K3/0623 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/49146 ,  H01L2924/014 ,  H01L2924/00

Abstract: An article includes a mounting substrate, a passive component site on the mounting substrate, and an active component site on the mounting substrate. The article also includes a fluid flow barrier disposed local to the passive component site and spaced apart from the active component site. The fluid flow barrier can be a recess that resists fluid flow thereinto because of surface tension of the fluid when it meets the recess edge. The fluid flow barrier can include a boundary that diverts fluid flow due to the angle of the recess edge as the fluid approaches it. An embodiment also includes a packaging system that includes the article and at least one passive component. An embodiment also includes a method of assembling the article or the packaging system.

Abstract translation: 一种物品包括安装基板，安装基板上的无源部件位置和安装基板上的有源部件位置。 该制品还包括设置在被动部件部位的局部并与活性部件部位间隔开的流体流动阻挡件。 流体阻挡层可以是当流体遇到凹陷边缘时由于流体的表面张力而阻止流体流入其中的凹槽。 流体阻挡层可以包括当流体接近它时由于凹口边缘的角度而转移流体流动的边界。 实施例还包括包括物品和至少一个无源部件的包装系统。 实施例还包括组装物品或包装系统的方法。

公开(公告)号：US06730542B2

公开(公告)日：2004-05-04

申请号：US10339982

申请日：2003-01-10

Applicant: Lejun Wang ,  Song-Hua Shi ,  Tian-An Chen

Inventor： Lejun Wang ,  Song-Hua Shi ,  Tian-An Chen

IPC: H01L2144

CPC classification number: H01L23/293 ,  H01L21/563 ,  H01L24/29 ,  H01L2221/6834 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/27

Abstract: A polybenzoxazine based wafer-level underfill material. The material may be provided to a surface of a semiconductor wafer. The semiconductor wafer may then be sawed into individual chips. The polybenzoxazine based underfill material may be for use between a chip and a package substrate.

Abstract translation: 基于聚苯并恶嗪的晶圆级底部填充材料。 该材料可以被提供到半导体晶片的表面。 然后可以将半导体晶片锯成单独的芯片。 基于聚苯并恶嗪的底部填充材料可以用于芯片和封装衬底之间。

公开(公告)号：US06727594B2

公开(公告)日：2004-04-27

申请号：US10038710

申请日：2002-01-02

Applicant: Lejun Wang ,  Song-Hua Shi ,  Tian-An Chen

Inventor： Lejun Wang ,  Song-Hua Shi ,  Tian-An Chen

IPC: H01L2940

CPC classification number: H01L23/293 ,  H01L21/563 ,  H01L24/29 ,  H01L2221/6834 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/27

Abstract: A polybenzoxazine based wafer-level underfill material. The material may be provided to a surface of a semiconductor wafer. The semiconductor wafer may then be sawed into individual chips. The polybenzoxazine based underfill material may be for use between a chip and a package substrate.

公开(公告)号：US20100019213A1

公开(公告)日：2010-01-28

申请号：US12521299

申请日：2007-03-05

Applicant: Sufeng Tian ,  Lejun Wang

Inventor： Sufeng Tian ,  Lejun Wang

IPC: C09K21/14 ,  D21C9/00

CPC classification number: D01F1/07 ,  D01F2/06 ,  Y10T428/2913 ,  Y10T428/2916 ,  Y10T428/2965 ,  Y10T428/2993

Abstract: The present invention provides a fire retardant antiflux fiber, the fiber is composed of the following components: cellulose 60˜80% by mass, silicon fire retardant (calculated as silicon dioxide) 15˜36% by mass, tourmaline 0.1˜5%. The present invention also provides a process of producing fire retardant antiflux fiber, in the adding step, the silicon fire retardant is added into the cellulose sulfonate in the sulfidizing step or the viscose which was prepared after the sulfidizing step, the level of adding the silicon fire retardant is 19˜30%, calculated as silicon dioxide. The fire retardant antiflux fiber of the present invention has high fire retardant antiflux effect, high fiber strength and excellent negative ion generating efficacy. At the same time, the viscose also maintains excellent filtering performance in the procedure using above production process, reducing the production standstill caused by the viscose blocking up filter screen, improving production efficiency. The viscose fiber can be used to fabricate nonwoven fabric widely.

Abstract translation: 本发明提供阻燃抗纤维，该纤维由以下成分组成：纤维素60〜80质量％，硅阻燃剂（以二氧化硅计）为15〜36质量％，电气石为0.1〜5％。 本发明还提供一种制备阻燃抗流纤维的方法，在添加步骤中，在硫化步骤中将硅阻燃剂加入到硫酸化步骤中的纤维素磺酸盐中，或在硫化步骤之后制备的粘胶，添加硅的水平 阻燃剂为19〜30％，以二氧化硅计。 本发明的阻燃抗纤维纤维具有较高的阻燃抗氧化作用，高纤维强度和优异的负离子产生效能。 同时，粘胶在使用上述生产工艺的过程中也保持了优异的过滤性能，减少了粘胶堵塞过滤网引起的生产停顿，提高了生产效率。 粘胶纤维可广泛用于制造无纺织物。