Abstract:
Implants, instruments and methods for bone fusion procedures are disclosed. In some embodiments, the implants are particularly advantageous for use between opposing vertebral bodies to facilitate stabilization or arthrodesis of an intervertebral joint. The implants include, at least, a support component that provides structural support during fusion. In a typical embodiment, the implants also include a growth component. A growth component provides an environment conducive to new bone growth between the bones being fused. Several unique configurations to enhance fusion, instruments for insertion and methods for insertion are also disclosed.
Abstract:
Bone guides for sizing or shaping bone are disclosed. The guides can be configured and sized for placement on a surgery table, instrument table or similar structure in an operating room. The guides provide for real time preparation of a bone graft during a surgical procedure.
Abstract:
Instruments and methods for preparing adjacent bones for fusion, and for inserting implants are disclosed. In one embodiment, the instruments include paddles for spacing the adjacent bones a predetermined distance and a cutting edge to create a channel between the adjacent bones to receive a fusion implant. In another embodiment, the instruments include a bone cutting instrument, a rasp, and an implant inserting tool. The instruments and methods are particularly advantageous for preparing a spinal fusion implant site.
Abstract:
A method of making a low inductance conductive via in a laminated substrate by providing a first conductive layer. A first dielectric layer is formed on the first conductive layer. A second conductive layer is formed on the first dielectric layer. A first conductive path is formed in the first conductive layer extending along a first route between a first node and a second node. A first conductive blind-via is connected to the first conductive path at the second node, with the first-blind via being formed in the first dielectric layer at the second node. Lastly, a second conductive path is formed in the second conductive layer that is connected to the first blind via. The second conductive path extends between a third node and the first blind via along a second route. The second route corresponds identically to at least a portion of the first route.
Abstract:
A constraining ring increases the modulus of an interconnect substrate to maintain flatness of the substrate. The constraining ring is made of materials selected to match the coefficient of thermal expansion of the substrate to that of the constraining ring. Circuit components including capacitors and resistors are formed on the constraining ring to provide enhanced electrical properties without adding to the size of the device.
Abstract:
The blast machine consists of a self-propelled vehicle including a pair of independently driven magnetic treads capable of adhering to and traversing ferromagnetic vertical surfaces and the underside of ferromagnetic horizontal surfaces. The blast machine includes a blast unit having a pair of blast wheels supported on the magnetic treads for propelling the blast unit over ferromagnetic surfaces The blast unit is mounted so as to be able to pivot about two axes relative to the treads so that the treads can follow and traverse curved surfaces without changing the orientation of the blast unit. The treads can also flex allowing them to traverse surfaces having varying contours. Moreover, the angle of the blast unit relative to the surface to be cleaned can be adjusted to ensure the proper orientation for blast cleaning The blast unit includes a unique mechanism for retrieving spent abrasive and debris from the surface and a separator for separating the reusable abrasive from the debris when the unit is oriented either vertically or upside down.